Ming
Hu
*a and
Zhonghua
Yang
ab
aDepartment of Mechanical Engineering, University of South Carolina, Columbia, SC 29201, USA. E-mail: hu@sc.edu
bSchool of Architecture and Civil Engineering, Shenyang University of Technology, Shenyang, 110870, China
First published on 26th February 2021
Correction for ‘Perspective on multi-scale simulation of thermal transport in solids and interfaces’ by Ming Hu et al., Phys. Chem. Chem. Phys., 2021, 23, 1785–1801, DOI: 10.1039/D0CP03372C.
This research is also partially supported by the NASA SC Space Grant Consortium REAP Program (Award No.: 521179-RP-SC005).
The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.
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