Yang Jin
a,
Denzheng Gaoa,
Yixuan Hua,
Pengpeng Chena,
Yuting Qiu*b and
Li-Dong Zhao
*a
aSchool of Materials Science and Engineering, Beihang University, Beijing 100191, China. E-mail: zhaolidong@buaa.edu.cn
bEngineering Practice and Innovation Center, Beihang University, Beijing 100191, China. E-mail: qyt2014@buaa.edu.cn
First published on 26th January 2026
GeSe, as a medium-temperature thermoelectric (TE) material, exhibits great potential for power generation. Improving symmetry is a pivotal strategy for enhancing the TE properties of GeSe-based materials. Herein, we incorporated 10 mol% AgBiTe2 as a solid solution into the GeSe matrix to enhance its structural symmetry. Then, we demonstrate a coordinated Pb-alloying strategy that drastically reduced lattice thermal conductivity (κlat) without compromising the electrical properties of GeSe-based materials, achieving an advance in thermoelectric performance and conversion efficiency. The Seebeck coefficient is significantly enhanced by the optimized carrier density and enlarged density of states effective mass, thus preserving electrical properties. The lattice conductivity is driven to the near-theoretical minimum through a concerted effect of chemical bonding softening and intensive point-defect phonon scattering. A minimum κlat of 0.44 W m−1 K−1 at 473 K is acquired. These concerted mechanisms culminate in a record ZT of 1.35 at 723 K in the (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1 composition. Besides, a single-leg device of Pb-alloyed GeSe realizes a conversion efficiency of 5.5% at a ΔT of 300 K, underscoring its practical potential. This work not only demonstrates a feasible route toward high-performance GeSe thermoelectrics but also provides a generalizable materials-design paradigm applicable to a broad range of low-symmetry chalcogenides.
S2σ).3 An excellent PF requires high carrier mobility, optimal carrier density and a suitable band structure. And the κ comprises electronic (κele) and lattice (κlat) contributions. The lattice component, which originates from phonon propagation, is the primary target for manipulation in TE materials.4 Numerous strategies are dedicated to achieving fast carriers and blocked phonons in TE systems. The manipulation of band shape,5,6 lattice plainification7,8 and deformation potential9,10 ensures electrical transport properties, while hierarchical scattering architecture,11 anharmonicity12,13 and low-symmetry crystal structures14 are conducive to intensifying phonon scattering. Typically, additives in TE materials do not have a singular effect but trigger multiple effects on coupled TE properties due to the interdependence of thermoelectric parameters.
Among numerous TE materials, GeSe, a group IV–VI monochalcogenide, is noted for its theoretically predicted high ZT.15 However, pristine GeSe exhibits an intrinsically low carrier density (nH ∼ 1016 cm−3), severely limiting its TE performance and resulting in a low ZT.16 Despite the exploration of various dopants for carrier concentration adjustment, the effectiveness has remained limited due to the low-symmetry orthorhombic phase (Pnma) of intrinsic GeSe. Recent breakthroughs have demonstrated that enhancing the crystal symmetry of GeSe to rhombohedral (R3m) or cubic (Fm
m) phases can simultaneously ameliorate carrier and phonon transport.17,18 This symmetry enhancement can be triggered by entropy-driven alloying with compounds like In2Te3,19 AgSbSe2,17,20,21 AgBiTe2,22,23 or CdTe.24 Within this paradigm, the introduction of lead (Pb) has emerged as a particularly potent strategy, which not only aids in stabilizing these high-symmetry phases but also actively participates in creating defect structures.25,26
In this work, we elucidate the role of Pb in promoting the thermoelectric performance of (GeSe)0.9(AgBiTe2)0.1 ingots. A prominent ZT of 1.35 at 723 K and an outstanding η of 5.5% with a ΔT of 300 K are realized in Pb-alloyed (GeSe)0.9(AgBiTe2)0.1. A significant increase in S was achieved, which derives from the synergistic effect of an increased DOS effective mass (m*) and a decreased nH induced by Pb alloying. Meanwhile, the incorporation of Pb drastically reduces κlat through a combination of weakened chemical bonds and intensive point-defect scattering, while simultaneously preserving the electrical properties. An ultralow κlat of 0.44 W m−1 K−1 at 473 K is attained in (Ge0.96Pb0.04Se)0.9(AgBiTe2)0.1 near the amorphous limit of GeSe. Ultimately, the reduced lattice thermal conductivity combined with retained electrical properties culminates in markedly elevated thermoelectric performance, leading to a distinguish ZTave of 0.95 across 303 K to 723 K. Our work offers a new paradigm for the rational design of high-performance TEs, which can be extended to other low-symmetry chalcogenide systems.
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| Fig. 1 Phase identification of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06) includes (a) PXRD patterns and (b) lattice parameters. | ||
The electrical properties of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06) are illustrated in Fig. 2. The overall σ decreases with rising temperature and then fluctuates around 473–573 K, coinciding with a phase transformation.23 Differential scanning calorimetry (DSC) measurements were performed, as illustrated in Fig. S2. The room-temperature σ sharply reduces from 437 S cm−1 for (GeSe)0.9(AgBiTe2)0.1 to 133 S cm−1 for (Ge0.94Pb0.06Se)0.9(AgBiTe2)0.1 by alloying Pb. And the overall Seebeck coefficient, presenting the opposite phenomenon, increases with rising Pb content, as depicted in Fig. 2(b). A significant (∼40%) improvement in the peak S at 473 K is achieved, increasing from 237 µV K−1 K for (GeSe)0.9(AgBiTe2)0.1 to 328 µV K−1 for (Ge0.94Pb0.06Se)0.9(AgBiTe2)0.1. The carrier density and mobility were measured to elucidate the variation between the S and electrical conductivity. The carrier density of the (GeSe)0.9(AgBiTe2)0.1 ingot is 3.66 × 1020 cm−3 at 303 K, which is higher than that of the reported (GeSe)0.9(AgBiTe2)0.1 polycrystal.23 The high carrier density contributes to the low carrier mobility in the (GeSe)0.9(AgBiTe2)0.1 ingot. Besides, the carrier density reduces as the Pb content increases, as illustrated in Fig. 2(c). The hole density in germanium chalcogenides is correlated with the formation energy of the Ge vacancy (Ef (VGe)). The reduced carrier density arises from the enhanced Ef (VGe) induced by Pb alloying.26–28 The carrier mobility experiences a slight decrease by incorporating Pb. Therefore, the decreased carrier mobility and density collectively result in a decline in electrical conductivity. The density of states (DOS) m* of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06) is depicted in Fig. S1(b). The DOS effective mass is significantly enhanced from 0.65 m0 for (GeSe)0.9(AgBiTe2)0.1 to 1.05 m0 for (Ge0.94Pb0.06Se)0.9(AgBiTe2)0.1, primarily due to band convergence induced by Pb alloying.26 The combination of diminished carrier density and the large DOS effective mass leads to superior Seebeck coefficients. Thus, a maximum power factor of 18 µW cm−1 K−2 at 673 K is achieved in (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1, as presented in Fig. 2(d).
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| Fig. 2 The electrical properties of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06): (a) σ, (b) S, (c) nH and µH at 303 K, and (d) PF. | ||
The thermal properties of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06) are presented in Fig. 3. The total thermal conductivity (κtot) initially declines with rising temperature and then increases at 473 K, coinciding with the temperature of phase transformation, as depicted in Fig. 3(a). The ambient-temperature κtot decreases from 0.89 W m−1 K−1 to 0.63 W m−1 K−1 with increasing Pb content. A minimum κtot of 0.5 W m−1 K−1 is obtained at 473 K for (Ge0.96Pb0.04Se)0.9(AgBiTe2)0.1. The κele is estimated using κele = LσT, where L denotes the Lorenz constant calculated from S employing a single parabolic band (SPB) model. (Fig. S1(c)) The electronic thermal conductivity significantly decreases as Pb content rises, stemming from the reduced carrier density and mobility. The κlat is derived by deducting the electronic component from the κtot, as presented in Fig. 3(b). The κlat at 303 K decreases from 0.66 W m−1 K−1 for (GeSe)0.9(AgBiTe2)0.1 to 0.56 W m−1 K−1 for (Ge0.94Pb0.06Se)0.9(AgBiTe2)0.1. The lowest κlat reaches 0.44 W m−1 K−1 for (Ge0.96Pb0.04Se)0.9(AgBiTe2)0.1. The sound velocity is measured to investigate reduced κlat, as presented in Fig. 3(c). The sound velocities, including transverse (vt) and longitudinal (vl), decline with rising Pb content, demonstrating bond weakening after Pb alloying.9,26 Besides, the large Pb atoms possess higher mass and larger radius than Ge atoms. Thus, the incorporation of Pb in the matrix generates mass and strain field fluctuations, as demonstrated by the scattering parameters of mass ГM and strain ГS, as illustrated in Fig. 3(d). The lattice softening and point defects collectively impede phonon transport, thus resulting in a decrease in κlat and approaching the limitation of κlat in GeSe-based materials.16
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| Fig. 3 The thermal properties of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06): (a) κtot, (b) κlat, (c) sound velocity (vl and vt), and (d) distortion parameters Γ (ΓM and ΓS). | ||
The thermoelectric performance is evaluated from the ratio of carrier mobility to κlat, as depicted in Fig. 4(a) to explicate the effects of Pb in GeSe-based materials. Pb alloying not only effectively intensifies phonon scattering via lattice softening and point defects but also preserves electrical transport properties, leading to a large µH/κlat in (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1. Hence, remarkable thermoelectric performance is achieved by Pb alloying, as presented in Fig. 4(b). The peak ZT value is enhanced from 1.22 for (GeSe)0.9(AgBiTe2)0.1 to 1.35 for (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1. The peak average ZT (ZTave) across 303 K to 723 K could reach 0.95 for (Ge0.98Pb0.02Se)0.9(AgBiTe2)0.1, as depicted in Fig. 4(d). The excellent TE performance in this work exhibits good thermal stability, which outperforms other GeSe systems, such as GeSe–AgBiSe2, GeSe–AgSbTe2, GeSe–AgSbSe2, GeSe–Sb–Cd–Te, and GeSe–Bi–MnCdTe2, as depicted in Fig. 4(c) and Fig. S3. The high ZT motivates us to further assemble a single-leg device for power generation. Ni and Cu are selected as the barrier layer material and electrode, respectively, and are connected using conductive silver paste. The voltage, efficiency and output power versus current are depicted in Fig. 5. And the heat flow is displayed in Fig. S1(d). The single-leg device fabricated from (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1 acquires an eminent η of 5.5% with a ΔT of 300 K, which is higher than that of other GeSe-based materials at similar ΔT, as displayed in Fig. 5(d).19,25,26
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| Fig. 4 The TE performance of (Ge1–xPbxSe)0.9(AgBiTe2)0.1 (x = 0–0.06): (a) the ratio of µH/κlat, (b) ZT, (c) comparison of ZT with other GeSe systems, and (d) ZTave. | ||
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| Fig. 5 The single-leg device performance of (Ge0.99Pb0.01Se)0.9(AgBiTe2)0.1 with different ΔT: current-dependent (a) voltage, (b) η, and (c) output power. (d) Comparison of η with other GeSe-based materials,19,25,26 with the inset showing the single-leg device connected to a Cu electrode during the test. | ||
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