High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm via stepwise cycling in Y-doped Hf0.5Zr0.5O2 thin films

Abstract

This study investigates the field-induced ferroelectric (FFE) characteristics and dynamic random access memory (DRAM) performance of Y-doped Hf0.5Zr0.5O2 (Y:Hf0.5Zr0.5O2) thin films grown by atomic layer deposition (ALD). Compared with undoped Hf0.5Zr0.5O2, the Y:Hf0.5Zr0.5O2 film exhibited suppressed ferroelectric orthorhombic phase and stabilized FFE tetragonal phase, resulting in double hysteresis loop characteristics in the polarization–electric field curves. These changes were attributed to substitutional diffusion of Y ions introduced by a single ALD cycle of Y2O3 inserted in the middle of the film. However, the onset field of the FFE effect from the pristine film was too high for DRAM application. To address this issue, a stepwise cycling method was proposed, consisting of an initial short high-field cycling step (6 MV cm−1, 105 cycles, 1 second) followed by subsequent cycles at gradually decreased field amplitudes (5 MV cm−1, 105 cycles, 1 second → 4 MV cm−1, 107 cycles, 100 seconds). This approach effectively shifted the FFE switching peaks toward lower fields, enabling charge boosting at low voltage (±0.8 V) while minimizing increases in remanent polarization and leakage current density (J). Consequently, the stepwise cycled 5.5-nm-thick Y:Hf0.5Zr0.5O2 film achieved a high dielectric permittivity (k) of ∼68 and a record-low equivalent oxide thickness (EOT) of ∼0.31 nm among dielectric thin films satisfying the DRAM J criterion (J < 10−7 A cm−2 at 0.8 V). The substantial EOT reduction with stepwise cycling was enabled by the low-voltage charge-boosting effect, which enhanced the field-induced polarization response. These improvements were attributed to dopant-induced local structural inhomogeneity and effective redistribution of double positively charged oxygen vacancies. The EOT values were sustained with only slight degradation over 109 cycles of 0.8 V operation and fully recovered after short high-field cycling.

Graphical abstract: High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm via stepwise cycling in Y-doped Hf0.5Zr0.5O2 thin films

Supplementary files

Article information

Article type
Communication
Submitted
14 Aug 2025
Accepted
06 Nov 2025
First published
07 Nov 2025

Mater. Horiz., 2026, Advance Article

High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm via stepwise cycling in Y-doped Hf0.5Zr0.5O2 thin films

J. Shin, H. Seo, J. Han, T. K. Kim, H. Paik, H. Song, H. Yoon, H. S. Park, K. D. Kim, S. J. Shin, J. H. Song, S. Lee, S. Choi, D. H. Shin, J. Choi and C. S. Hwang, Mater. Horiz., 2026, Advance Article , DOI: 10.1039/D5MH01563D

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements