Hao Tangab,
Kunpeng Douc,
Yucheng Xiongab,
Feng Wangd,
Yang Zhaoe,
Xiaomeng Wangab,
Qiang Fuab,
Juekuan Yange,
Ni Zhaod and
Dongyan Xu
*ab
aDepartment of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong Special Administrative Region, China. E-mail: dyxu@mae.cuhk.edu.hk
bShenzhen Research Institute, The Chinese University of Hong Kong, Shenzhen, 518057, China
cResearch Center for Applied Sciences, Academia Sinica, Taipei 11529, Taiwan
dDepartment of Electronic Engineering, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong Special Administrative Region, China
eSchool of Mechanical Engineering, Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University, Nanjing, 211189, China
First published on 11th July 2016
In this work, fullerene (C60) nanorods were prepared by a surfactant-assisted self-assembly method. Although the orientation of molecular alignment remains unchanged from one end to the other end in these C60 nanorods, they cannot be rigorously treated as single crystals because of the existence of amorphous-like regions formed by a high density of defects such as stacking faults and vacancy clusters. The partially crystalline and partially amorphous structure results in unusual thermal transport behavior in C60 nanorods, which cannot be classified into either typical crystalline-like or typical glass-like behavior. The thermal resistances of the C60 nanorods decrease with increasing temperature and reach a plateau around 100 K, which can be attributed to the combined effect of Einstein localized vibration in C60 molecules, intracluster vibration, and phonon-defect scattering. Accompanied with depositing Pt/C composites at two ends of a C60 nanorod to improve thermal contact between Pt electrodes and the C60 nanorod, tensile strain may be introduced in the C60 nanorod due to contraction, which enhances thermal resistance, especially in the low temperature range. Ultralow thermal conductivity (less than 0.06 W m−1 K−1) is observed for self-assembled C60 nanorods at room temperature, which is significantly lower than the thermal conductivity of bulk C60 single crystals and polycrystalline C60/C70 compacts but on the same order of magnitude as the lower limit of thermal conductivity of amorphous carbon.
Carbon materials, which form a variety of allotropes and derivatives, are unique in terms of their ability to conduct heat with the room-temperature thermal conductivity spanning five orders of magnitude, i.e., about 4000–5000 W m−1 K−1 in free-standing graphene,6,7 3000–3500 W m−1 K−1 in single-walled carbon nanotubes,8,9 about 2000 W m−1 K−1 in diamond,10 and 0.02–0.2 W m−1 K−1 in amorphous carbon.11 Fullerene (C60) is discovered as the third stable allotrope of carbon after diamond and graphite, which is entirely composed of carbon atoms and has a ball-shaped structure with a diameter of about 0.7 to 1.0 nm.12 Thermal conductivity of single C60 molecules is still unknown since C60 molecules are zero-dimensional materials and it is experimentally challenging to measure their thermal properties. Bulk single crystals of C60 molecules have been prepared via a sublimation–recrystallization method and their thermal conductivity demonstrates typical crystalline-like behavior, which means that thermal conductivity decreases with increasing temperature from 30 K to 300 K due to phonon Umklapp scattering.13 By contrast, polycrystalline C60/C70 compacts, prepared by directly compacting C60 and C70 powders at 3000 atm, show the glass-like thermal transport behavior, which means that thermal conductivity shows no temperature dependence above 10 K since only localized vibrations of rigid molecules contribute to thermal transport.14
Recently, there is a great interest to synthesize one-dimensional C60 nanorods via a surfactant-triggered self-assembly method for their potential applications in nanoelectronic and photoelectronic devices.15,16 It is fundamentally important to understand thermal transport in C60 nanorods in order to enhance the performance and stability of electronic devices. In this work, we prepared self-assembled C60 nanorods and carried out mesoscopic thermal transport measurements of individual C60 nanorods through a suspended thermal bridge method. Unusual thermal transport behavior is observed in self-assembled C60 nanorods, which is different from those in bulk single crystals of C60 molecules13 and polycrystalline C60/C70 compacts,14 due to their unique structures.
Thermal conductivity of individual C60 nanorods was measured by using a suspended thermal bridge method in a cryostat from 20 K to 300 K. The details of the measurement technique can be found in the literature.18 In brief, a microfabricated device consisting of two suspended silicon nitride membranes is used for thermal conductivity characterization. The scanning electron microscopy (SEM) image of a suspended device is shown in Fig. S1 (ESI†). Two membranes are separated by several microns and serve as heat source and heat sink, respectively, in the measurement. A platinum (Pt) coil and a Pt electrode with a thickness of 50 nm are patterned on each membrane. The Pt coil serves as a heater to increase the temperature of the suspended membrane (heat source), as well as a resistance thermometer to measure the temperature of each suspended membrane (heat source or heat sink). The Pt electrode is designed to have a large width of 3 μm, which is beneficial for thermal conductivity measurement of one-dimensional nanostructures due to a large contact area between the nanostructure and the electrode. An individual C60 nanorod was placed bridging two membranes by using a micromanipulator. Following a previous report,19 we introduced a Wheatstone bridge into the circuit at the sensing side to reduce the effect of temperature fluctuation of the cryostat on thermal conductivity measurement. The diameter of the C60 nanorod and its suspended length between two Pt electrodes were measured from the SEM image.
It is well-known that thermal transport in hard solids is rooted in materials' structure and can be classified as crystalline-like or amorphous-like behavior. In crystalline solids, atoms vibrate collectively as elastic waves which dominate thermal transport.21 The bulk C60 single crystals prepared by a sublimation–recrystallization method are believed to have a relatively high degree of order in the alignment of C60 molecules, which is confirmed by their crystalline-like thermal transport behavior, i.e., thermal resistance showing increasing trend with the increase of temperature.13 However, in amorphous solids or disordered crystals, heat is transported in a random walk among harmonically coupled localized oscillators, which are assumed to vibrate with random phases.22 Previous studies on C60 solids13,14 have confirmed that from 10 K to 40 K, vibrational motions of rigid buckyball molecules (localized excitations) dominate thermal transport; while above 40 K, intracluster vibrations (surface modes) gradually appear and dominate thermal transport. The polycrystalline C60/C70 compacts, prepared by directly compacting C60 and C70 powders at 3000 atm, should have a low degree of order in the alignment of building blocks, which is confirmed by their glass-like thermal transport behavior, i.e., thermal resistance showing temperature independence above 10 K.14 Their thermal transport behavior indicates that only localized vibrations of rigid molecules contribute to thermal transport in C60/C70 compacts, while surface modes play insignificant role.
The measured thermal resistance of the C60 nanorod (Sample 1) indicates that, vibrational motions of rigid buckyball molecules (localized excitations) contribute to thermal transport in the C60 nanorod below 40 K, while intracluster vibrations (surface modes) contribute to thermal transport above 40 K. The unique thermal transport behavior results from the coexistence of amorphous and crystalline structures in the C60 nanorod: (1) from 20 K to 40 K, thermal resistance mainly comes from Einstein localized oscillators in amorphous regions; (2) above 40 K, thermal resistance is mainly caused by intracluster scattering in crystalline regions; (3) the combination of these two features results in the absence of an obvious peak in the thermal resistance curve (Fig. 3(c)). The temperature independence of thermal resistance above 100 K results from the phonon-defect scattering, which dominates over phonon Umklapp scattering in the temperature range from 100 K to 360 K. The defects here refer to stacking faults and vacancies in crystalline regions, as well as interfaces between amorphous and crystalline regions. The abrupt change of thermal resistance associated with the transition from the torsional vibration to nearly free rotation in C60 single crystals at 260 K (ref. 13) is not observed, which indicates that the degree of disorder in the nanorod is large enough to quench the transition.
It should be noted that the measured thermal resistance consists of two parts: the intrinsic thermal resistance of the C60 nanorod and the contact thermal resistance between the nanorod and Pt electrodes. To minimize the contact thermal resistance, Pt/C composites are deposited at contacts between the nanorod and Pt electrodes by electron beam induced deposition (EBID) as shown in Fig. 3(b). As seen in Fig. 3(c), temperature dependence of thermal resistance shows a similar trend before and after the deposition of Pt/C composites. At 300 K, the total thermal resistance after EBID is reduced by 16% compared to the value before EBID.
It is also observed that two measured thermal resistance curves intersect with each other at 50 K and the thermal resistance measured after EBID at 20 K is 10% higher than the counterpart measured before EBID. A similar phenomenon is observed for the other nanorod (Sample 2) as shown in Fig. S2.† If the deposition of Pt/C composites only reduces contact thermal resistance, we would expect that the thermal resistance measured after EBID is lower than that measured before EBID for the whole measurement temperature range. The intersecting thermal resistances we observed indicate that the deposition of Pt/C composites might induce some other effects in the C60 nanorod in addition to the reduction of contact thermal resistance. Since compositions of Pt/C composites are similar to Pt electrodes and the C60 nanorod, it is reasonable to assume that Pt/C composites will not significantly change the nature of the contact interface. On the other hand, we notice that the measured suspended lengths before and after EBID are very close to each other (with less than 1% difference). We hypothesize that the higher thermal resistance after EBID at low temperature might be due to the effect of contraction. C60 molecules will contract with the decrease of temperature,23 which in turn will result in the contraction of the C60 nanorod. Before EBID, two ends of the nanorod are loosely placed on the suspended device, so no strain will be introduced with the decrease of temperature. However, after EBID, two ends of the nanorod are fixed onto the suspended device by Pt/C composites, which will hinder contraction and induce tensile stress in the C60 nanorod. The induced tensile stress will affect thermal transport in the C60 nanorod since both stiffness and lattice anharmonicity will vary with strain and thus phonon velocity and mean free path will be changed.24 The tensile strain could increase thermal resistance of the C60 nanorod by: (1) softening phonon modes and reducing velocities of phonons for both Einstein localized oscillator modes (vibrational motions of rigid buckyball molecules) and surface modes (intracluster vibrations);24–26 (2) decreasing the specific heat of each propagating phonon mode;24–26 and (3) inducing defects to reduce phonon coupling. As an example, the van der Waals interactions between neighboring C60 molecules could be broken and as a result thermal resistance will be enhanced.
| Sample | Diameter (nm) | Suspended length (μm) | Thermal conductivity at 300 K (W m−1 K−1) |
|---|---|---|---|
| 1 | 743 | 6.4 | 0.019 |
| 2 | 562 | 7.3 | 0.025 |
| 3 | 578 | 7.5 | 0.027 |
| 4 | 788 | 8.0 | 0.054 |
Footnote |
| † Electronic supplementary information (ESI) available. See DOI: 10.1039/c6ra14042d |
| This journal is © The Royal Society of Chemistry 2016 |