Open Access Article
Daniel A. Morales Jrab,
Collin Sindtbc,
Kell Fremouwab,
Kaitian Maoab,
Matteo Pomaab,
Thomas Stewartd,
Ryan A. DeCrescent
b and
Michael D. McGehee*abc
aMaterials Science and Engineering (MSE) Program, University of Colorado Boulder, Boulder, CO 80303, USA. E-mail: Michael.McGehee@colorado.edu; dmo7603@gmail.com
bRenewable and Sustainable Energy Institute (RASEI), University of Colorado Boulder, Boulder, CO 80303, USA. E-mail: Ryan.Decrescent@colorado.edu
cChemical and Biological Engineering, University of Colorado Boulder, Boulder, CO 80303, USA
dDepartment of Physics, University of Colorado Boulder, Boulder, CO 80309, USA
First published on 12th January 2026
When perovskite solar cells (PSCs) are subjected to reverse bias, they often abruptly pass large current densities through localized film defects. The large, localized current induces heating that quickly and permanently damages the materials in the device – including transport layers, perovskite, and metal contacts – and often leads to permanent electrical shorting of the device. We employed a 30-nm-thick nickel oxide (NiOX) hole transport layer (HTL) in PSCs and found that NiOX decreased the likelihood that cells show abrupt reverse-bias breakdown and prevented permanent shorting and severe thermal damage. We found that cells using NiOX could recover up to 84% of their initial PCE even after passing −20 mA cm−2 of average reverse current densities (the cell's one-sun short-circuit current density) for 5 minutes. Cells with all-organic HTLs were permanently shorted afterwards. In addition to preventing abrupt breakdown, photoluminescence images of cells before and after reverse-bias breakdown show that NiOX also prevents localized damage to the perovskite and transport layers, presumably due to its superior uniformity and thermal stability compared to organic HTLs.
Broader contextWhen a solar panel is partially shaded, current can be forced “backward” through the shaded cells. This condition, known as “reverse bias”, causes severe thermal and electrical stress even in strong silicon cells. Perovskite solar cells have historically been very weak to this type of stress, showing rapid and permanent degradation under slight reverse bias. In perovskite solar cells – like other thin-film solar cells – some of this problem is related to the use of very thin (5 to 10 nanometers) hole-transporting layers which have thickness inhomogeneities and pinholes that act as electrical weak spots. To improve their electrical and thermal resilience, they need to be thicker while avoiding excessive electrical resistance. We show that sputtered nickel oxide is a good material choice to make thicker hole transport layers that can solve this problem. Sputtered nickel oxide has exceptional uniformity and lower electrical resistance compared to solution-processed organic hole transport layers. It reliably makes perovskite solar cells more resilient to moderate reverse bias. Sputtering is also a relevant industry-scale process that can be used to deposit high-quality films over large areas, and even on highly textured silicon for perovskite-silicon tandem solar cells. |
Abrupt breakdown of thin-film solar cells in reverse bias is typically associated with the formation of “hotspots” which occur near fabrication defects (e.g., pinholes in any layer, or other electrically conductive defects), leading to low breakdown voltages of just −1 V to −4 V.11–17 Pinholes and weak spots are a common result of crystallization dynamics (e.g., bubbles or film tension), material defects (particle or dried material attachment) or poor wetting of the solution on the substrate.19–21 Commercial Si cells have high reverse breakdown voltages (VBr) – often greater than −15 V – and panels can thus be protected against reverse-bias stress by incorporating about one bypass diode per 10–20 cells. The low and unpredictable VBr in typical PSCs (sometimes as low as −0.5 V to −1 V) would not reliably enable the bypass diode strategy, and would in the best case still require about one bypass diode per cell, greatly increasing production costs.19 Any strategy to reliably increase breakdown voltages to several volts will be helpful in this regard. Strategies to increase the VBr of PSCs have involved using a tin-oxide (SnOX) electron transport layer (ETL) or using a thicker (∼35 nm) polymer hole-transport layer (HTL) to improve layer uniformity and eliminate conductive weak spots. With these strategies, VBr values have been increased up to about −10 to −12 V or larger.18,22 However, thick undoped polymers increase series resistance and reduce power-conversion efficiencies to unacceptable levels, while doped polymers can introduce parasitic optical absorption.23
Here, we show that sputtered NiOX is a good HTL for preventing abrupt breakdown in PSCs. A 30-nm-thick layer of NiOX provides uniform coverage on rough transparent conductive oxides (TCOs) like tin-doped indium oxide (ITO), and has low optical loss and acceptably low series resistance. The thermal stability of NiOX compared to organic HTLs also allows it to pass larger localized current densities and experience larger localized Joule heating without catastrophic failure, helping prevent permanent shorting even if cells show abrupt breakdown. Because of its improved uniformity over organic HTLs, it is also reasonable to assume that if pinholes are present within the perovskite layer, the current would be more evenly distributed across the entire pinhole, or even the whole cell, rather than highly localized at an HTL “weak” spot in the perovskite pinhole. We used photoluminescence (PL) imaging before and after reverse biasing cells to locate pinhole defects in the perovskite film that are likely passing disproportionately large localized current densities under reverse bias. PL imaging shows that NiOX prevents damage to the perovskite around these pinholes.
NiOX significantly reduced the chance of abrupt reverse breakdown in TLDs compared to SAM-only HTLs. 11 out of 12 TLDs using NiOX (including NiOX and NiOX + SAM) showed a gradual reverse-bias breakdown (blue and grey curves). Further, the NiOX TLDs retained their diode-like J–V behavior after these reverse bias scans, indicating no permanent degradation to the materials in the TLD during reverse bias (Fig. 1C). In contrast, all SAM-only TLDs showed abrupt breakdown before reaching −2 V (Fig. 1B) and were permanently shorted afterward (Fig. 1C). In a complete solar cell, we expect NiOX or NiOX + SAM HTLs to help prevent abrupt breakdown and permanent device degradation should perovskite pinholes exist.
Having established that TLDs comprising NiOX show consistent reverse-bias J–V behavior and gradual reverse-bias breakdown, we compared solar cells with a combination of NiOX and NiOX + SAM HTLs to ones with a SAM-only HTL. Initial forward-bias J–V sweeps show that PCEs of NiOX + SAM devices (17.46 ± 1.08%) were similar to those with SAMs (18.81 ± 1.01%) (Fig. 1D). Devices with SAMs showed on average slightly higher open-circuit voltages due to improved interface properties (1180.7 ± 35.6 mV for SAM devices and 1175.5 ± 30.9 mV for NiOX + SAM devices). 30 nm of NiOX did not add appreciable series resistance to the cells. During the reverse-bias J–V sweeps, the PSCs with NiOX + SAM HTLs were much more likely to show gradual breakdown around −4 V to −5 V (Fig. 1E).26,28 Breakdown statistics are presented in Fig. 1F, where we bin the total number of cells based on the voltage at which they pass −20 mA cm−2 average current density. NiOX + SAM PSCs show a substantially higher proportion of devices exceeding −4 V (9 out of 11 devices) compared to SAM-only devices (3 out of 11 devices). NiOX + SAM PSCs also showed more consistent and gradual breakdown behavior.
To assess cells for any permanent damage after these reverse-bias J–V scans, we tested the forward-bias performance of the cells under illumination. PSCs comprising a SAM-only HTL showed an average PCE loss of 65.1% (relative) after reverse-bias J–V scans. In contrast, cells with NiOX + SAM HTL showed an average PCE loss of 47.8% (relative) afterward and displayed fewer instances of highly conductive ohmic shunts (SI Fig. 1). The PCE losses were primarily driven by reduced shunt resistances and associated reduced fill factors (FFs).
To understand the degradation of the cells after reverse bias, we delaminated the Ag electrodes from the cells and performed X-ray photoelectron spectroscopy (XPS) on both the peeled electrodes and the underlying perovskite films (SI Fig. 2 and 3). The XPS spectra from the peeled Ag electrodes (SI Fig. 2) showed I 3d signals after reverse bias, regardless of the HTL used. Since neutral iodine would likely leave the sample as a gas, the signal is likely from the formation of AgI at the Ag/BCP/C60 interface due to the diffusion of iodine (I−, I2, or I3−) through the C60 occurring during reverse bias. A thin layer of AgI would be electrically resistive and would likely change energy alignment between the metal and ETL, decreasing the JSC and FF. This would be especially true in cells that did not show abrupt breakdown during reverse J–V sweeps since they experienced larger reverse potentials over longer periods of time. Visual images of the perovskite films below the delaminated Ag electrodes after reverse bias show some type of surface corrosion and optical scattering texture (SI Fig. 2B), further support the hypothesis of AgI formation.
The observations from both Fig. 1 and from XPS (SI Fig. 2 and 3) show that although NiOX helps prevent abrupt low-voltage breakdown in PCSs, it does not prevent harmful electrochemistry at the ETL and top metal contact interface associated with the soft breakdown of the cells. To prevent the formation of AgI and associated degradation in our PSCs, we used atomic layer deposition (ALD) to deposit a 20-nm-thick SnOX ETL on top of the C60 layer. ALD SnOX is well known to be an excellent ETL material and barrier against diffusion of metal and iodine in PSCs.18,22,27 We used the same HTL combinations, perovskite layer, and Ag top metal contact (Fig. 2A).15,20
When using ALD SnOX with any HTL combination, the average reverse breakdown voltages shift to larger reverse potentials by about −1 V, but the portion of abrupt breakdown events still depends on the specific HTL (Fig. 2B). We found that abrupt breakdown still frequently occurs for the SAM-only HTL PSCs during the reverse J–V scans (Fig. 2B, red curves). In contrast, NiOX once again consistently reduced the likelihood of abrupt breakdown (blue and black curves). The breakdown statistics are shown in Fig. 2C, where we again bin the total number of devices based on the voltage at which they pass −20 mA cm−2 average current density. SAM-only HTLs led to 8 out of 19 (42%) exceeding −4.5 V, whereas NiOX and NiOX + SAM HTLs led to 7 out of 9 (78%) and 15 out of 16 (93%) devices exceeding this voltage before breaking down, respectively. The J–V curves before and after the reverse sweeps for each HTL with ALD SnOX are provided in SI Fig. 4.
NiOX once again prevented the abrupt breakdown of our solar cells during these reverse bias scans. Nearly all cells with SnOX ETLs were not permanently shunted after these reverse J–V sweeps. We attribute the improved ability of the cells to retain their PCEs to the ALD SnOX layer, which acts as a strong barrier against ion diffusion, helping to prevent the formation of AgI under reverse bias, and preventing the formation of permanent conductive shunts even if cells showed abrupt breakdown for short durations.18,27
To better understand the resilience of NiOX, we stressed a separate batch of cells by passing −2.4 mA through the cell – corresponding to an average current density of −20 mA cm−2 (their approximate JSC) – in the dark for both 5 and 20 minutes. If the current is distributed disproportionately with high localized current densities in pinholes, we expect very high temperatures and cell degradation in those regions. After holding these cells at −2.4 mA for 5 minutes in the dark, we performed light-J–V scans in forward bias and found that 10 out of 11 cells with NiOX retained some degree of photovoltaic performance, on average retaining 75% of their initial PCEs (Fig. 2E) (exemplary J–V curves before and after a long fixed-current stress test is shown in SI Fig. 6). In contrast, nearly all cells (9 out of 11) with SAM-only HTLs remained permanently shorted (Fig. 2G). We further investigated the cause of the degradation of cells with organic HTLs by PL imaging to look for evidence of burn marks or permanent damage. In contrast to visual microscopy, PL images can indicate subtle localized degradation to the perovskite layer that is revealed by decreased PL intensity. A net decrease in PL intensity across the cell can also reveal highly conductive shunts between the electrodes.
We were particularly interested in damage occurring at pre-existing pinholes, which was previously identified to be the origin of substantial material degradation and even electrode melting.18 Fig. 2D shows PL images of a PSC with a SAM-only HTL before (left) and after (right) holding −2.4 mA for 20 minutes in the dark. Several pre-existing perovskite pinholes are circled, identified by dark spots in the PL image. After reverse-bias stress, we observed a slight exaggeration of these same defects, indicating that degradation of the perovskite occurred in these areas. On average, PL intensities across the whole cell area decreased after reverse bias, indicating highly conductive permanent shunts. Voltage–time curves for these fixed-current holds are shown in SI Fig. 5, where abrupt decreases in the applied potential indicate some type of abrupt breakdown during the measurements. Forward-bias J–V curves of these cells with SAMs showed linear behavior with a high slope and nearly 0% PCE even after allowing the devices to rest overnight (SI Fig. 7), indicating highly conductive permanent shorting from the formation of severe hotspots, burning and metal melting around these pinholes. In contrast, cells including NiOX + SAM HTLs could be held at an average current density of −20 mA cm−2 for 20 minutes with no indication of burning, melting or other damage (Fig. 2F). Further, they showed no noticeable decrease in PL intensity across the whole cell area.
Without a uniform NiOX layer, Joule heating likely leads to quick material degradation of the organic HTL, exposing the underlying ITO and leading to a run-away increase in current densities, metal melting and ultimately a permanently shorted cell like those shown in Fig. 2. Incorporating NiOX underneath the SAM prevents the formation of highly conductive contact between ITO and the ETL and seems to prevent extreme localized heating, burning and melting.
Supplementary information (SI): experimental details (materials, device fabrication, and characterization), additional data, and modeling. See DOI: https://doi.org/10.1039/d5el00206k.
| This journal is © The Royal Society of Chemistry 2026 |