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Issue 26, 2008
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Coppernanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

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Abstract

We present a facile, room temperature and “fully liquid” method to specifically produce either copper nanoparticles or thin conductive copper films on silicon substrates by using a dedicated reduction process of mesitylcopper by H2 or an aminoborane.

Graphical abstract: Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

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Article information


Submitted
17 Mar 2008
Accepted
16 May 2008
First published
27 May 2008

J. Mater. Chem., 2008,18, 3084-3086
Article type
Communication

Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

C. Barrière, G. Alcaraz, O. Margeat, P. Fau, J. B. Quoirin, C. Anceau and B. Chaudret, J. Mater. Chem., 2008, 18, 3084
DOI: 10.1039/B804460K

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