Open Access Article
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Correction: Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder
N. I. M. Nordina,
S. M. Said*b,
R. Ramlia,
K. Weide-Zaagec,
M. F. M. Sabria,
A. Mamata,
N. N. S. Ibrahimd,
A. Mainale and
R. S. Dattab
aDepartment of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
bDepartment of Electrical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia. E-mail: smsaid@um.edu.my
cRESRI Group Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover, Appelstraße 4, 30167 Hannover, Germany
dProduct Quality & Reliability Engineering (PQRE) Laboratory, Malaysian Institute of Microelectronic Systems (MIMOS) Berhad, Technology Park Malaysia, Kuala Lumpur 57000, Malaysia
eDepartment of Chemistry, University of Malaya, 50603 Kuala Lumpur, Malaysia
First published on 7th December 2015
Abstract
Correction for ‘Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder’ by N. I. M. Nordin et al., RSC Adv., 2015, 5, 99058–99064.
The authors regret that funding details were omitted from the original article. The relevant details are presented in the following amended Acknowledgements section.
Acknowledgements
The authors acknowledge financial support from the Ministry of Education Malaysia under High Impact Research (HIR) fund UM.C/625/1/HIR/MOE/ENG/29 and also from University of Malaya under UMRG (RP003A-13AET and RP003D-13AET) and PPP (PG140-2014A) grants.The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.
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