Dynamic hydrogen bond evolution in thermosensitive hydrogels for self-adaptive passive cooling

Abstract

Facing the growing demand for green cooling, the application of thermosensitive hydrogels in adaptive thermal management is limited due to the kinetic-thermodynamic mismatch of water molecules during their phase transition. Herein, we propose a dynamic hydrogen bonding evolution hydrogel (hydrogen bonding energy in the P(NAGA-CO-NIPAm) hydrogel showing a temperature-dependent evolution) via artificial intelligence (AI) assisted component optimization to construct thermosentive hydrogels with a hierarchical synergistic dissipative pattern, which combine both phase-volume stability and optical transition properties, enabling adaptive passive cooling. The P(NAGA-CO-NIPAm)-4* thermosensitive hydrogel exhibits a triple synergistic mechanism (dynamic hydrogen bonding, hydrophobic aggregation, and light scattering) and excellent adaptive evaporative cooling capability (5 °C: 21.97 W m−2 → 25 °C: 53.99 W m−2 → 45 °C: 608.94 W m−2), which effectively solves the mismatch between water-molecule transport dynamics and the material thermodynamic response. At 45 °C, the cooling duration of the P(NAGA-CO-NIPAm)-4* hydrogel exceeded that of conventional PNIPAm hydrogels by over 10-fold. Compared to PNAGA and PNIPAm, P(NAGA-CO-NIPAm)-4* exhibits the best cooling capacity in extreme environments (60 °C and 800 W m−2), cooling to 41.33 °C (ΔT = 17.44 °C, 29.68%). The results provide a theoretical foundation and practical framework for next-generation adaptive cooling materials, with significant scientific and practical value in mitigating global cooling demands.

Graphical abstract: Dynamic hydrogen bond evolution in thermosensitive hydrogels for self-adaptive passive cooling

Supplementary files

Article information

Article type
Paper
Submitted
22 Dec 2025
Accepted
10 Mar 2026
First published
10 Mar 2026

J. Mater. Chem. A, 2026, Advance Article

Dynamic hydrogen bond evolution in thermosensitive hydrogels for self-adaptive passive cooling

S. Ge, N. Yang, X. Zhu, X. Min, Y. Kong, C. Xu, H. Yang and J. Wang, J. Mater. Chem. A, 2026, Advance Article , DOI: 10.1039/D5TA10414A

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