Flexible transparent conductive films based on slot-die- coating-induced oriented silver nanowire networks

Abstract

Silver nanowire-based transparent conductive film (AgNW TCF) is considered the best substitute for indium tin oxide (ITO) in flexible optoelectronic devices, yet it is limited by the random network distribution, high junction resistance and poor surface uniformity. Herein, highly aligned bilayer orthogonal AgNW TCFs were fabricated via an improved slot-die-coating process compatible with sheet-to-sheet manufacturing. Appropriate ink rheology and coating parameters allowed the controlled alignment of AgNWs, while mutually perpendicular coatings and subsequent mechanical pressing enabled the construction of a bilayered orthogonal conductive network structure. The resultant bilayer orthogonal AgNW TCF exhibits excellent optoelectronic performance with a high transmittance of 95.4% at 550 nm and a low sheet resistance of 19 Ω sq⁻¹. The surface roughness of the bilayer orthogonal AgNW TCF reached 5.92 nm, 46% lower than that of conventional random networks. The shear-induced alignment, controlled drying, and mechanical pressing synergistically promote nanowire ordering, reduce junction resistance, and improve interlayer electrical contact. This work provides a scalable strategy for fabricating high-performance AgNW TCFs, which have strong potential applications in the sheet-to-sheet production of flexible optoelectronic devices.