A detailed electron microscopic study has been made of the very early stages of growth of nickel electrodeposits on to characterised {100} copper substrates. These observations have shown the electrocrystallisation of nickel on copper to be fundamentally different from its growth from the vapour, involving the production of a specific type of defect, the “growth dislocation”, to reduce misfit strain, which has hitherto gone unreported.
J. P. G. Farr and A. J. S. McNeil, Faraday Symp. Chem. Soc., 1977, 12, 145 DOI: 10.1039/FS9771200145
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