Issue 26, 2008

Coppernanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

Abstract

We present a facile, room temperature and “fully liquid” method to specifically produce either copper nanoparticles or thin conductive copper films on silicon substrates by using a dedicated reduction process of mesitylcopper by H2 or an aminoborane.

Graphical abstract: Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

Article information

Article type
Communication
Submitted
17 Mar 2008
Accepted
16 May 2008
First published
27 May 2008

J. Mater. Chem., 2008,18, 3084-3086

Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

C. Barrière, G. Alcaraz, O. Margeat, P. Fau, J. B. Quoirin, C. Anceau and B. Chaudret, J. Mater. Chem., 2008, 18, 3084 DOI: 10.1039/B804460K

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