Regulation of properties of Sb flexible phase change films induced by ultrasonic vibration: a multi-dimensional study

Abstract

In recent years, flexible memory technology has made unprecedented progress in power consumption performance and structural optimization. However, achieving multi-functionality in materials remains a significant challenge for modern electronic devices. At present, theoretical research on ultrasonic vibration is relatively mature, providing a new solution for optimizing the performance of electronic components. In this study, an innovative strategy was proposed, utilizing magnetron sputtering technology combined with ultrasonic surface standing waves, to prepare high-quality flexible phase-change films. The ultrasonic process improved thermal stability, carrier concentration, and electrical stability while refining grain size. In addition, it enhanced the crystalline surface flatness and strengthened the film–substrate adhesion. Finally, efficient and stable Sb-based electronic devices were fabricated on flexible PEEK substrates. The reversible SET/RESET switching of the device was achieved with a 100 ns pulse width under ultrasonic surface standing waves. The results showed that the target device exhibited strong reliability and stability. This study provided a cost-effective and scalable approach for producing high-quality flexible phase-change memory, while also proposing a novel strategy for developing multi-functional electronic materials.