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Issue 4, 2009
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Hierarchical multicomponent assembly utilizing sequential metal–ligand and hydrogen-bonding interactions

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Abstract

The solid state structures of the copper(II) Schiff base complexes [{Cu(1)}(H2O)], [Cu(1)(OH2)]·MeCN and [({Cu(1)}(H2O))2(2)] (H21 = N,N′-(1R,2R)-(–)-1,2-cyclohexylenebis(3-ethoxysalicylideneamine) and 2 = naphthalene-2,6-dicarboxylic acid) exhibit two recurring structural motifs: host–guest, hydrogen-bonded recognition of H2O in the O,O′,O″,O‴-cavity of [Cu(1)], and face-to-face stacking of [Cu(1)] units with non-bonded Cu⋯Cu separations of 3.54–4.89 Å. In [{Cu(1)}(H2O)], the H2O molecule is non-coordinated to the copper(II) centre whereas in [Cu(1)(OH2)]·MeCN it is axially bound to the copper(II) atom while retaining its role as a hydrogen-bonded guest in the O,O′,O″,O‴-cavity of an adjacent [Cu(1)] molecule. The guest H2O molecule in [{Cu(1)}(H2O)] can function as a hydrogen bond donor as illustrated by the assembly of [({Cu(1)}(H2O))2(2)]. Solution (in THF) electronic spectroscopic data for the complexes are consistent with dissociation of the building blocks including the cleavage of the Cu–OH2 coordination bond. The self-assembly and structural diversity are discussed in terms of a series of hierarchical events.

Graphical abstract: Hierarchical multicomponent assembly utilizing sequential metal–ligand and hydrogen-bonding interactions

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Supplementary files

Article information


Submitted
08 Oct 2008
Accepted
25 Nov 2008
First published
05 Jan 2009

CrystEngComm, 2009,11, 657-662
Article type
Paper

Hierarchical multicomponent assembly utilizing sequential metal–ligand and hydrogen-bonding interactions

E. C. Constable, G. Zhang, C. E. Housecroft, M. Neuburger and S. Schaffner, CrystEngComm, 2009, 11, 657
DOI: 10.1039/B817706F

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