W. T.
Ruane
*a,
K. M.
Johansen
b,
K. D.
Leedy
c,
D. C.
Look
cd,
H.
von Wenckstern
e,
M.
Grundmann
e,
G. C.
Farlow
f and
L. J.
Brillson
g
aDepartment of Physics, The Ohio State University, Columbus, Ohio 43210, USA. E-mail: ruane.3@osu.edu
bUniversity of Oslo, Centre for Materials Science and Nanotechnology, 0318 Oslo, Norway
cAir Force Research Laboratory, Sensors Directorate, WPAFB, OH 45433, USA
dSemiconductor Research Center, Wright State University, Dayton, OH 45435, USA
eInstitut für Experimentelle Physik II, Universität Leipzig, Linnéstr. 5, 04103 Leipzig, Germany
fDepartment of Physics, Wright State University, Dayton, OH 45435, USA
gDepartment of Physics and Department of Electrical & Computer Engineering, The Ohio State University, Columbus, OH 43210, USA
First published on 11th March 2016
The spatial distribution of defect related deep band emission has been studied in zinc oxide (ZnO) nano- and microwires using depth resolved cathodoluminescence spectroscopy (DRCLS) in a hyperspectral imaging (HSI) mode within a UHV scanning electron microscope (SEM). Three sets of wires were examined that had been grown by pulsed laser deposition or vapor transport methods and ranged in diameter from 200 nm–2.7 μm. This data was analyzed by developing a 3D DRCLS simulation and using it to estimate the segregation depth and decay profile of the near surface defects. We observed different dominant defects from each growth process as well as diameter-dependent defect segregation behavior.
Previous studies on defect distribution in ZnO wires have reported defect segregation where defects are located at or near the nanowire surfaces.12–15 CL spectra of microwires grown by pulsed laser deposition (PLD) on sapphire displayed impurity emissions near the surface on a submicron scale in cross section.14 Transport and photoluminescence (PL) studies of similar nanowires with diameters ranging from 0.1 to 7.5 μm supported a core–shell model and showed that intentional Al doping could decrease resistivity by two orders of magnitude.15 Shalish et al.12 used PL to study sets of different diameter (50 nm–300 nm) nanowires and observed a linear increase in the ratio of the near band edge to green band defect (Inbe/Igb) peak intensities with increasing diameter. This increase was attributed to high defect densities at the surface of the wires and that holes within 30 nm of the surface would diffuse and recombine there. Xue et al.13 used spatially resolved cathodoluminescence across a 180 nm diameter nanowire. These data were analyzed using a constant-density core–shell model, consisting of a high defect density shell and a lower defect density core. The thickness of the shell was estimated at 5–6 nm.
The direct approach to obtain the defect distribution of the cross section of a wire is to cut the wire and measure across the resulting plane. However, this process will damage the wire and can distort the intended measurement in terms of altered strain, shape, defect distribution, and density. Furthermore, it is not suitable for in situ characterization. Thus there is a need for a non-destructive method to extract the depth dependent information.
In our study, nano- and microwires grown by a variety of methods were measured by DRCLS, in hyperspectral mode, across the outside walls of the wires. To reconstruct the spatial defect variation along the cross section of the wire, a 3D DRCLS simulation and defect model was developed. The results reveal segregation of defects towards the surface, and both the defect distribution profile and segregation depth have been extracted.
The measurements in this study were performed on a JEOL 7800f UHV SEM which has been modified for cathodoluminescence. We use an Oxford MonoCL monochromator outfitted with a Gatan grating (150 lines per mm and blaze wavelength of 500 nm) and an Andor Newton CCD camera. This setup allowed us to capture hyperspectral images (HSI) by using a DAC card to control the SEM beam location with special software (CHIMP).17 Each HSI consists of a 2D rectangular array of cathodoluminescence spectra, where each point in the array corresponds to a spatial location on the sample that the electron beam dwells on for a fixed time. All measurements were taken at a temperature of 80 K.
The hyperspectral images were captured using an electron beam energy of 5 keV on a variety of wires from each sample set. This probe energy was chosen because it struck a good balance between high signal counts and good spatial resolution, allowing for high density HSI's to be captured in a reasonable amount of time. Although most SEMs have a spot-size on the order of a few nanometers, higher beam energy results in larger generation volumes of e–h pairs under the surface. This reduces the spatial resolution of the CL measurement.
The three sets of ZnO wires varied in growth method, size, and type of defects. Wire set A was grown by PLD and had a hexagonal prism geometry ranging in diameter from 100 nm–10 μm. Many of these wires were quite long (>100 μm) and straight. Set B was grown using CVD and consisted of needle-shaped wires and larger hexagonal prism shaped wires (400 nm–2 μm in diameter). These wires were shorter than set A, usually <10 μm. Set C was grown by PLD by using a target consisting of ZnO:
Ga2O3/99
:
1wt%. The wires from set C were approximately 2 μm in length and 200 nm in diameter. Their width was too small to acquire detailed enough DRCLS HSI line-scans needed for an analysis of their spatial defect distribution.
We modeled the defect distribution as a function defined within a hexagonal prism with the origin of the coordinate system at the center of the hexagon. The x-axis lies parallel to the plane of the sample holder, the y-axis is parallel to the wire's c-axis, and the z-axis’ direction points toward the collection mirror above the wire. The cross section of the prism is a regular hexagon whose geometrical parameters (Fig. 1(a)), r (radius) & θ (tilt angle), can be extracted from a secondary electron image (SEI). This can be done by measuring the distance between the vertices, as viewed from above, and using some basic geometry (see the ESI† for more details). The value of the defect density at a point is determined by a piecewise function defined in two regions we refer to as the segregation region and the bulk region. The bulk region domain lies in a smaller, concentric, hexagonal prism of radius b. This radius b is determined so that the separation between the inner and outer prisms is the segregation width, wseg. If the point lies within the bulk region the density is given by cbulk. If the point lies outside the smaller hexagonal prism, but still within the bounding prism (i.e., in the segregation region) then the density is determined by some function of the distance from that point to the bounding hexagonal prism's surface. The functions we used to model the defect density in the segregation region were: a constant value (csurf), linear decay, and exponential decay. The linear and exponential decay profiles had a value of csurf on the surface and reached a value of cbulk a distance wseg below the free surface. An illustration of a linear decay profile is shown in Fig. 2.
The CL simulation uses 3D energy loss profiles (ELP) generated by the software CASINO (monte CArlo Simulation of electroN trajectory in sOlids).18 This software allows one to create/import a 3D model of a sample, subdivide it into small rectangular prisms (cells), and then track the energy lost within each cell as the trajectories of the incident electrons are calculated (Fig. 1(b)). The CL simulation software developed here then iterates through each of the cells and divides the energy absorbed, ΔEij, by an average ionization energy to find the number of e–h pairs (ELP) generated in cell .
The main effect of minority carrier diffusion is to expand the CL probing volume (where light is emitted from). This is simulated, in a rather simplistic way, by doing a 2D Gaussian convolution with the ELP calculated distribution of holes (minority carriers in n-type ZnO). The result of the convolution is a new hole distribution, which represents the spatial distribution of where radiative recombination will occur. The Gaussian's variance is set by the minority carrier diffusion length and any hole ending up outside of the wire is assumed to have recombined at the surface. There are several potential improvements that can be made to such a model, e.g., by including a diffusion length which is a function of the local defect densities instead of a single parameter. However, as discussed below, allowing for a single parameter minority carrier diffusion did not improve our overall fit to the experimental curves for our data. Hence, the development of the method has not been pursued further at this stage.
The number of holes that recombine through a defect state (Ndef) or as a near band edge (Nnbe) emission is governed by the local value of the defect concentration in our model. If Ndef and Nnbe photons are generated, the number of photons reaching the detector will be attenuated by their respective exponential factors e−α(f)zij, where zij is the distance from the cell to the surface and α(f) is the frequency dependent absorption coefficient. Adding up all the absorption-corrected photon count from each cell, one obtains the measured defect emission (Idef) & NBE emission (Inbe) intensities. The ratio is finally taken to give a value for Idef/Inbe for each electron beam spot.
As a test of the simulation and model we compared the results of a best fit using a 5 keV line-scan to that of the best fit of a CL depth dependence using three different beam energies (1.5 keV, 2 keV, and 5 keV) at a spot on the top face of the same, 2.7 μm diameter, wire. The current of the electron beam was set to maintain constant power throughout the 3 different probe energies. The best fit parameters (wseg, cbulk, & decay profile) were found to be the same for both the single-spot depth dependence fit (red dots in Fig. 2(c)) and the line-profile fit at 5 keV (blue dots in Fig. 2(d)), demonstrating the consistency and reliability of the method. The best fit parameters for the wire were, wseg = 37 nm and a linear decay profile, which is similar to the other micron-sized diameter wires from set A, which are presented in the results section.
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Fig. 3 (a) CL spectrum from set A (CuZn). (b) CL spectrum from set B (UGB). (c) CL spectrum from set C (VZn). |
In set B, the deep band emission was primarily from an unstructured green band (UGB) emission. This appears in spectra as a smooth wide peak centered ∼2.45 eV. The nature of this peak is still contested but has been attributed to a variety of defects including Vo,21,22VZn,23 as well as other possibilities.3,24
In set C (Ga-doped ZnO wires), the defect emission peak energy was approximately 1.8 eV. Previous studies have correlated the emission for this energy to VZn isolated defects and defect clusters.25,26 That would be consistent with findings of acceptor compensation in highly n-type doped samples.27,28
We found that the defect segregation widths as well as their functional profiles were different for small diameter wires, e.g., 380 nm, compared to the larger, 1–2 μm diameter micowires. Fig. 4 illustrates the experimental line-scan values obtained from the HSI maps along with CL simulations that best fit the data points as determined by the least squares fit between simulated and the measured line-scans. Note how the simulations appear to reflect the asymmetries and slope changes of the experimental data. Bracketing each best fit simulation curve are alternate simulations with the same line profile but different wseg that establish error bounds. The following Error analysis section describes how best fits and their error bars are determined.
Fig. 4(a) shows results for a 1.7 μm diameter wire from set B, whose dominant defect was the UGB. Here, wseg = 36 nm+9 nm−8 nm with a linear decay profile. Fig. 4(b) shows results for a much larger wire, a 2.2 μm diameter wire from set A, whose best fit profile corresponded to wseg = 36 nm ± 5 nm and a linear decay profile. The behavior of this defect was very similar to the 1.7 μm wire from set B. For both of the set A wires analyzed, we attributed the dominant defect to CuZn defects due to the phonon structure observed, given previous literature and since Cu can be a common trace impurity in ZnO. Fig. 4(c) shows results for the smallest wire studied, a 380 nm diameter from set A. The best fit obtained from our simulation yielded a segregation width wseg = 12 nm+6 nm−4 nm. This smallest experimental wire profile displayed closest agreement to the simulation profile for a constant decay type. Our best fits were achieved by neglecting a single parameter minority carrier diffusion length. A more extensive approach involving variable diffusion lengths through a Monte Carlo approach requires considerably more computational power and cost. However, our results recreating the line scans with no diffusion suggests, possibly due to high defect densities, that minority carrier diffusion near the surface may be small.
The profiles of the Idef/Inbe from our CL line-scans across the measured ZnO wires and the different segregation widths for different diameter wires are inconsistent with a defect emission process where minority carriers diffuse to the surface and recombine there. Thus our results show that there are defects below the surface of these structures, which may be of great importance in evaluating and improving the performance of devices based on ZnO.
We observed indications of a diameter dependence in this defect segregation behavior. These results support a model in which defects are distributed inside ZnO nano- and micowires and segregate towards free surfaces versus models in which carriers diffuse to recombination centers at the surface. The presence of electrically-active defects inside, rather than just on the surface, could affect electrical transport through such wires.
Footnote |
† Electronic supplementary information (ESI) available. See DOI: 10.1039/C5NR08248J |
This journal is © The Royal Society of Chemistry 2016 |