Ghada
El Jamal
*a,
Thomas
Gouder
b,
Rachel
Eloirdi
b,
Evgenia
Tereshina-Chitrova
cd,
Lukáš
Horákd
d and
Mats
Jonsson
a
aSchool of Engineering Sciences in Chemistry, Biotechnology and Health (CBH), Department of Chemistry, Applied Physical Chemistry, KTH Royal Institute of Technology, SE-100 44 Stockholm, Sweden. E-mail: ghadaej@kth.se
bEuropean Commission, Joint Research Centre, Postfach 2340, DE-76215 Karlsruhe, Germany
cInstitute of Physics, ASCR, Prague, Czech Republic
dFaculty of Mathematics and Physics, Charles University, 12116 Prague, Czech Republic
First published on 1st July 2021
X-ray photoelectron spectroscopy (XPS) has been used to study the effect of mixed H2O/H2 gas plasma on the surfaces of UO2, U2O5 and UO3 thin films at 400 °C. The experiments were performed in situ under ultra-high vacuum conditions. Deconvolution of the U4f7/2 peaks into U(IV), U(V) and U(VI) components revealed the surface composition of the films after 10 min plasma exposure as a function of H2 concentration in the feed gas of the plasma. Some selected films (unexposed and exposed) were also analysed using grazing-incidence X-ray diffraction (GIXRD). The XPS results show that U(V) is formed as a major product upon 10 minutes exposure of UO3 by a mixed H2O/H2 plasma in a fairly wide H2 concentration range. When starting with U(V) (U2O5), rather high H2 concentrations are needed to reduce U(V) to U(IV) in 10 minutes. In the plasma induced oxidation of UO2, U(V) is never observed as a major product after 10 minutes and it would seem that once U(V) is formed in the oxidation of UO2 it is rapidly oxidized further to U(VI). The grazing incidence X-ray diffraction analysis shows that there is a considerable impact of the plasma and heating conditions on the crystal structure of the films in line with the change of the oxidation state. This structural difference is proposed to be the main kinetic barrier for plasma induced transfer between U(IV) and U(V) in both directions.
As dissolution and precipitation of secondary phases occur in parallel with the redox processes, it is difficult to draw reliable mechanistic conclusions for the individual processes from experiments performed in solution. To circumvent this problem, we have recently developed an approach to simulate the radiolysis by a vacuum ECR (electron cyclotron resonance) water plasma (the products are to a large extent the same as the aqueous radiolysis products) to which we expose uranium oxide model films. In situ X-ray photoelectron spectroscopy (XPS) analysis was used to monitor the evolution of the freshly reacted surfaces, without interference of laboratory atmosphere, dissolution or precipitation reactions. Our previous work using this methodology has shown that a pure water plasma oxidizes UO2 and U2O5 (U(V)) to UO3 (U(VI)). In a series of exposures of UO2 films to the water plasma for different times we could evaluate the dynamics of the process. The results showed that UO2 is initially oxidized to U(V) and U(VI) and the latter becomes the major product after 10–15 minutes exposure. For longer exposures, U(VI) is slowly reduced back to U(V). These findings were discussed in detail and a simple kinetic model was developed to describe the dynamics of the process.27 While we have previously only used this methodology for exposures to pure water plasma,28 we have extended in the present study the experimental conditions by using a mixed H2O/H2 plasma.
The use of a mixed H2O/H2 plasma does not simply mimic the impact of H2 on water radiolysis since, in water radiolysis, the radiation energy is completely absorbed by water and H2 only reacts with the aqueous radiolysis products. In the mixed plasma, the plasma is generated both from H2O and H2 and the products may react with each other inside the plasma generator, while outside the plasma generator the pressure is too low to allow bimolecular processes before the plasma products reach the oxide surface. The use of a mixed H2O/H2 plasma enables fine-tuning of the redox properties of the plasma, which opens up the possibility for more detailed studies of the redox chemistry of uranium oxide films under UHV conditions.
In this work, we have exposed UO2, U2O5 and UO3 films to mixed H2O/H2 plasmas and analysed the films after 10 min plasma exposure using XPS complemented by grazing-incidence x-ray diffraction (GIXRD). The results are discussed in terms of intrinsic kinetic barriers for the transfer between different oxidation states.
More details about the ECR source and different gas plasma characterization methods with a RGA-Mass spectrometer are reported in a previous study.29
In this paper, we perform all plasma exposures for 10 min and at a sample temperature of 400 °C. Based on that found in the previous studies, the plasma-induced reactions are well advanced but not necessarily complete after 10 min. Nevertheless, the use of a common exposure time for all oxides and plasma compositions allows direct comparison of the results.
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Fig. 1 Pressures of molecular products in a mixed H2O/H2 plasma in a system where the H2 pressure in the plasma generator is first stepwise increased and thereafter stepwise decreased. |
Before the plasma is switched on and while the plasma chamber is loaded with pure H2O, only water is detected. When the plasma is switched on the water signal decreases and H2 and O2 are also detected. These two products originate from the recombination of H atoms and O atoms, respectively. Both H atoms and O atoms are produced in a water plasma (in addition to hydroxyl radicals). After 200 s, H2 is added to the plasma chamber with a relatively low partial pressure(I). The immediate response of the system is a slight decrease in the O2 pressure, a slight increase in the H2 pressure and a significant increase in the H2O pressure. After 250 s the partial pressure of H2 is increased for the second time (II). The immediate response is a further decrease in the O2 pressure, an increase in the H2 pressure and a rapid initial increase in the H2O pressure followed by an even larger drop in the pressure. This pattern is reproduced, although with a smaller initial increase and the following decrease in the H2O pressure for the following three incremental steps in the H2 pressure (III, IV, and V). The transient behaviour of H2O could partly be due to a slow response of the system when the H2 pressure is increased. After the third incremental increase in the H2 pressure, the O2 pressure is insignificant. The H2 supply is thereafter reduced in three steps (VI, VII, and VIII) and the system gradually recovers from the impact of H2 in the plasma generator. The decrease in the O2 pressure with increasing H2 pressure is partly due to the direct reaction between the O atom and H2 producing water, and the reaction between the O atom and the H atom producing hydroxyl radical. The gradual increase in the H2 pressure will also have an impact on the energy deposition in the plasma, and as the H2 pressure increases the primary production of the water plasma products will decrease. The consequence of this is that the oxidant concentration decreases both in absolute and relative terms with increasing H2 pressure. When increasing the H2 fraction in the plasma chamber of a mixed H2O/H2 plasma, the plasma changes from containing both oxidants and reductants to a purely reducing plasma.
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Fig. 2 U4f core level X-ray photoemission spectra of uranium recorded for the precursor UO2 film and for the UO2 films exposed to pure water plasma and a mixed gas plasma of water and hydrogen. |
Besides the main lines, a convenient indicator of the oxidation state is the satellites on the high binding energy side. Although their intensities are much lower compared to the main lines, they can much better resolve individual species. In Fig. 2 (right), when the UO2 film is exposed to a pure water plasma, the typical satellite peak of U(VI) appears. With increasing H2 concentration up to 10% (hereafter referred to as 10% H2 in the H2O/H2 mixed plasma) in the mixed gas plasma, it is gradually replaced by the U(V) satellite peak. At 20% H2 in a mixed plasma, the satellite peak of U(IV) is finally formed. These data consistently show a decreasing oxidation power of the water plasma with increasing H2 content.
The valence band spectra and O1s peaks of the plasma-exposed UO2 films are plotted in Fig. 3. Regardless of the H2 concentration, the intensity of the U5f peak originally present at 1.2 eV below the Fermi level decreases after the exposure. We have previously concluded that the loss of the U5f intensity is due to the occupancy of the 5f states decreasing with uranium oxidation (nominally 2 for U(IV), 1 for U(V) and 0 for U(VI)).30 The intensity loss is strongest for the pure water plasma exposure, pointing to strong oxidation (close to U(VI)). Even when the H2 concentration in the plasma feed gas is as low as 3%, the U5f intensity is much higher compared to the peak observed for the pure water plasma exposure. At 20% H2, the intensity is almost the same as for the unexposed film. This shows that the oxidizing effect of the water plasma is suppressed by hydrogen, up to the point that practically no oxidation takes place at 20% H2. In Fig. 3c the U5f bands are normalized to the same height and shifted to the same lower binding energy side for easier comparison. The spectra can be divided into two groups. One group contains broad peaks and is observed for the untreated and 20% H2 in the H2O/H2 mixed plasma films. The other group has narrow peaks and is observed for all other plasma processed films. The different peak widths are attributed to the different 5f counts, leading to different final state multiplets: the broad shape corresponds to the 5f2 ground state of U(IV) while the narrow peak corresponds to the 5f1 ground state of U(V). This shows that for the 0, 3, and 10% H2 treated films, UO2 is oxidized into a mixture of U(V) (giving 5f1) and U(VI) (giving no peaks at all because of the 5f0 configuration). The result is a pure 5f1 signal. For 20% H2 in a mixed plasma almost no oxidation takes place and the pure 5f2 is observed, just as for the untreated film. All the plasma treated films have a featureless and broad O2p band (dominating the valence band spectra in the energy range 3–7 eV), except the one exposed to the 20% H2 in a mixed plasma, which exhibits the same two-peak shape and low intensity as UO2 (observed for the untreated films).
The observed evolution of the U oxidation state is corroborated by the O1s spectra for different treatment conditions (Fig. 3b). The O1s signal of the original UO2 film lies at 530.1 eV. When the film is exposed to a pure H2 plasma under the conditions used in this work, the resulting XPS spectra are identical to UO2, proving that the oxide is unchanged. After exposure to the pure water plasma, the O1s signal strongly broadens and shifts towards the lower binding energy, as expected for UO3. Moreover, it acquires the shape typical of UO3.30 The broadening is attributed to the crystal structure of UO3, having inequivalent oxygen atoms (in contrast to UO2). With increasing hydrogen concentration, the broadening becomes less pronounced. The O1s peak width after exposure to 10% H2 in mixed plasma is between the O1s peak widths observed for UO3 and UO2. This is typical of U2O5, as shown previously.30 The sample exposed to 20% H2 in mixed plasma has an O1s peak of the same width as the original UO2, but only slightly shifted to the lower binding energy (by – 0.3 eV).
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Fig. 4 U4f core level XPS spectra recorded for the precursor UO3 film and the films with plasma treatment. |
It was shown previously that UO3 is prone to reduction when exposed to pure water plasma.28 This was attributed to the atomic hydrogen, also being present in the pure water plasma. The effect is, though, very weak and longer exposure times than used in the present study are needed (30–60 min (ref. 27)) to observe partial reduction of U(VI) into U(V). For mixed H2O/H2 plasma, the reduction becomes more pronounced.
The U4f peaks shift to lower binding energy and broaden: the U(V) component grows at the expense of the U(VI) component at higher BE. After exposure to 20% H2 in a mixed plasma the U(VI) component is still the dominating peak, while after exposure to 50% H2 in a mixed plasma the U(V) peak becomes the most prominent one. After exposure to the 20% H2 in a mixed plasma, the satellite peak of U(V) appears. For exposures to 30% H2 or higher H2 concentration, the U(V) satellite completely replaces the U(VI) satellite (data not shown). For the sake of clarity, we only plotted the result for the film exposed to 50% H2 in a mixed plasma.
At still higher H2 concentrations, the surface is further reduced and the U(IV) satellite appears. However the reduction is not complete even for 90% H2, and a residual U(V) satellite remains. It is only when the UO3 film is exposed to a pure H2 plasma that it is fully reduced to U(IV).
The valence band and O1s spectra for the UO3 films exposed to mixed H2O/H2 plasmas are plotted in Fig. 5. From these spectral features it is, as expected, evident that the degree of reduction increases with increasing H2 content of the mixed plasma. The O2p band loses its broad symmetrical shape, decreases in intensity and eventually takes the two-peak shape of UO2 (Fig. 3) after exposure to a mixed plasma containing 90% H2. In addition, the U5f peak increases in intensity due to the enhanced 5f population (n5f) after the reduction of U(VI) to U(V) and then U(IV) (n5f = 0, 1 and 2, respectively). After exposure of pure UO3 to the mixed plasma the O1s signal is identical to the signal before exposure. With increasing H2 concentration, the O1s peak narrows and shifts towards higher binding energies. The exposure to 30% H2 in a mixed plasma (not shown) yields a similar O1s spectrum for the 50% H2 in a mixed plasma. This is attributed to the presence of an intermediate oxidation state (U(V)), stable over an extended range of reducing conditions. It is only when UO3 is exposed to 90% H2 in a mixed plasma that the peak narrows even more and takes the shape typical of UO2.
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Fig. 5 a) Valence band and b) O1s core level XPS spectra for the precursor and plasma treated UO3 films. |
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Fig. 6 U4f core level XPS spectra recorded for the original U2O5 film and U2O5 films exposed to plasma with variable H2O–H2 composition. |
The effect of plasma exposure is also evident in Fig. 7 where the XPS survey spectra of the valence band and the O1s peak of each exposed sample are presented. As discussed previously,28 after the oxidation of U2O5 with the water plasma, the intensity of the U5f peak at 1.2 eV decreases without changing its width, which implies that the product after plasma exposure is a mixture of U(V) and U(VI). U(V) gives the 5f1 signal while U(VI) has no 5f emission at all. U(V) can either oxidize or reduce, depending on the redox potential of the environment. With increasing H2 concentration, the reduction in the U5f intensity is much less pronounced than for the water plasma, which implies that U2O5 is less oxidized. Upon exposure to mixed plasmas with 50% or more H2, the U5f line grows and the O2p band loses its broad shape and becomes similar to the characteristic spectrum of UO2. U2O5 is clearly reduced under such conditions.
Fig. 7 also shows that the O1s peak of U2O5 becomes broader after exposure to the water plasma and shifts to lower binding energy. As discussed above, this indicates the oxidation of U2O5 into UO3. After exposure to 20% H2 in a mixed plasma the peak is slightly narrower. After exposure to 40% H2 in a mixed plasma, the O1s line becomes again narrower and superimposes to the original peak of U2O5, showing that the film does not react at all. For plasma containing 50–80% H2, the O1s peak narrows even more and shifts to higher binding energy, characteristic of UO2.
The relative fractions of U(IV), U(V) and U(VI) after 10 minutes exposure to a mixed H2O/H2 plasma as a function of H2 concentration in the plasma feeding gas provides interesting information on the uranium oxide and mixed plasma system. UO2 is shown to be oxidized by the mixed plasma provided the H2 content is below 40%. In other words, 40% H2 is sufficient to suppress oxidation by increasing the reduction rate of U(V) at the surface, in combination with decreasing the rate of U(IV) oxidation (through increasing the flux of reductants and decreasing the flux of oxidants as seen in Fig. 1).
For UO3 it is obvious that reduction in the 10 min time scale occurs only in presence of H2. In general, the rate and extent of reduction appear to be increasing with increasing H2 concentration up to 30%. Between 30 and 70% H2 the major product is U(V) and the extent of reduction appears to be concentration independent. At around 90% H2, reduction proceeds all the way to U(IV) which becomes the major product.
As can be seen, the oxidation of UO2 and the reduction of UO3 proceed via the formation of U(V). Interestingly, U(V) (U2O5) is quantitatively reduced to U(IV) at an H2 concentration of 50% and higher, while it is oxidized to U(VI) at an H2 concentration from around 40% and lower. The rate and extent of the oxidation reaction within the 10 min time scale increase with decreasing H2 concentration.
The fact that U(V) is never a major product after 10 min of UO2 oxidation while the reduction of UO3 involves U(V) as the major product in a wide H2 concentration range provides interesting information about the kinetics of the processes. As described above, long-term exposure of UO2 to a pure water plasma initially leads to oxidation affording U(V) and U(VI). After reaching a state of almost pure U(VI), prolonged exposure leads to the slow formation of U(V). Interestingly, UPS data (not shown here) being more surface sensitive than XPS reveal the formation of U(V) and U(VI) during the initial oxidation of UO2, but the slow formation of U(V) from U(VI) could never be confirmed by this method. Therefore, it was concluded that the U(V) formed upon reduction of U(VI) was formed deeper in the film and thereby displayed a lower reactivity towards the water plasma constituents. The present XPS data corroborate this hypothesis since the reduction of UO3 mainly yields U(V) in a very wide H2 concentration range and proceeds to U(IV) only at around 90% H2. At the same time, U2O5 exposed to mixed plasma is quantitatively already converted to U(IV) at 50% H2, i.e., at a considerably lower reducing power.
Oxidation of UO2 by the water plasma for 10 min (pattern C) shows that the UO2 concentration decreased substantially at a lower intensity peak at 28.04° in 2θ, while a new and highly textured phase is formed and characterized by a strong intensity peak at 21.48°. This peak could be assigned to cubic UO337 whose Bragg positions are reported in the figure for comparison but it could be also linked to δ-U2O5,34 α-U3O835 or β-U3O8.38 The limited number of Bragg peaks and their low intensities prevents us from unambiguous identification of the crystal structure type. As suggested by the XPS-UPS results and in agreement with the XRD analysis, sample C is not pure and contains at least 2 phases of which only the cubic structure expected of UO2 can be clearly identified.
As has been shown in the spectral analysis above and in the tentative deconvolution, U(V) is formed as a major product upon the 10 min exposure of UO3 to a mixed H2O/H2 plasma in a fairly wide H2 concentration range. When starting with U(V) (U2O5) it is evident that fairly high H2 concentrations are needed to reduce U(V) to U(IV) in 10 min. In the plasma induced oxidation of UO2, U(V) is never observed as a major product after 10 min and it seems that once U(V) is formed in the oxidation of UO2, it is oxidized further to U(VI). One possible explanation may be that compounds containing U(V) and U(VI) have similar crystal structures: UO3, U3O8 (a mixed oxide with 66% U(V) and 33% U(VI)) and U2O5 (pure U(V) oxide) all exist in a layered structure (see the additional material), while U(IV) mostly exists in a cubic (fluorite) structure.31–33 Because of the similarity in the crystal structure, reduction of UO3 to U3O8 then to U2O5 does not require any major structure reorganization. However, when oxidizing UO2 to U2O5 a major structural transformation is required. This is also the case when reducing U(V) to U(IV). This would partly explain why the reduction of UO3 with mixed H2 in a mixed plasma appears to have U(V) as the major product after 10 min exposure within a wide range of H2 concentrations and why fairly high H2 concentrations are needed to reduce U2O5 to U(IV) within 10 min. The kinetic limitations would also account for the fact that U(V) is never observed as the major product in plasma induced oxidation of UO2. Given the fairly short exposure times used in this work, we can only rationalize the structural reorganization in terms of a kinetic barrier.
The XPS results show that U(V) is formed as a major product upon exposure of UO3 to a mixed H2O/H2 plasma in a fairly wide H2 concentration range. When starting with U(V) (U2O5) appreciable H2 concentrations are needed to reduce U(V) to U(IV) in 10 minutes. In the plasma induced oxidation of UO2, U(V) is never observed as a major product after 10 min and it would seem that once U(V) is formed during the oxidation of UO2 it is rapidly oxidized further to U(VI). Formation of U(V) is easier, obtained by the reduction of UO3 by a mixed H2O/H2 plasma. It could not be prepared by the oxidation of UO2 with the water plasma. Once U(V) is obtained from the UO3 reduction, it is relatively stable as it shows lower reactivity than UO2 for oxidation and UO3 for reduction. The grazing incidence X-ray diffraction analysis shows that there is a considerable impact of the plasma and heating conditions on the crystallographic structure of the films in line with the change of the oxidation state. This structural difference may be the main kinetic barrier for plasma induced transfer between U(IV) and U(V) in both directions. Further characterisation by micro-Raman spectroscopy and transmission electron microscopy would be helpful to identify different types of uranium oxides present on the substrate.
Footnote |
† Electronic supplementary information (ESI) available. See DOI: 10.1039/d1dt01020d |
This journal is © The Royal Society of Chemistry 2021 |