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Correction: Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications

Van Long Huynh, Knut E. Aasmundtveit and Hoang-Vu Nguyen*
Department of Microsystems, University of South-Eastern Norway, Raveien 215, Borre, 3184, Norway. E-mail: Hoang.V.Nguyen@usn.no

Received 23rd February 2026 , Accepted 23rd February 2026

First published on 10th March 2026


Abstract

Correction for ‘Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications’ by Van Long Huynh et al., Soft Matter, 2025, 21, 6641–6648. DOI: https://doi.org/10.1039/D5SM00446B.


The authors regret that there was an error in the sentence in line 7–8, Method Section 2.1, page 6642 of the original article. The text originally read, “The cleaned wafers were spin-coated with either a positive photoresist (SU-8 10, Kayaku) or a negative photoresist (AZ 4562, MicroChemicals).” This sentence should read, “The cleaned wafers were spin-coated with either a positive photoresist (AZ 4562, MicroChemicals) or a negative photoresist (SU-8 10, Kayaku).”

The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.


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