Jump to main content
Jump to site search

Issue 10, 2006
Previous Article Next Article

Injection molded microfluidic chips featuring integrated interconnects

Author affiliations


An injection molding process for the fabrication of disposable plastic microfluidic chips with a cycle time of 2 min has been designed, developed, and implemented. Of the sixteen commercially available grades of cyclo-olefin copolymer (COC) that were screened for autofluorescence and transparency to ultraviolet (UV) light, Topas 8007 × 10 was identified as the most suitable for production. A robust solid metal mold insert defining the microfluidic channels was rapidly microfabricated using a process that significantly reduces the time required for electroplating. No wear of the insert was observed even after over 1000 cycles. The chips were bonded by thermal fusion using different bonding conditions. Each condition was tested and its suitability evaluated by burst pressure measurements. The COC microfluidic chips feature novel, integrated, reversible, standardized, ready-to-use interconnects that enable operation at pressures up to 15.6 MPa, the highest value reported to date. The suitability of these UV transparent, high pressure-resistant, disposable devices was demonstrated by in situ preparation of a high surface area porous polymer monolith within the channels.

Graphical abstract: Injection molded microfluidic chips featuring integrated interconnects

Back to tab navigation

Article information

25 Apr 2006
13 Jul 2006
First published
31 Jul 2006

Lab Chip, 2006,6, 1346-1354
Article type

Injection molded microfluidic chips featuring integrated interconnects

D. A. Mair, E. Geiger, A. P. Pisano, J. M. J. Fréchet and F. Svec, Lab Chip, 2006, 6, 1346
DOI: 10.1039/B605911B

Social activity

Search articles by author