Hee-Woong Parka,
Hyun-Su Seoa,
Kiok Kwona and
Seunghan Shin*ab
aGreen Chemistry & Materials Group, Korea Institute of Industrial Technology (KITECH), Cheonan, Chungnam 31056, Republic of Korea. E-mail: shshin@kitech.re.kr
bDepartment of Green Process and System Engineering, University of Science & Technology (UST), Daejeon 34113, Republic of Korea
First published on 17th April 2023
Photoreactive pressure-sensitive adhesives (PSAs) were prepared by grafting mono- or difunctional photoreactive monomers onto acrylic PSA, and their adhesion properties were evaluated before and after ultraviolet (UV) curing for application as dicing tape. In this study, the NCO-terminated difunctional photoreactive monomer (NDPM) was newly synthesized and compared with 2-acryloxyloxyethyl isocyanate (AOI), a monofunctional monomer. The 180° peel strengths of pristine and photoreactive PSAs were similar before UV curing (1850–2030 gf/25 mm). After UV curing, the 180° peel strengths of the photoreactive PSAs decreased significantly and converged to nearly zero. When a UV dose of 200 mJ cm−2 was used, the 180° peel strength of 40% NDPM-grafted PSA decreased to 8.40 gf/25 mm, which was much lower than that of 40% AOI-grafted PSA (39.26 gf/25 mm). NDPM-grafted PSA also showed that its storage modulus shifted more to the upper right side of Chang's viscoelastic window than AOI-grafted PSA, and this is because NDPM provided a higher degree of crosslinking than AOI. Furthermore, SEM-EDS analysis showed that UV-cured NDPM-grafted PSA retained almost no residue on the silicon wafer after debonding.
Dicing tape is used for fixing a silicon wafer in a dicing process. During the dicing process, a high peel force for the wafer is needed, but after dicing, easy peeling for picking up the chips and low residue are needed. To complete these requirements, UV-curable PSA has been developed and widely used.9,10 UV-curable PSA is normally prepared with an acrylate copolymer-based PSA containing a photoreactive group. After UV curing, its modulus greatly increases due to the crosslink of the photoreactive group of PSA, and thereby, the adhesion decreases sharply.11
A common method of making UV-curable PSA is to mix an acrylic polymer with a multifunctional oligomer/acrylate monomer. After UV curing, it forms a semi-IPN structure.10–14 However, this method has some problems, such as compatibility, low cohesion, and high residue on a silicon wafer, due to the addition of low-molecular-weight substances.11,15,16 Another method is similar to the previous method except it uses a crosslinked acrylic polymer. This UV-curable PSA forms an IPN structure and has improved compatibility, cohesion strength, and low residue on a silicon wafer.17,18 However, compared to the previous method, this method has a relatively low adhesion before UV curing and still has a residue problem due to the unreacted low-molecular-weight additives.
To solve these problems, a photocurable functional group was directly grafted onto the acrylic polymer chain. Ryu et al. reported that extremely low peel strength and residue level were achieved by UV curing after introducing a photocurable functional group through a ring opening reaction of acrylic acid and glycidyl methacrylate in an acrylic polymer.16 However, the initial adhesive strength decreased as the amount of acrylic acid increased. Recently, Han et al. reported that isocyanatoethyl methacrylate (IEM) was introduced through a urethane reaction to a hydroxyl group in the acrylic polymer and achieved excellent debonding properties upon UV irradiation for 40 s.19 Although multifunctional acrylate has the advantage of providing high crosslink density and fast crosslinking in the UV-curing process,18,20 there have been few studies of the direct grafting of multifunctional acrylate onto acrylic polymer chains. Therefore, the purpose of this study was to enhance the efficiency of UV-curable acrylic PSA by incorporating multifunctional acrylate groups with favourable properties into the acrylic PSA. The ultimate goal was to achieve desirable easy-to-peel properties, characterized by reduced peel strength and minimal residue after UV exposure.
In this study, a novel NCO-terminated difunctional photoreactive monomer (NDPM) was synthesized with the expectation that it could induce a higher degree of crosslinking and lower adhesion and residue levels after UV curing than a monofunctional photoreactive monomer. To verify this, two different monomers, NDPM (difunctional monomer (f = 2)) and 2-acryloxyloxyethyl isocyanate (AOI, monofunctional monomer (f = 1), also called isocyanatoethyl acrylate), were grafted onto acrylic PSA through a urethane reaction. After characterizing the photoreactive PSAs, their 180° peel strength and residue on the silicon wafer before and after UV irradiation were evaluated by changing the types of photoreactive monomers and graft amounts. Chang's viscoelastic window of photoreactive PSAs was drawn to compare the changes in their adhesion performance by grafting and UV curing.
Sample | Control PSA (50 wt%, g) | Monomer | DBTDL (part) | |||
---|---|---|---|---|---|---|
Type | Amount | mol% (–OH in Control PSA) | ||||
g | mmol | |||||
Control PSA | — | — | — | 0 | — | |
PSA-A10 | 50.00 (OH = 32.29 mmol) | AOI | 0.46 | 3.22 | 10 | 0.1 |
PSA-A20 | 0.91 | 6.46 | 20 | |||
PSA-A40 | 1.82 | 12.91 | 40 | |||
PSA-A70 | 3.19 | 22.60 | 70 | |||
PSA-A100 | 4.56 | 32.29 | 100 | |||
PSA-N10 | 50.00 (OH = 32.29 mmol) | NDPM | 1.41 | 3.22 | 10 | 0.1 |
PSA-N20 | 2.82 | 6.46 | 20 | |||
PSA-N40 | 5.64 | 12.91 | 40 | |||
PSA-N70 | 9.87 | 22.60 | 70 | |||
PSA-N100 | 14.10 | 32.29 | 100 |
The detailed synthetic procedure is as follows: Control PSA solution (50 g, 50 wt% solution) was put into a 250 mL round bottom flask in a nitrogen atmosphere equipped with a mechanical stirrer, and the solution was stirred at 50 °C for 10 min. After that, NCO-terminated photoreactive monomer (AOI or NDPM) and DBTDL (0.1 part) were dissolved in EA and slowly added dropwise over 1 h. After 1 h of additional stirring, the reaction was terminated by cooling the reaction mixture to room temperature, and the final solid contents were adjusted to 50%.
For further photocuring of the prepared samples, UV irradiation was performed using a conveyor-type UV curing system (LZ-UH402RCH, Lichtzen, Gunpo, Korea). The UV intensity at 365 nm was 100 mW cm−2, and the UV dose was controlled by the UV exposure time. The UV dose was confirmed using a UV Power PUCK II radiometer (EIT 2.0 LLC, Leesburg, VA, USA).
The PSA tape prepared with Control PSA syrup was named Control. Photoreactive PSA tapes were named Ax–y or Nx–y, where A is AOI, N is NDPM, x is the mol% of photoreactive monomer to the hydroxyl groups in PSA and y is UV dose. For example, A40-200 means a tape that is prepared with PSA-A40 syrup and a UV dose of 200 mJ cm−2.
The weight-average molecular weight (Mw), number-average molecular weight (Mn) and polydispersity index (PDI) values of the PSA samples were measured using Agilent PL-GPC 220 gel permeation chromatography (GPC) (Agilent Technologies, Santa Clara, CA, USA). The GPC column set was calibrated using polystyrene narrow standards, the operation temperature was 35 °C, and the eluent was THF. The sample was prepared by dissolving it in THF at a concentration of 0.1 wt%.
The 180° peel strength was measured using the SurTA system (ChemiLab, Suwon, Korea). The PSA tape was cut into 60 mm × 100 mm pieces and attached to a silicon wafer. It was rolled twice with a 2 kg roller, left at room temperature for 10 min, and peel strength was then measured at a peeling speed of 300 mm min−1. Measurements were repeated at least 3 times.
The viscoelastic properties (storage modulus, loss modulus, tan delta) of PSAs were measured using an MCR 102 rheometer (Anton Paar, Graz, Austria). The sample was placed on a round plate (8 mm in diameter), and the gap between plates was set to 0.75 mm. The strain was 0.1%, and the plate was twisted in the frequency range from 0.01 to 100 Hz at 25 °C.
The gel fraction was measured using an extraction method. One gram of sample (W0) was wrapped in stainless steel woven wire mesh (#20 mesh). After that, the prepared sample was put in an EA at 40 °C and stirred for 24 h. The solid remaining after filtering was dried in an 80 °C vacuum oven until it reached a constant weight, and the weight (W1) was recorded. The gel fraction was calculated by the following equation: gel fraction (%) = (W1/W0) × 100. Measurements were repeated at least 3 times.
The surface residue on the silicon wafer after peel strength measurement was observed using field-emission scanning electron microscopy (FE-SEM, JSM 6701F, JEOL, Tokyo, Japan) equipped with an energy dispersive X-ray spectrometer (EDS). After cutting the sample to an appropriate size, sputtering was performed for 30 s using a sputter coater 108 auto (Cressington Scientific Instruments, Watford, UK). The magnification was 140×.
After purification by column chromatography, the chemical structure of NDPM was confirmed by FT-IR and 1H-NMR spectra. Fig. 3 shows the FT-IR spectra of NDPM and AMP. The NDPM spectrum did not show the –OH peak (3500 cm−1) of AMP but showed new NH (3300 cm−1) and NCO (2250 cm−1) peaks. The CC (1640 cm−1) peaks were observed in both compounds.
Fig. 4 shows the 1H-NMR spectra of IPDI and NDPM. Peaks observed at 3.54–2.99 (m, 2H) ppm are assigned to the CH2 linkage between the primary isocyanate and the alicyclic ring. These peaks did not change after the urethane reaction (compared with IPDI peak 2). Considering the NMR spectrum and Lomölder et al.'s paper together, the chemical structure of NDPM was confirmed, as displayed in Fig. 4. Based on the FT-IR and 1H-NMR spectra analysis, it was confirmed that NDPM was successfully synthesized.
Reaction monitoring was performed using FT-IR (Fig. 5). As the mol% of photoreactive monomers increased, the –OH peak (3500 cm−1) decreased, and the –NH (3300 cm−1) and CC (1640 cm−1) peaks increased. In addition, it is considered that photoreactive PSA was successfully synthesized because the NCO (2250 cm−1) peak completely disappeared after the reaction was completed.
Fig. 5 FT-IR spectra of (a) AOI-grafted PSAs and (b) NDPM-grafted PSAs, where peak 1 is NH (urethane) stretching, peak 2 is NCO stretching, and peak 3 is CC stretching. |
Table 2 shows the basic information of the synthesized photoreactive PSAs and pristine PSA. The molecular weight of photoreactive PSA slightly increased according to the mol% of the photoreactive monomer. It seems to be slightly increased by the additional heating and stirring conditions, but it did not change significantly compared to the pristine PSA. Additionally, the gel fraction of photoreactive PSA was similar to that of pristine PSA (2∼5%). This means that heat crosslinking hardly occurred during the grafting reaction with pristine PSA, and this result was consistent with the result by Han et al.19
Sample code | Photo-reactive monomer | Mol (%) (based on –OH in Control PSA) | Mn (g mol−1) | Mw (g mol−1) | PDI | Gel fraction (%) |
---|---|---|---|---|---|---|
Control PSA | — | 0 | 234000 | 585000 | 2.50 | 1.95 |
PSA-A10 | AOI | 10 | 233000 | 588000 | 2.52 | 2.14 |
PSA-A20 | 20 | 234000 | 596000 | 2.54 | 1.98 | |
PSA-A40 | 40 | 239000 | 606000 | 2.53 | 2.22 | |
PSA-A70 | 70 | 245000 | 620000 | 2.54 | 2.41 | |
PSA-A100 | 100 | 254000 | 623000 | 2.45 | 2.54 | |
PSA-N10 | NDPM | 10 | 231000 | 599000 | 2.59 | 1.99 |
PSA-N20 | 20 | 249000 | 619000 | 2.48 | 2.06 | |
PSA-N40 | 40 | 250000 | 620000 | 2.48 | 2.13 | |
PSA-N70 | 70 | 242000 | 617000 | 2.55 | 2.31 | |
PSA-N100 | 100 | 259000 | 637000 | 2.45 | 4.66 |
Fig. 7 shows the 180° peel strength results according to the UV dose. The peel strength of photoreactive PSA decreased dramatically due to chemical crosslinking caused by UV irradiation, and the adhesive strength converged to zero as the amount of photoreactive monomer approached 100 mol%. In particular, the decrease in peel strength of NDPM-grafted PSA (N series) was larger than that of AOI-grafted PSA (A series).
Fig. 7 180° peel strength of photoreactive PSA as a function of degree of grafting cured at (a) UV dose of 200 mJ cm−2 and (b) 500 mJ cm−2. The inset shows peel strengths in the range of 40–100 mol%. |
At a UV dose of 200 mJ cm−2, NDPM showed less than half of the peel strength compared to AOI. When 40 mol% NDPM was introduced, the peel strength was decreased to one-fifth of that of AOI-grafted PSA (39.26 vs. 8.40 gf/25 mm). At 500 mJ cm−2, the peel strength decreased faster, and the peel strength approached almost zero at 40 mol% NDPM (2.74 gf/25 mm). This is because NDPM has twice as many photoreactive groups per mole as AOI, so the degree of crosslinking of NDPM-grafted PSA will be higher than that of AOI-grafted PSA even with the same content. Fig. 8 shows the gel fraction of photoreactive PSA grafted with NDPM or AOI as a function of grafting ratio and UV dose. At a high grafting ratio (more than 70%, red box in Fig. 8), the gel fraction of photoreactive PSA was similar irrespective of the photoreactive monomers. However, there was a noticeable difference at a low grafting ratio (less than 40%, blue box in Fig. 8). NDPM induced a higher gel fraction with a relatively smaller amount compared with AOI.
Fig. 8 Gel fraction of photoreactive PSA as a function of the degree of grafting cured at (a) UV doses of 200 mJ cm−2 and (b) 500 mJ cm−2. |
Fig. 8 shows the gel fraction of photoreactive PSA grafted with NDPM or AOI as a function of grafting ratio and UV dose. At a high grafting ratio (more than 70%, red box in Fig. 8), the gel fraction of photoreactive PSA was similar irrespective of the photoreactive monomers. However, there was a noticeable difference at a low grafting ratio (less than 40%, blue box in Fig. 8). NDPM induced a higher gel fraction with a relatively smaller amount compared with AOI.
For a better understanding of UV crosslinking in photoreactive PSA tapes, viscoelastic properties (storage modulus G′, loss modulus Gʺ, tan delta) were measured using 40%-grafted PSA (A40 and N40). Rheological tests of PSA provide a good correlation with adhesion properties.22 Because frequency is inversely proportional to time, G′ measured at low and mid frequencies (0.005–0.5 Hz) at the application temperature is related to tack and shear resistance, and G′ measured at high frequency (102 Hz) is related to peel strength.1 In Fig. 9(a) and (b), after UV irradiation (200 mJ cm−2) on A40 and N40, their moduli (G′, Gʺ) were significantly increased; in particular, N40 showed a greater change. This means that NDPM induced a higher crosslinking density than AOI by UV curing.
After UV curing, N40-200 and A40-200 showed that G′ was higher than Gʺ in all frequency ranges, and the crossover point disappeared, which was observed in N40 and A40. In Fig. 9(c) and (d), tan delta also greatly decreased, which indicates that PSA became elastically dominant, which means that it is closer to a solid rather than a liquid. This also means that PSA loses fluidity, and its wettability is greatly reduced. This is in good agreement with the peel strength results described in Fig. 7.
Fig. 10 shows Chang's viscoelastic window of photoreactive PSAs. This can be drawn based on the G′ and Gʺ measured at 10−2 and 102 Hz and help to characterize the PSA.23 Samples before UV curing were mainly located in Quadrant 3, which was close to the use of removable PSA. After UV curing, the windows of A40 and N40 moved to Quadrant 2, where it has high G′ and Gʺ, and the PSA in this area is suitable for high shear PSA applications. In both samples, it seems that the peel strength decreased due to the decrease in wettability as the modulus increased after UV curing. It is well known that PSA requires wettability for adhesion, and this wettability is rheologically possible when its G′ is less than 3.0 × 105 Pa at 25 °C and 1 Hz (Dahlquist criterion).24 In Fig. 10, the G′ of A40-200 and N40-200 at high frequency (102 Hz), which is correlated with the peel test, exceeded the Dahlquist criterion, so it can be considered that the peel strengths of A40-200 and N40-200 almost disappeared. In particular, N40-200 shows higher G′ and Gʺ changes than A40-200, which again confirms that NDPM is more effective in reducing adhesion than AOI.
Surface residues on the silicon wafer after debonding of PSAs were observed using SEM (Fig. 11). In Fig. 11(a)–(c), Control, A40, and N40 residues remained on the silicon wafer. However, after UV irradiation (200 mJ cm−2), the residues of A40 and N40 were significantly reduced due to UV crosslinking (see Fig. 11(e) and (f)). For a more detailed analysis, SEM-EDS analysis was performed, and the results are displayed in Table 3. Compared to the Control, A40 and N40 showed a similar level of residue (carbon% 10–14). However, after UV irradiation, their carbon% decreased to single digit values. In particular, the carbon% of N40-200 was as low as that of the blank (silicon wafer), which means that N40-200 left almost no residue after debonding.
Fig. 11 SEM images of silicon wafers after debonding of various photoreactive PSAs; (a) silicon wafer (blank), (b) Control, (c) A40, (d) N40, (e) A40-200, and (f) N40-200 (140× magnification). |
Si (%) | C (%) | O (%) | |
---|---|---|---|
Blank (silicon wafer) | 85.49 | 6.20 | 7.44 |
Control | 78.22 | 14.37 | 6.65 |
A40 | 82.81 | 10.11 | 6.36 |
N40 | 78.96 | 12.29 | 6.87 |
A40-200 | 82.81 | 7.71 | 8.61 |
N40-200 | 83.88 | 6.62 | 7.92 |
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