Open Access Article
Kyu Moon Kwon
a,
Ji Won Han
a,
Joungwon Parkb,
Kyoung Hwan Kim
b,
Hwi-Yeol Parkb,
Woo-Hee Kim
a,
Ji-Hoon Ahn
a,
Hyo Rang Kang*ac and
Tae Joo Park
*ad
aDepartment of Materials Science and Chemical Engineering, Hanyang University, Ansan 15588, Republic of Korea. E-mail: tjp@hanyang.ac.kr
bBattery Material TU, Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd., Suwon 16678, Republic of Korea
cNanocamp Inc., Chungju 27315, Republic of Korea. E-mail: hrkang@nanocamp.kr
dALPES Co., Ltd., Ansan 15588, Republic of Korea
First published on 16th February 2026
The use of high-density three-dimensional sintered (HTS) cathode plates is a promising approach for increasing the energy density of Li-ion batteries. However, their performances are limited by the absence of conducting agents and interfacial side reactions. In this study, a Ru–RuOx mixed protective layer (RRML) is conformally deposited on HTS-LiCoO2 (LCO) via atomic layer deposition and employed as a mixed ionic–electronic conducting protective layer. Physicochemical analyses reveal the formation of a Ru–RuOx solid solution at a 5 nm thickness without post-treatment. The full-cell evaluation demonstrates that the RRML-coated HTS-LCO electrode exhibits approximately twice the cycle life (80% capacity retention at 1C) of uncoated HTS-LCO. This study demonstrates that the RRML coating enables simultaneous ionic and electronic conduction and interfacial stabilization.
The protective layer coating of CAMs is considered an effective strategy to address the aforementioned issues in LIBs.11–13 Conventional wet-chemical methods, such as sol–gel and spray coating, have been widely employed but are limited in terms of thickness control and uniform surface coverage.14 In contrast, atomic layer deposition (ALD), which relies on self-limiting surface reactions, enables conformal coating with atomic-scale thickness control, even on substrates with complex geometries. Because of this capability, ALD allows for the deposition of ultrathin films (typically a few nanometers thick) with exceptional uniformity, making it one of the most suitable techniques for protective layer formation.15–17
In the case of HTS-LCO, which is composed solely of an active material without any CAs, the absence of electron-percolation networks within the electrode imposes intrinsic limitations on charge-transfer kinetics, particularly under high-C-rate conditions. As a result, the protective layer is required to exhibit mixed ionic–electronic conducting (MIEC) characteristics, rather than functioning solely as a chemically inert passivation barrier.13,18,19 Under these constraints, electronically insulating oxides (e.g., Al2O3, TiO2, and ZrO2) are not suitable for CA-free sintered cathodes, where electronic percolation must be preserved. Among the platinum-group elements, Ru is known as an excellent electronic conductor owing to its short electron mean free path (≈6.6 nm) and low electrical resistivity (≈7 µΩ·cm−1), even in thin films.20,21 Moreover, RuOx acts as an ionic conductor, exhibiting an ionic conductivity of approximately 10−8 S cm−1 and a relatively low electrical resistivity despite being an oxide.22,23 Owing to these properties, previous studies have explored the use of RuO2 as an individual coating layer, to enhance the electronic conductivity of CAMs, or additive layer combined with carbon coatings.24,25 However, for CA-free sintered cathodes, these approaches are intrinsically insufficient to meet the combined requirements of interfacial stabilization and simultaneous Li+/electron transport. Metallic Ru, while offering high electronic conductivity, lacks Li+ transport pathways and therefore cannot function as a standalone protective layer. Conversely, RuO2 enables Li+ conduction but exhibits lower electronic conductivity than Ru, while carbon-composite strategies inevitably reintroduce inactive components and additional interfacial instability.
In this study, we aim to enhance the electronic conductivity of HTS-LCO while maintaining the Li+ conduction pathways and suppressing interfacial side reactions. To achieve this, a Ru–RuOx mixed protective layer (RRML) is deposited on the HTS-LCO surface using ALD without any post-treatment and is applied as an MIEC protective layer. Physicochemical analyses are used to confirm the successful formation of the Ru–RuOx solid solution, and a full-cell evaluation further demonstrates its impact on electrochemical performance.
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1, indicating that the RuOx phase constitutes a substantial portion of the film and is consistently present throughout the RRML thickness (Fig. S1). This can be attributed to the island-growth behavior of metallic Ru during the early stages of film deposition, which originates from its high surface energy. It is reported that Ru is hardly oxidized when the grain size is below a critical value (<6 nm), due to the increasing oxide formation energy with decreasing grain (island) size.26,27 Because the film thickness is approximately 5 nm, the grains are extremely small, thereby suppressing oxidation of Ru islands and increasing the relative fraction of thermodynamically unstable grain boundary regions. Oxygen reactants exposed during the ALD process are likely to adsorb at these boundaries. Adsorbed oxygen forms a Ru–O bond at the surface of Ru islands, leading to the formation of the Ru–RuOx solid solution.21,28 The O 1s core-level spectra (Fig. 1e) also exhibit a metal–O peak, including Ru–O, at a BE of 529.7 eV, corroborating the interpretation from the Ru 3d spectra and confirming the formation of the RRML on the HTS-LCO surface. In addition, the Co 2p and Li 1s with Co 3p core-level spectra display peaks corresponding to the underlying HTS-LCO (Fig. S2). To assess the MIEC character, the electronic resistivity and ionic conductivity of the RRML were measured (Fig. S3 and Table S1). The film exhibits a low electronic resistivity of ≈70 µΩ·cm−1 at a thickness of 5 nm and an ionic conductivity of 3.8 × 10−8 S cm−1 at 25 °C. These values indicate that the RRML provides simultaneous electronic and ionic transport.
Fig. 2a and b show a cross-sectional high-resolution transmission electron microscopy (HRTEM) image and the corresponding EDS mapping image of HTS-LCO coated with an RRML, respectively. In Fig. 2a, a continuous protective layer is observed, and a strong Ru signal is detected along the HTS-LCO surface in the EDS mapping. This confirms the uniform deposition of the RRML, which is consistent with the SEM–EDS mapping results shown in Fig. 1c. In Fig. 2b, the thickness of the RRML is measured to be approximately 5.5 nm. The fast Fourier transform (FFT) pattern obtained from the HTS-LCO region (lower-right inset in Fig. 2b) displays a distinct diffraction pattern corresponding to the (003) plane of LCO, indicating that negligible structural changes occur in HTS-LCO during the RRML-deposition process. Fig. 2c and d present FFT patterns acquired from local regions within the RRML, in which diffraction spots corresponding to the Ru (101) and (002) planes are observed. Combined with the XPS results shown in Fig. 1d, these observations confirm the presence of a metallic Ru phase within the RRML. Fig. 2e and f show the X-ray diffraction (XRD) results of HTS-LCO coated with 5 and 40 nm-thick RRMLs. Regardless of the RRML thickness, the main diffraction peaks of HTS-LCO at 18.8° and 45.2°, corresponding to the (003) and (104) planes, respectively, remain nearly unchanged, corroborating the TEM analysis (Fig. 2b) that the ALD process hardly affects the crystal structure of HTS-LCO. However, as shown by the magnified XRD patterns over the 38°–44.6° range (Fig. 2f), a clear difference is observed based on the RRML thickness. For the 5 nm RRML, no apparent diffraction peaks are observed in this region, whereas the 40 nm RRML exhibits the Ru (002) and (101) diffraction peaks at approximately 42.2° and 43.9°, respectively. These results indicate that the absence of diffraction peaks at 5 nm originates from the extremely small grain size of the layer, which is consistent with the previously discussed growth mechanism.
To evaluate the effect of the RRML, full coin-type cells are assembled using uncoated HTS-LCO (bare cell) and RRML-coated HTS-LCO (RRML cell) as the cathodes and graphite as the anode. As shown in Fig. 3a, the bare cell exhibits unstable cycling behavior after approximately 120 cycles and delivers a discharge capacity of 113.9 mAh g−1 with 79.3% capacity retention in the 280th cycle. In contrast, the RRML cell retains stable operation for up to 500 cycles and exhibits a capacity retention of 77.6%. The cycle life, defined at 80% capacity retention, is prolonged from 211 to 440 cycles by the RRML coating, reflecting a nearly two-fold enhancement. The rate capability is evaluated by inserting discharge steps at 0.2 and 0.5C every 50 cycles (Fig. 3b). The bare cell exhibits a 1C capacity retention of 94.7% relative to 0.2C in the 53rd cycle, which decreases to 90.6% in the 253rd cycle. In contrast, the RRML cell exhibits nearly constant capacity retentions between 94.9% and 95.2% under identical conditions. These results suggest that the bare cell becomes increasingly limited by nonuniform charge transfer and localized polarization associated with the absence of a CA, accompanied by progressive interfacial processes that are consistent with an increase in interfacial resistance during cycling.29–32
Fig. 3c presents the charge–discharge profiles of the bare and RRML cells in the first cycle (0.2C), and Fig. 3d shows those in the 280th cycle (1C). The corresponding average discharge voltages are shown in Fig. 3e. At the beginning of the 1C discharge in the 280th cycle (Fig. 3d), the bare cell exhibits a voltage decrease of 0.253 V, whereas the RRML cell exhibits a decrease of only 0.096 V. The average discharge voltages of the bare and RRML cells are 3.81 and 3.86 V in the first cycle (0.2C) and 3.59 and 3.75 V in the 280th cycle (1C), respectively. Consequently, the decreases in the average discharge voltage from the first to the 280th cycle are 0.22 and 0.076 V for the bare and RRML-coated cells, respectively, representing a nearly threefold difference. These results are consistent with reduced interfacial impedance growth in the RRML cell under high-rate operation, supporting its role in stabilizing charge-transfer behavior at the cathode–electrolyte interface. Fig. 3f presents the voltage–time profile of the cells in the 280th cycle, while Fig. 3g summarizes the relative durations of the constant-current (CC) and constant-voltage (CV) charging steps. In general, a reduced CC-time ratio indicates that the cell reaches the cut-off voltage prematurely owing to increased polarization, which is primarily associated with elevated interfacial resistance at the cathode–electrolyte interface.33,34 Under such conditions, the CC step terminates earlier, and a prolonged CV step follows. In the 280th cycle, the CC charging times of the bare and RRML cells are 1991 and 3093 s, corresponding to CC-time ratios of 44.9% and 71.5%, respectively, representing a 1.6-fold difference. The markedly shorter CC step of the bare cell reflects severe interfacial polarization, whereas the extended CC step of the RRML cell indicates suppressed polarization buildup during charging. This interpretation is further supported by electrochemical impedance spectroscopy (EIS) performed after the formation cycles, where the RRML cell exhibits a lower charge-transfer resistance (Rct ≈ 36.8 Ω) than the bare cell (Rct ≈ 51.9 Ω), indicating reduced interfacial impedance at the cathode–electrolyte interface (Fig. S4 and Table S2). Taken together, the polarization behavior, CC/CV time-ratio evolution, and EIS results consistently indicate mitigated interfacial-impedance buildup in the RRML cell during long-term cycling.
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3. Moreover, 2032-type coin cells were assembled in an Ar-filled glove box. After 24 h rest at 25 °C, the cells were tested with a battery-cycle tester (TOSCAT, Toyo). Charge–discharge tests were conducted within a voltage window of 3.0–4.35 V. The cells were charged to 4.35 V at 0.1C in CC mode, followed by CV charging at 4.35 V until the current decreased to 0.05C. The discharge process was performed at 0.1C to 3.0 V in CC mode. Three formation cycles were carried out under these conditions, followed by cycling at 0.2C (1 cycle), 0.5C (1 cycle), and 1C (48 cycles) within the same voltage range. All electrochemical measurements were conducted at 25 °C.
Supplementary information (SI) is available. See DOI: https://doi.org/10.1039/d5ta09872f.
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