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Issue 26, 2009
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Free-standing film electronics using photo-crosslinking layer-by-layer assembly

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Abstract

A robust and efficient strategy for preparing a substrate for highly flexible and patchable electronics was developed via a photo-crosslinking LbL spin-coating process that allows various thicknesses to be achieved without any rinsing or intermediate purification steps.

Graphical abstract: Free-standing film electronics using photo-crosslinking layer-by-layer assembly

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Supplementary files

Article information


Submitted
25 Mar 2009
Accepted
08 May 2009
First published
22 May 2009

J. Mater. Chem., 2009,19, 4488-4490
Article type
Communication

Free-standing film electronics using photo-crosslinking layer-by-layer assembly

J. Park, J. Kim, S. Lee, J. Bang, B. J. Kim, Y. S. Kim and J. Cho, J. Mater. Chem., 2009, 19, 4488
DOI: 10.1039/B908568H

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