Chandramouli
Subramaniam
*a,
Yuzuri
Yasuda
a,
Satoshi
Takeya
b,
Seisuke
Ata
ac,
Ayumi
Nishizawa
a,
Don
Futaba
ac,
Takeo
Yamada
ac and
Kenji
Hata
*ac
aTechnology Research Association for Single wall Carbon Nanotubes (TASC), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan. E-mail: chandramouli-subramaniam@aist.go.jp
bResearch Institute of Instrumentation Frontier (RIIF), National Institute of Advanced Industrial Science and Technology (AIST), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan
cNanotube Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan. E-mail: kenji-hata@aist.go.jp
First published on 15th January 2019
Correction for ‘Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics’ by Chandramouli Subramaniam and Kenji Hata et al., Nanoscale, 2014, 6, 2669–2674.
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Fig. 1 DSC profiles of the CNT-Cu composite (blue), aluminum pan (red) and sapphire (black), employed to estimate the specific heat capacity of the CNT-Cu composite. |
Accordingly, the specific heat capacity of CNT-Cu (CCNT-Cup) is estimated to be 575 J kg−1 K−1 at 30 °C.
The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.
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