Open Access Article
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Correction: Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance
Hongyu
Tang
ab,
Zuopeng
Qu
*c,
Lei
Wang
c,
Huaiyu
Ye
*de,
Xuejun
Fan
f and
Guoqi
Zhang
*a
aDepartment of Microelectronics, Faculty of Electronic, Mathematics and Information, Delft University of Technology, Delft 2628 CT, The Netherlands. E-mail: G.Q.Zhang@tudelft.nl
bChangzhou Institute of Technology Research for Solid State Lighting, Changzhou, 213161, China
cSchool of Renewable Energy, North China Electric Power University, Beijing, 102206, China. E-mail: z.qu@ncepu.edu.cn
dSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China. E-mail: yehy@sustech.edu.cn
eShenzhen Institute of Wide-bandgap Semiconductors, Shenzhen 518055, Guangdong, China
fDepartment of Mechanical Engineering, Lamar University, Beaumont, TX, USA
First published on 20th May 2020
Abstract
Correction for ‘Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance’ by Hongyu Tang et al., Phys. Chem. Chem. Phys., 2019, 21, 18179–18187, DOI: 10.1039/C9CP03381E.
The authors would like to correct one of the funding numbers provided in the published article from “No. 2019B010126001” to “No. 2019B010131001”.
The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.
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