Xianyan Xu,
Jing Li,
Xuepeng Zhang,
Huiying Xu,
Zhuo-Feng Ke* and
Cunyuan Zhao*
MOE Key Laboratory of Bioinorganic and Synthetic Chemistry, School of Chemistry and Chemical Engineering, Sun Yat-Sen University, Guangzhou 510275, P. R. China. E-mail: kezhf3@mail.sysu.edu.cn; ceszhcy@mail.sysu.edu.cn; Fax: +86-20-8411-0523; Tel: +86-20-8411-0523
First published on 18th February 2015
Removing or reducing NO is meaningful for environment protection. Herein, the investigation of the probability of NO reduction on silicene is presented utilizing DFT calculations. Two mechanisms for NO reduction on silicene are provided: a direct dissociation mechanism and a dimer mechanism. The direct dissociation mechanism is characterized as the direct breaking of the N–O bond. The calculated potential energy surfaces show that the total energy barrier in the favored direct dissociation pathway is 0.466 eV. On the other hand, the dimer mechanism is identified to undergo a (NO)2 dimer formation on silicene, which then decomposes into N2O + Oad or N2 + 2Oad. The (NO)2 dimer formation on silicene is found to be feasible both in thermodynamics and kinetics. The formation energy barriers for (NO)2 dimer are lower than 0.231 eV. The calculation results indicate that the (NO)2 dimers can be readily reduced into N2O or N2. The energy barriers in the favored decomposition pathways to produce N2O are quite low (<0.032 eV). The energy barrier for the release of N2 is calculated to be 0.156 eV. The further reduction of N2O to N2 on silicene is also investigated. The results indicate it is easy to reduce N2O to N2 with an energy barrier of only 0.445 eV. NO reduction on silicene hence prefers to generate N2 via the dimer mechanism when compared to the direct dissociation. NO reduction on silicene with silicane as substrate is further proved to proceed via the same reduction mechanism as compared with the free-standing model. Hence, our results presented here suggest that silicene can be a potential material in NO removal, which will reduce NO into environmentally-friendly gases.
Silicene is the Si counterparts of graphene and has attracted great attention as a potential material to replace graphene in recent years. Silicene is initially predicted to have unique two-dimensional buckled honeycomb structure consisting of silicon atoms as semimetal by theoretical calculations33,34 and then was successfully synthesized on various substrates such as Ag(111),35,36 Ir(111),37 and diboride thin film.38 It has been predicted that free-standing silicene has similar physical properties to graphene such as Dirac cone and linear electronic band dispersion around K point.33 The silicon atoms in silicene are sp2-/sp3-hybridized and the π bonds in silicene are derived from the overlapping of 3pz orbital of the Si atoms. Compared to the overlapping of 2pz orbital of C atoms in graphene, the π bonds of silicene are relatively weaker, which provides silicene an unique bulked structure and a very reactive surface on which chemical bonds can be readily formed between silicene and chemical species.39 It is also the reason why free-standing silicene has not been observed in reality and the substrates are required to stabilize silicene. It is proved in theory that hydrogenation is much easier in silicene39–41 and the interactions between alkali, alkaline-earth, transition-metal atoms, B, N, Al, or P atoms and silicene are quite strong.42–45 Silicene has also been further suggested to be a good sensor for NO and NH3 and disposable molecule sensor for NO2, O2, and SO2 due to the adsorption energies of NO or NH3 on silicene are no larger than 0.60 eV while the adsorption energies of NO2, O2, and SO2 on silicene are larger than 1.0 eV.46,47 However, it is known to us only the chemisorption of NO has been investigated but no further researches on the probability of NO reduction on silicene are reported. Silicene is known to be active due to the sp2/sp3 character and the frontier orbitals of NO have been found to be very close to the Dirac point of silicene by Yang et al.,48 it hence might exhibit good reactivity with NO. Therefore, an investigation on the probability of NO reduction on silicene is presented in this paper and we will further detail the mechanism of this process since the importance of (NO)2 dimer formation in NO reduction demonstrated by previous investigations.2,20,21,29–32 Moreover, calculations on NO reduction on silicene with silicane as substrate are carried out to interpret the substrate effect since DFT investigation has revealed silicane is promising for producing free-standing silicene due to the successful synthesis of silicane in experiments,49–51 the preserved chemical reactivity of silicene by the weak interaction between silicene and silicane and the predicted ability for silicane to stabilize silicene.52,53
A 5 × 5 silicene supercell containing 50 atoms was chosen as the benchmark model and the minimum distance between the neighboring silicene sheets is greater than 20 Å to avoid the interactions between them. The model is shown in Fig. 1a. The lattice constant of the silicene model in our calculation is 3.860 Å with a bulking value of 0.462 Å. The nearest-neighbor Si–Si bond length is 2.277 Å and the Si bond angle is 115.9°, which is in a good agreement with the previous results.47,61–63 The letters T and V in blue color respectively represent the Si atom at the top site and valley site. It is obvious that the Si atoms at the T or V site are equivalent to each other. Hence, attention has only been focused on the hexagon ring circled in Fig. 1, in which the possible reactive sites involved in the process of NO reduction on silicene are labeled in red color numbers. The Brillouin zone was sampled by 5 × 5 × 1 special k-points using the Monkhorst–Pack scheme64 during the geometry optimization whereas 15 × 15 × 1 special k-points for the calculation of density of states to obtain the electronic properties. The population analysis was performed using the Mulliken population analysis method.65,66
To study the substrate effect on NO reduction on silicene, monolayer silicane are taken as the substrate. Silicane has similar lattice structures with silicene, so that the coherent lattices are built for silicene/silicane bilayers with AB stacking. In silicene/silicane system, the lengths of Si–Si and the bulking for silicene slightly increases to 2.283 and 0.493 Å respectively due to the weak interaction between silicene and silicane, Fig. 1b.
The adsorption energy Eads is defined by the following equation:
| Eads = E[silicene or silicene/silicane+(NO)n] − [Esilicene or silicene/silicane + nENO] |
For the adsorption of NO monomer on silicene, we have evaluated N-atom and/or O-atom approach to the silicon atom(s) at T site, the top of the Si–Si bond and the hollow site of the hexagon ring of silicene. After full optimization, four adsorption structures are obtained. The adsorption structures and calculated adsorption energies of monomer NO on silicene are shown in Fig. 2. It is found that N–Si1 bond is formed when N-atom of NO attacking Si1 (see structure M1 in Fig. 2). A four-membered ring is formed in M2 and M3. Noted that N atom in M2 is connected with Si1 and O atom is adjacent to Si2 (N–Si1–Si2–O) while they are in the opposite order in M3 (O–Si1–Si2–N). The adsorption energy of structure M2 are greater than structure M3 (−0.317 eV for M2 vs. −0.259 eV for M3). Structure M4 is originated from the N–O bond approaching to the hollow site of silicene. It features two new-forming N–Si bonds and one new-forming Si–O bond with a N–O bond length of 1.436 Å. The adsorption energy for this configuration is −0.378 eV. But no chemisorption with O atom of NO attacking Si1 is observed and M3 actually does not exist in reality. It is known one unpaired electron is on the N atom of NO molecule. In this case, N atom exhibits a better electrophilicity than O, which leads the weak interaction between O and Si atoms while strong binding between N and Si atoms, resulting the preferred bonding between N and Si atoms rather than O and Si atoms when NO approaches to silicene. When seen from the side of NO approaching to silicene, Si1 is at the T site and Si2 are at the V site. Obviously, the adsorption of NO monomer onto silicene would undergo N atom first attacking the T site Si atom rather than the V site Si atom. Thus, there is no possibility to form M3 with N bonding to the V site Si atom and O bonding to the T site Si atom.
| NO → Nad + Oad | (1) |
Our calculation results suggest the direct dissociation of NO on silicene would proceed via two different reaction pathways: pathway 1 (Fig. 3a) and pathway 2 (Fig. 3b). It is found that the monoadsorption configurations M1, M2 and M4 are involved in the direct dissociation pathways. Moreover, the two dissociative pathways are both stepwise and require to go through three intermediates (M1, M2 and IM1 in pathway 1 while M1′, IM2 and M4 in pathway 2) to break the N–O bond. Both dissociation pathways would involve in the following steps: (1) form the first N–Si bond, (2) form the Si–O bond, (3) form the second N–Si bond, (4) break the N–O bond.
Pathway 1 (Fig. 3a) starts from M1 and M1 then goes through TS1 to get M2 along with a decreasing distance between Si2 and O. It is found the formation of M1 is free of barrier. In M2, the distance between Si2 and O is 1.796 Å, indicating a Si–O bond is formed. This step is endothermic by 0.134 eV and requires an energy barrier of 0.493 eV. M2 is not stable and would next turn into IM1 upon forming a second N–Si bond by over passing the transition state TS2 with an energy barrier of 0.282 eV. It is exothermic by 0.145 eV in M2 → IM1. Along with the generation of IM1, the distance between N and Si6 decreases while the bond length of N–O bond increases from 1.375 Å in M2 to 1.395 Å in TS2 and 1.485 Å in IM1. The lengths of the two N–Si bonds in IM1 are 1.848 and 1.859 Å. Finally, IM1 crossovers TS3 to get the dissociative product FS1 with N–O bond breaking. This step requires activation energy of 0.491 eV and it is exothermic by 2.241 eV. In FS1, the N atom inserts into Si1–Si6 and thus penetrated into silicene lattice which is consistent with the investigation of Sivek45 while the O atom prefers to form a three-membered ring with Si2 and Si3. Because NO dissociation on silicene releases energy overall pathway 1, the barrier of the highest elementary step should be the overall barrier. From the PESs in Fig. 3a, we found the energy barriers of M1 → M2 and IM1 → FS1 are comparable and hence the both steps will affect the reaction rate of pathway 1.
Pathway 2 (Fig. 3b) starts from M1′, a similar chemisorption configuration to M1. Like M1, it is also a barrier free process to form M1′. The adsorption energy of M1′ is −0.452 eV. In M1′, the distance between N and Si1 is 2.056 Å. The difference between M1 and M1′ is the orientation of the N–O bond after adsorption (Fig. 4a). The N–O bond in M1 is in-plane with Si1–Si2 bond while in M1′ it is almost in-plane with Si1 and Si3 atoms. The O atom in M1′ then approaches Si3 and the conversion from M1′ to IM2 occurs by passing through TS4. This step is endothermic by 0.175 eV and the energy barrier is 0.212 eV. In IM2, the distance between O and Si3 atoms is 1.892 Å, indicating a Si–O bond formed. IM2 next converts into M4 via TS5 with N atom bonding to Si6. A second N–Si bond is formed in this step, similar to M2 → IM1 in pathway 1. As a result, M4 exhibits two N–Si bonds (N–Si1 1.817 Å and N–Si6 1.872 Å) and one Si–O bond (Si3–O 1.798 Å). The energy barrier and the released energy in this step are 0.159 eV and 0.101 eV, respectively. Then M4 climbs over TS6 with an energy barrier of 0.392 eV and achieves IM3 with the N–O bond broken. The N atom is inserted into Si1–Si6 bond in IM3 while the oxygen atom is only bonding to Si3 which is easy to interact with Si4 to form three-membered ring (FS2) by overcoming a small energy barrier of 0.067 eV associated with TS7. The steps of M4 → IM3 and IM3 → FS2 respectively release energy 1.415 and 1.051 eV. In the whole process of pathway 2, it releases energy by 2.392 eV relative to M1′. Hence, pathway 2 is determined by the step of M4 → IM3 which has an energy barrier of 0.392 eV. But M4 is higher in energy than M1′ by 0.074 eV, therefore the overall barrier of pathway 2 is 0.466 eV, that is, the energy difference between M1′ and TS6.
Comparing the two pathways, we can find similar characters between them, such as the formation of the first N–Si bond in M1′ formation similar to that in M1 formation, the formation of the Si–O bond in M1′ → IM2 similar to that in M1 → M2, the formation of the second N–Si bond in IM2 → M4 similar to that in M2 → IM1, the cleavage of the N–O bond in M4 → IM3 similar to that in IM1 → FS1.
N⋯N
O (C2v) without silicene which has been proved to be the global minimum in both gas and condensed phases.68,69 The binding energy of cis-O
N⋯N
O is −0.508 eV relative to the isolated NO molecule in our calculation. In the cis-O
N⋯N
O, the two NO molecules are bonding to each other via the two N atoms. The distance of N–N bond is 2.048 Å (close to that of the gas (NO)2 in previous investigations),32,68,69 whereas the two N–O bonds are 1.166 and 1.167 Å which is almost the same as that of the free NO molecule (1.164 Å), as shown in Fig. 5a. Such interaction between the two NO in the cis-O
N⋯N
O would induce the modification of the electronic structure of NO species to some extent. The projected density of states (PDOS) on p orbitals of NO and (NO)2 in Fig. 5b and c clearly show that more split peaks exhibit in the PDOS of (NO)2. With comparing to the Fermi level of the free NO (−4.376 eV), the Fermi level of (NO)2 lies at −4.518 eV and are lifted towards the valence band due to the dimerization. Moreover, the SOMO of (NO)2 lies a lower energy level comparing with NO.
To obtain the adsorption structure of (NO)2 dimer, we have evaluated various possibilities for the adsorption (NO)2 on silicene: (1) (NO)2 binds to one Si atom on silicene via N-η1, O-η1, NN-η2, OO-η2, or NO-η2; (2) (NO)2 binds simultaneously to two Si atoms on silicene with NN⋯SiSi, NO⋯SiSi, or OO⋯SiSi interactions. After full optimization, six most plausible adsorption configurations of dimers are proposed, shown in Fig. 6. The adsorption energies of the six dimers (−1.308 eV for D1, −2.090 eV for D2, −1.491 eV for D3, −2.165 eV for D4, −1.993 eV for D5, −2.473 eV for D6, and −2.326 eV for D7) are much larger than the twice of that of the NO monomer (M1: Eads = −0.451 eV) and the dimerization energy of NO (−0.508 eV).
Structure D1 is characterized by the bonding between N1 and Si1 with N2 and O2 away from Si1 (O1N1adN2O2, Si1N1ad). The length of N1–Si1 bond is 1.875 Å and the adsorption energy −1.308 eV. Two possible pathways are proposed to form structure D1 (Fig. 7a). One pathway starts from structure fIM1 with one NO molecule preadsorbed onto silicene via the interaction between N1 and Si1. N2 of the second NO then attacks N1 to produce D1 with forming N1–N2 bond. The other starts from structure fIM2 with N1 of (NO)2 approaching Si1. Both of these two pathways are free of barrier.
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| Fig. 7 Relative energies along the reaction path for the formation of (NO)2 dimer on silicene. Golden, red and blue colors denote Si, O, and N atom, respectively. The distances are in angstrom. | ||
Structures D2 and D3 (Fig. 6) correspond to an O1N1adN2adO2 species. In structure D2, N1 is bonding to Si1 with N2 bonding to Si2. Hence, a four-membered ring Si1N1adN2adSi2 is formed between (NO)2 and silicene. The two formed N–Si bonds length are 1.899 and 1.912 Å, respectively. D1 could transform to D2 through fTS1 with an energy barrier of 0.036 eV, Fig. 7b. D2 can also be achieved via two other possible pathways (see Fig. 7b). In the first pathway, two free NO molecules are adsorbed on silicene in order, followed by the formation of structure fIM3 which lies below the reaction entrance by 0.495 eV. In structure fIM3, N2 of the second NO molecule gets close to N1 and Si2 while N–N and N–Si distances decrease. Going through fIM3 finally reaches D2 without any energy barrier. The second pathway starts from structure fIM4 that is more stable than the free system by 0.636 eV, and only slightly greater in energy than the (NO)2 dimer formation (−0.508 eV), indicating physisorption of (NO)2 onto silicene. Once N1 of the dimer (NO)2 is bonding to Si1, N2 would attack Si2, which leads the system to D2. The process of fIM4 → D2 is a concerted but very asynchronic process and it is free of barrier. Unlike N2 bonding to Si2 in D2, N2 in D3 is bonding to Si3. The bonding leads Si1 and Si3 pulled out to increase the bulking of silicene. Fig. 7c shows that D1 can also be converted into D3 by overcoming an energy barrier of 0.175 eV involving transition state fTS2. The formation of D3 can also be originated from the N–N binding between two NO of the monoadsorption configuration (structure fIM5). The binding energy barrier is 0.048 eV (fTS3). In fIM5 → D3, it releases energy by 0.377 eV.
Structure D4 (Fig. 6) is characterized by the bonding between N1 and Si1, O1 and Si2 (O1adN1adN2O2) with forming a four-membered ring Si1N1adO1adSi2. The new forming bonds N1–Si1 and O1–Si2 between (NO)2 and silicene are 1.848 and 1.739 Å in length, respectively. Fig. 7d suggests that D4 can be originated from structure D1′ (an isomer of D1) by overcoming an energy barrier of 0.231 eV. The comparison between structure D1 and D1′ are shown in Fig. 4b. D4 can also be formed by the two NO molecules approaching silicene in order. Upon the first NO molecule forming a four-membered ring with Si1 and Si2 to reach M2, the second NO molecule starts to approach N1 (structure fIM6) and finally D4 is achieved without any barrier. However, the formation of M2 requires an activation energy of 0.493 eV from M1 (Fig. 3a), which means the pathway of D4 formation involving M2 requires an energy barrier of 0.493 eV. Comparing the process involving D1′ to that involving fIM6, the conversion from D1′ to D4 is more favorable in kinetics.
Structure D5 is characterized by the bonding between N1 and Si1, O1 and Si3 (O1adN1adN2O2, Si1N1adO1adSi3) (Fig. 6). The new bonds N1–Si1 and O1–Si3 are 1.874 and 1.736 Å. Similar to the formation of D4, D5 can also be formed by the two NO approaching silicene in order (Fig. 7e). IM2 is first formed with the bonding between N1 and Si1, O1 and Si3. N2 of the second NO then starts to approach N1 of the first NO (structure fIM7) with a decreasing N1–N2 distance. By this, structure fIM7 is converted into D5 without any barrier. D5 can also start from structure fIM8 with the dimerization of the two NO molecules before adsorption on silicene. The two N atoms gradually move closer to Si1 at the same time with decreasing distances between N1 and Si1, N2 and Si1 (structure fIM9). D5 is finally obtained from structure fIM9 by overcoming an energy barrier (fTS5) of 0.087 eV. The process of fIM9 → D5 is along with a decreasing distance between O1 and Si3 and an increasing distance between N2 and Si1. Since IM2 is originated from M1′ by overcoming an energy barrier of 0.212 eV and it is endothermic by 0.175 eV (Fig. 3b), the pathway of D5 which is originated from structure fIM8 is more favorable in kinetics.
Structure D6 corresponds to a trapezoid O1adN1N2O2ad, in which the two O atoms of (NO)2 dimer are bonding to Si1 atom and a five-membered ring Si1O1adN1N2O2ad is formed between (NO)2 and silicene. The two new-formed Si–O bonds are 1.820 and 1.747 Å. The adsorption energy is −2.473 eV. Because of the weak interaction between O and Si atoms, the (NO)2 dimer can be only adsorbed onto silicene with the two O atoms attacking the Si1 at the same time. It is found that no barrier is required to form D6 when (NO)2 approaches to silicene with their O atoms getting close to Si1 (structure fIM10), shown in Fig. 7f. It should be noted that the bonding of the two O atoms to the different Si atoms such as the bonding of O1 to Si1 and O2 to Si2 or Si3 has been also investigated. However, there is no observation for such configurations according to our calculations due to the weak interaction between O and Si atom.
Structure D7 is characterized by the bonding between N1 and Si1, O2 and Si2 (O1N1adN2O2ad) and hence a five-membered ring Si1N1adN2O2adSi2 can be observed between (NO)2 and silicene. Similar to the formation of D1 and D2, D7 can be originated from the two NO approaching silicene in order (Fig. 7f) involving fIM11 without any barrier.
Overview the formation of (NO)2 dimer on silicene, it requires zero barrier for D1, D2, D6 and D7 while 0.048, 0.231 and 0.087 eV of energy barriers are respectively required to overcome in the favorite formation pathways of D3, D4 and D5. It should be noted that D2 is more stable than D3 by 0.599 eV. D1 can be readily converted into D2 by overcoming a small energy barrier of 0.036 eV and releasing energy by 0.782 eV while D1 would be turned into D3 which demands an energy barrier of 0.175 eV and releases 0.183 eV energy, shown in Fig. 7b and c. Thus, we propose D3 can be first converted into D1 and then to D2. The conversion energy profile is summarized in Fig. 8. The conversion energy barrier of D3 → D1 is 0.358 eV and it is endothermic by 0.183 eV. In D3 → D1 → D2, the overall energy barrier is 0.358 eV. The process releases energy by 0.599 eV which is the energy difference between D3 and D2. Compared to mono NO molecule on silicene, structure D3 has a larger adsorption energy (−1.491 eV for D3 vs. −0.451 eV for M1) and the conversion energy barrier is smaller than the direct dissociation energy barrier (0.358 eV for the process of D3 → D1 → D2 vs. 0.493 and 0.466 eV for NO direct dissociation shown in Fig. 3). Thus the conversion from D3 to D2 is likely to take place. The decomposition of D1 and D3 therefore would not be included due to the easy conversion from D1 to D2 or D4 and from D3 to D2 according to the kinetic and thermodynamic analysis. Hence, we mainly focus on D2, D4, D5, D6 and D7 in discussions about the dimer decomposition on silicene in this paper.
| (NO)2 → N2 + 2Oad | (2) |
| (NO)2 → N2O + Oad | (3) |
The PESs are presented in Fig. 9. D2, D4, D5, D6, or D7 are taken as the reactants. The results indicate D2, D4, D5 and D7 would decompose into N2O following eqn (3) while D6 would decompose into N2 following eqn (2). The decomposition energy barriers of D2 to N2O (Fig. 9a) are 1.581 and 1.609 eV, while it is 1.000 eV to decompose D7 to N2O (Fig. 9e). For D4 (Fig. 9b) and D5 (Fig. 9c) to N2O, the decomposition energy barriers are respectively 0.026 and 0.032 eV. For D6 to N2 (Fig. 9d), 0.156 eV energy barrier is required. Obviously, the relatively high energy barriers (>1.000 eV) lead to the decomposition of D2 and D7 difficult. However, the very small energy barriers (<0.156 eV) would result in the very fast decomposition of D4 and D5 to N2O, or D6 to N2. Moreover, unlike the dimer decomposition products with the dangling Si–O and N–O bond respectively on the Si doped and N doped graphene in the process of (NO)2 → N2O + Oad in which the O should be further removed by CO or NO,21,23 it is further found the product of atomic O atoms in the dimer decomposition on silicene is facile to form three-membered ring with barely no barrier, hence no consideration for removing the O from silicene in our system.
In order to decompose the dimer to N2O, the N–O bond is required to break and the N–N bond becomes stronger. In another word, the longer length of N–O bond and the stronger N–N bonding facilitate the decomposition. In D2, the bond length of N1–N2, N1–O1 and N2–O2 bond are 1.401, 1.238 and 1.238 Å, respectively. In D7, the (NO)2 dimer are bonding to silicene via N1–Si1 and Si1–O2. The bond length of N2–O2 and N1–N2 are 1.388 and 1.293 Å, respectively. The N2–O2 bond is longer than that in D2 while N1–N2 of D7 is shorter than that in D2. N2–O2 bond is more activated in D7 than in D2. Therefore, smaller activation energy is required for D7 (1.000 eV) compared to the decomposition of D2 (1.581 and 1.609 eV). Unlike D7, the (NO)2 dimer in D4 and D5 are bonding to silicene within one N–O bond. The N1–O1 bond is 1.492 and 1.464 Å while the N1–N2 bond is 1.299 and 1.317 Å for D4 and D5, respectively. Compared to the N2–O2 bond (1.388 Å) of D7, the N1–O1 of D4 and D5 are elongated by 0.104 and 0.076 Å, respectively. The N1–N2 bonding changes slightly. We can clearly see the N1–O1 bond in D4 and D5 are much more activated than D7. Therefore, only much smaller activation energies (<0.032 eV) are required to decompose D4 and D5 to N2O. In D6, the two N–O bonds are 1.375 and 1.424 Å. The N1–N2 bond is 1.247 Å. Such trapezoid O1adN1N2O2ad structure is helpful to decrease N–O bond and increase the N–N bonding, finally facilitate the N–O breaking. So the decomposition energy barrier is only 0.156 eV. Therefore, the dimer mechanism for NO reduction can only take place following the decomposition of D4, D5 and D6.
Since D4 and D5 can be reduced into N2O, the adsorption and reduction of N2O on silicene are also considered. For the adsorption of N2O on silicene, only physisorption is observed; see the structure of PHY in Fig. 10. It is obvious that the interaction between N2O and silicene is very weak with adsorption energy of 0.159 eV. The N–N and N–O bond lengths are 1.142 and 1.195 Å, respectively. They are unchanged when compared with the isolated N2O molecule. The PHY structure is then directly decomposed by going through the transition state TSa and finally PCa with desorbed N2 is achieved. The decomposition potential energy surface is depicted in Fig. 10. This process needs to overcome an energy barrier of 0.445 eV and it releases energy by 2.683 eV. In the decomposition of N2O, the Si1–O is shortened from 3.530 Å (PHY) to 2.305 Å (TSa) and finally the O atom forms a three-membered ring with two neighboring Si atoms, while the N2–O bond length increases from 1.195 Å (PHY) to 1.241 Å (TSa) and is ruptured in PCa. A reaction with an energy barrier of less than 0.500 eV is expected to occur at room temperature, thus the decomposition of N2O is likely to proceed rapidly at room temperature, which is the reason we can easily observe the decomposition product of N2O on silicene.47 Therefore, N2 would be the final product in the dimer mechanism for NO reduction.
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| Fig. 10 The potential energy surfaces of the decomposition of N2O on silicene. Golden, red and blue colors denote Si, O, and N atom. The distances are in angstrom. | ||
With comparing the direct dissociation and the dimer decomposition mechanism for NO reduction, NO reduction on silicene would like to proceed via the dimer mechanism and prefer the N2 production. First, the adsorption energies of the (NO)2 dimer on silicene are larger than that of the NO monomer adsorption. Second, the decomposition energy barriers (0.026, 0.032 and 0.156 eV) for the dimers D4, D5 and D6 are much lower than those (0.493 and 0.466 eV) for the NO direct dissociation. In addition, more electron accumulated on (NO)n helps the NO reduction. The Mulliken charge analysis showed that the electrons are donated from silicene to the NO species and the order of the accumulated net charge on NO and (NO)2 are consistent with the adsorption energies of these molecules on silicene: (NO)2 > NO, listed in Table 1. Moreover, more electron donated by silicene are occupied the 2π*–2π* orbital of (NO)2, leading to the increasing of the N–N bond distance while the decreasing of the N–O distance and finally facilitating the decomposition of the dimer.20,21,25,32 Accordingly, the N–N bond is greatly shortened in D4, D5 and D6 compared to 2.048 Å of the gas phase (NO)2 and the key N–O bond becomes significantly longer in D4, D5 and D6 compared to 1.164 Å of the free NO molecule. The lengths of N–N bond and N–O bond in D4, D5 and D6 have been described in Fig. 6 and Table 1. The projected density of states (PDOS) of silicene and (NO)n in M1, D4, D5 and D6 (Fig. 11) clearly show that the 2π* orbitals of NO around the Fermi level are partly filled in M1 while 2π*–2π* orbitals of (NO)2 are almost full filled around the Fermi level in D4, D5 and D6 with the electron density of silicene is depopulated, which is in well agreement with the more electron charge accumulated on the NO species (Table 1).
| Adsorption configuration | Eads/eV | Q(NO)n/e | dN–N/Å | dN–O/Å |
|---|---|---|---|---|
| a n in Q(NO)n indicates the number of NO molecule. | ||||
| M1 | −0.451 | −0.171 | — | 1.192 |
| M1′ | −0.452 | −0.174 | — | 1.193 |
| D4 | −2.165 | −0.711 | 1.299 | 1.232, 1.492 |
| D5 | −1.993 | −0.684 | 1.317 | 1.226, 1.464 |
| D6 | −2.473 | −0.836 | 1.247 | 1.375, 1.424 |
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| Fig. 11 The projected density of state (PDOS) of (a) M1, (b) D4, (c) D5 and (d) D6. n of (NO)n equals to 1 or 2. | ||
It is noted that the calculated direct dissociation barrier of NO on the silicene is 0.466 eV or 0.493 eV and the favorite dimer decomposition energy barrier is no higher than 0.156 eV, which are both much lower than that on the nitrogen doped graphene (1.70 eV for the direct dissociation while 0.70 eV for the dimer mechanism)23 and that on the silicon doped graphene (3.91 eV for the direct dissociation mechanism while 0.443 eV for the dimer mechanism).21 The result indicates the higher reactivity of silicene than graphene to the molecules' adsorption, which is caused by the easy electron transfer from silicene to the adsorbates due to the sp2/sp3 character of silicene.
To explore the substrate effect on the chemical reactivity of silicene toward NO, both two direct dissociation pathways of NO on (5 × 5)silicene/(5 × 5)silicane are investigated while only the formation and the decomposition of the (NO)2 dimer D6 are considered. The PESs for NO reduction on (5 × 5)silicene/(5 × 5)silicane are shown in Fig. 12 and the related structure configurations along the reaction pathways are depicted in Fig. 13. It is found that similar configurations of silicene on silicane are observed along the NO reduction process as compared to those of free-standing silicene. The obtained PESs in Fig. 12 of NO on (5 × 5)silicene/(5 × 5)silicane show the same trends with those of free-standing silicene. For NO direct dissociation on (5 × 5)silicene/(5 × 5)silicane, the energy barriers of M1 → M2 and IM1 → FS1 are with respective to 0.510 and 0.509 eV, both determining the reaction rate of pathway 1; while the overall reaction barrier for pathway 2 is 0.454 eV, which is determined by the N–O broking of M4 → IM3. The dissociation barrier for pathway 2 of NO reduction on silicene/silicane bilayer is lower than pathway 1 and NO direct dissociation on silicene/silicane bilayer thus prefers to proceed along pathway 2 rather than pathway 1, which is the same with the results of free-standing silicene. It is noted that direct dissociation barriers for NO reduction on silicene/silicane bilayer are slightly higher than those for free-standing silicene, which is ascribed to the weak interaction between silicene and silicane. For D6 on silicene/silicane, the formation process for D6 is barrierless and the barrier for D6 decomposition is 0.081 eV. It is clear that the (NO)2 dimer decomposition mechanism, rather than the direct dissociation mechanism, is preferred for silicene/silicane to give a decomposition product with desorbed N2. Our theoretical prediction hence suggests that, free-standing silicene and silicene/silicane may be promising materials for NO reduction, which provide helpful theoretical clues for the experimental development and widen the future application of silicene. However, it should be noted that metal substrates may have strong effects on the silicene structure, resulting in different NO reduction features, which need to be further explored in the future.
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