Microstructure and conductivity evolution in Bi2CuO4–Bi2O3 and Bi2MoO6–Bi2Mo2O9 oxide composites nearby eutectic temperatures
Abstract
The enhance of electrical conductivity at the eutectic temperature was attended with a thermally reversible microstructural change of composites, expressed by redistribution of an eutectic liquid between triple grain junctions (at cooling) and grain boundaries (at heating).