Preparation of PVP coated Cu NPs and the application for low-temperature bonding†
Abstract
There is an increasing interest in developing a low temperature interconnection process using
* Corresponding authors
a Department of Mechanical Engineering & Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of P. R. China, Tsinghua University, Beijing, China
b
Centre of Advanced Materials for Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada
E-mail:
a2hu@mecheng1.uwaterloo.ca
Fax: +1 519-888-6197
Tel: 1 519-888-4567 ext. 35464
There is an increasing interest in developing a low temperature interconnection process using
Y. Jianfeng, Z. Guisheng, H. Anming and Y. N. Zhou, J. Mater. Chem., 2011, 21, 15981 DOI: 10.1039/C1JM12108A
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