Low-temperature (below Tg) thermal bonding of COC microfluidic devices using UV photografted HEMA-modified substrates: high strength, stable hydrophilic, biocompatible surfaces
Abstract
* Corresponding authors
a Singapore-MIT Alliance, Manufacturing Systems and Technology Programme, Nanyang Technological University, 65 Nanyang Drive, Singapore
b School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore
c School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
S. Roy, C. Y. Yue, S. S. Venkatraman and L. L. Ma, J. Mater. Chem., 2011, 21, 15031 DOI: 10.1039/C1JM11750E
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