Issue 14, 2010
From the journal:

Journal of Materials Chemistry

Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

Kimiyasu Sato,*a   Hitomi Horibe,a   Takashi Shirai,a   Yuji Hotta,a   Hiromi Nakano,b   Hideaki Nagai,c   Kenshi Mitsuishid  and  Koji Wataria  

* Corresponding authors

a National Institute of Advanced Industrial Science and Technology (AIST), Anagahora 2266-98, Shimoshidami, Moriyama-ku, Nagoya 463-8560, Japan
E-mail: sato.kimiyasu@aist.go.jp
Fax: +81 52 736 7405
Tel: +81 52 736 7155

b Cooperative Research Facility Center, Toyohashi University of Technology, Hibariga-oka, Tempaku, Toyohashi 441-8580, Japan

c National Institute of Advanced Industrial Science and Technology (AIST), AIST Tsukuba Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan

d Mitsui Chemical Inc., Shiodome City Center, Higashi-Shinbashi, Minato-ku, Tokyo 105-7117, Japan

Abstract

Thermally conductive ceramic/plastic composite materials are needed in various industries for thermal management. The present work aimed at creating composite films of hexagonal boron nitride (h-BN) particles and polyimide. A thermal conductivity of 7 W m−1 K−1 was achieved at solids loading of 60 vol% with flexibility maintained.

Graphical abstract: Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

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Article information

DOI
https://doi.org/10.1039/B924997D
Article type
Communication
Submitted
27 Nov 2009
Accepted
26 Feb 2010
First published
04 Mar 2010

J. Mater. Chem., 2010,20, 2749-2752

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Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

K. Sato, H. Horibe, T. Shirai, Y. Hotta, H. Nakano, H. Nagai, K. Mitsuishi and K. Watari, J. Mater. Chem., 2010, 20, 2749 DOI: 10.1039/B924997D

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