Zhengshang
Wang
a,
Wen
Cui
a,
Hao
Yuan
b,
Xiaoli
Kang
b,
Zhou
Zheng
b,
Longqin
Chen
c,
Qiujun
Hu
d,
Wenbin
Qiu
c,
Jun
Tang
c and
Xudong
Cui
*b
aSichuan Research Center of New Materials, 596 Yinhe Road, Shuangliu, Chengdu 610200, PR China
bInstitute of Chemical Materials, China Academy of Engineering Physics, Mianyang 621900, PR China. E-mail: xudcui@caep.cn; Tel: +86-65726204
cKey Laboratory of Radiation Physics and Technology of Ministry of Education, Institute of Nuclear Science and Technology, Sichuan University, Chengdu 610064, China
dCollege of Physics, Sichuan University, Chengdu 610065, China
First published on 5th July 2022
Correction for ‘Direct ink writing of high-performance Bi2Te3-based thermoelectric materials using quasi-inorganic inks and interface engineering’ by Zhengshang Wang et al., J. Mater. Chem. A, 2022, https://doi.org/10.1039/d2ta02289c.
Fig. 1 (a) Schematic illustration of PAA and PEI binders stabilizing the Bi2Te3-based TE inks. Complex viscosity curves (b) and storage modulus curves (c) of TE inks with various binder contents. |
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