Young-Jae Kima,
Jong-Heon Kimb,
Shin-Woo Ha‡
a,
Dongil Kwon*b and
Jin-Kyu Lee*a
aDepartment of Chemistry, Seoul National University, Seoul 151-747, Korea. E-mail: jinklee@snu.ac.kr; Fax: +82-2-882-1080; Tel: +82-2-879-2923
bDepartment of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
First published on 3rd September 2014
SiO2–polyimide nanocomposites were successfully fabricated by surface modification of silica nanoparticles. In order to create structural similarity between the polymer and the SiO2 surface and to generate interfacial interaction with the polymer chain, (3-trimethoxysilylpropyl)diethylenetriamine was attached to the surface, and then, the surface amines were reacted with phthalic anhydride. The modified silica nanoparticles in polyamic acid solution were subjected to thermal imidization to obtain SiO2–polyimide (PI) nanocomposite films. Cross-sectional transmission electron microscopy results showed no significant aggregation in any of the SiO2–PI nanocomposite films having up to 20 wt% of silica nanoparticles. The effects of silica nanoparticles as a filler material on the thermal, optical, and mechanical properties of the SiO2–PI nanocomposite films were studied in comparison with those of PI by UV-vis spectrometry, thermal gravimetric analysis, thermal mechanical analysis, and nanoindentation.
In situ and ex situ synthesis are the primary methods used to prepare polymer–inorganic nanocomposites.1 In situ synthesis methods generate nanoparticles inside a polymer matrix by in situ sol–gel reactions5 or in situ gas–solid reactions,6 and therefore, one-step fabrication is possible. However, it is difficult to ensure full control of the shape, crystallinity, size, size distribution, and surface properties of the nanoparticles during the reaction. Moreover, the properties of the nanocomposites can be influenced by unreacted reactants or byproducts, which is usually considered to be a main drawback of in situ methods.1 On the other hand, in ex situ synthesis methods, pre-made nanoparticles are blended with polymers, or the polymers are synthesized with the nanoparticles.7,8 Therefore, the properties of the nanoparticles can be easily controlled. Among ex situ synthesis methods, blending is the simplest and most convenient way to prepare polymer nanocomposites.4 However, the nanoparticles tend to aggregate in large agglomers during the mixing process due to their high surface energy and low compatibility with polymers, which leads to deterioration of the mechanical and optical properties of the resulting composites. Thus, the key challenge with these methods are improving the compatibility of the nanoparticles with the polymer and maintaining good dispersibility within the polymer matrix. Modification of nanoparticle surfaces by chemical and/or physical interactions is generally employed to solve these problems.4
Aromatic polyimides are important industrial polymers used in many applications such as packaging and insulation for large-scale integrated circuits because of their high thermal stability, high chemical resistance, mechanical properties, and low dielectric constants.9,10 However, their disadvantages include high glass transition temperatures (Tg)11,12 and high thermal expansion coefficients (CTE).9 The high Tg of polyimides, which is caused by their rigid back bones and strong interaction, makes them difficult to process.11 In addition, the higher CTE of polyimides compared with that of metals causes interfacial stress induced by the thermal expansion mismatch between the polyimide and the metal during thermal cycling in the manufacturing process. This leads to device failure via interfacial decohesion or cracks in microelectronic applications.13,14 Many efforts to reduce polymer CTE have been undertaken by using inorganic fillers such as nanoparticles,15 nanotubes,16 and clay.17 SiO2 nanoparticles are most widely used as a nanofillers due to their low CTE (∼0.55 × 10−6 °C−1), high thermal stability, optical transparency, and easy surface modification.18 There have been many attempts to fabricate SiO2–polyimide nanocomposites in order to reduce the CTE of the polyimide. Most of the SiO2–polyimide nanocomposites were prepared by the in situ sol–gel method5,9,19–21 using a silica precursor, while only a few of them were prepared by blending processes.15,22,23 Because polyimides and SiO2 are incompatible, SiO2 tends to accumulate in large aggregations in a polymer matrix.22 To improve the compatibility between polyimide and SiO2, surface modification of silica nanoparticles with oleic acid has been performed.15,23 However, no significant changes in thermal properties such as Tg and thermal decomposition temperature (Td) were observed. Therefore, to obtain the desired properties of polyimide nanocomposites without aggregation of silica nanoparticles, an appropriate surface ligand to be used for the modification of the nanoparticles is needed.
Herein, we focused on the fabrication of SiO2–polyimide nanocomposites by surface modification of SiO2, using functional groups with chemical and structural similarities to the polymer chains. Silica nanoparticles prepared by the Stöber method24 were modified by a simple two-step reaction: surface Si–OH groups were reacted with (3-trimethoxy-silylpropyl)diethylenetriamine (DETAS) to introduce a large number of amine sites onto the surface,25 which could then react with phthalic anhydride, generating amic acid terminal groups (Fig. 1). We successfully incorporated silica nanoparticles up to 20 wt% in the polymers without aggregation, and compared the thermal, optical, and mechanical properties, along with the CTE, with those of the pristine polyimide to understand the effects of the silica nanoparticles.
4.0 mL of DETAS was added to the dispersed SiO2 solution (400 mg of SiO2 nanoparticles in 40 mL of EtOH), and the mixed solution was stirred at room temperature for 12 h. The mixture was centrifuged for 20 min at 20000 rpm, and then, the precipitate was redispersed in EtOH. This centrifugation–redispersion procedure was repeated more than two times to obtain the dispersed solution of the DETAS-modified SiO2 nanoparticles (DETAS-SiO2). To the dispersed solution of DETAS-SiO2 in 40 mL of EtOH, 1.7 g of phthalic anhydride and 0.16 mL of triethylamine were added. The mixture was refluxed with vigorous stirring for 12 h. After cooling, the dispersion was centrifuged for 20 min at 20
000 rpm, and then, the precipitate was redispersed in N-methyl-2-pyrrolidone (NMP). This procedure was repeated more than two times to remove the excess phthalic anhydride and triethylamine. The dispersed solution was centrifuged at 3800 rpm for 10 min to remove any aggregated particles, and the dispersed solution of phthalic anhydride-modified silica nanoparticles (P-SiO2) was reserved for the next process.
Thermal gravimetric analysis (TGA) measurements were performed using an SDT Q600 apparatus (TA Instruments Inc.). TGA was performed by pre-heating the sample at 100 °C for 60 min and then heating it from 100 °C to 1000 °C at a heating rate of 10 °C min−1 under N2-atmosphere. Transmittance was measured using a UV-vis spectrometer (Sinco, S-3100). Thermal mechanical analyses (TMA), using a TMA-Q400 system, were performed to measure the Tg and CTE of the nanocomposite films under the tension mode (load = 50 mN), by heating them from 25 °C to 400 °C at a heating rate of 5 °C min−1 under nitrogen.
Nanoindentation tests were performed on 50–60 μm-thick polyimide and SiO2–PI nanocomposite films using an Ultra Nanoindentation Tester (UNHT, CSM instruments). The loading and unloading rates were both 250 mN min−1. A holding time of 3 s was maintained at the maximum load. At least seven indentations were performed on each sample, and the average values were determined.
In an indentation test, hardness is defined as the indentation at the maximum load, Pmax, divided by the projected area of tip-sample contact, A, and is calculated for a perfect Berkovich indenter as follows:
A = 24.5hc2 |
hc = hmax − hd |
The effective elastic modulus is formulated in terms of the unloading slope S and contact area A as
For a Berkovich indenter, the indenter geometry parameter β is 1.034.
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Fig. 2 TEM images of (a) as-prepared silica nanoparticles, (b) DETAS-SiO2, and (c) P-SiO2. (d) Zeta potential values of as-prepared and modified silica nanoparticles in EtOH. |
After the modification, the surfaces of the SiO2 nanoparticles was characterized by FT-IR, solid-state 13C-NMR, zeta-potential, and TGA. A strong absorption band at 1710 cm−1, which corresponded to a CO stretching vibration from the amic acid moiety, was clearly observed in the FT-IR spectrum of the P-SiO2 (see the ESI Fig. S3†). In addition, new peaks at 110–130 ppm and 160–170 ppm, corresponding to aromatic carbons and carbonyl carbon, respectively, were found in the solid-state 13C-NMR spectrum of the P-SiO2 (see the ESI Fig. S4†). As shown in Fig. 2a–c, the nanoparticles were well dispersed in the solvents (EtOH and NMP) without showing any significant changes in size or shape during the surface modification reactions. Furthermore, the surface charge of the bare SiO2 generated a negative zeta potential of −33.6 mV due to a hydroxyl group, as shown in Fig. 2d. After attaching DETAS, however, the zeta potential changed from −33.6 mV to 38.9 mV, which is attributed to positively charged amine groups in the DETAS on the silica surface, even neutral conditions. The zeta-potential of the P-SiO2 was 9.1 mV since most of the amine groups of the DETAS formed neutral imide linkages with phthalic anhydride and some amic acid units had Zwitter-ion-type charges.
TGA curves for bare SiO2, DETAS-SiO2, and P-SiO2 are shown in Fig. 3. The amount of weight loss gradually increased in the temperature range from 100 to 1000 °C. An additional 5.6% and 12.6% weight loss resulted from the attached organic units on the surfaces of the SiO2 nanoparticles after the surface modification. The mole percentage of organic groups on the surface of SiO2 nanoparticles could be calculated from TGA data as summarized in Table S1.†
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Fig. 3 TGA curves for bare silica, modified silica nanoparticles (DETAS-SiO2 and P-SiO2), neat polyimide film, and SiO2–polyimide nanocomposite films with various SiO2 contents. |
Since polyamic acid was dissolved in and is usually processed in NMP, the P-SiO2 was dispersed in the NMP in order to homogeneously incorporate the SiO2 nanoparticles in the poly-amic acid. As shown in Fig. 2c and S1c,† the P-SiO2 nanoparticles were well dispersed in NMP without generating aggregation. Furthermore, the dispersed P-SiO2 solution in NMP showed the excellent long-term stability over the one year (Fig. S1d†). Four different SiO2–polyamic acid nanocomposite solutions (5, 10, 20, and 40 wt% of SiO2) were prepared by mixing the appropriate amounts of polyamic acid solution with the P-SiO2 nanoparticles dispersed in the NMP solution. The SiO2–polyimide nanocomposite films were produced using the thermal imidization method, by gradually heating the SiO2–polyamic acid nanocomposite solution up to 350 °C, as described in the experimental section. Fig. 4 shows cross-sectional TEM images of SiO2–PI nanocomposite films. It was clearly observed that the silica nanoparticles were homogeneously dispersed in the polyimide matrices without showing signs of aggregation. This indicates that the ligands on the SiO2 surface have similar chemical structures to the repeating units of the polyimide, and thus, the compatibility between the polymer chain and the nanoparticles is enhanced. As a result, aggregations were not observed in any of the SiO2–polyimide nanocomposite films having up to 40 wt% of SiO2 nanoparticles (Fig. S5†). However, SiO2–polyimide nanocomposites films became brittle beyond 40 wt% of the incorporated SiO2 nanoparticles. Therefore, further measurements were performed with SiO2–PI nanocomposites having the content of SiO2 nanoparticles under 20 wt%.
Transparency of SiO2–PI nanocomposite films, which can be measured using a UV-vis spectrometer, is another important property for optical applications. Strong absorption in the UV-vis region from all of the samples is attributed to an intrinsic feature of polyimides (Fig. 5), which exhibit charge transfer interactions between electron donor and acceptor10 even though the thickness of the PI films ranged from 50 μm to 60 μm. Although the transparency gradually decreased with increasing silica content, no serious degradation in transparency was found in any of the samples. This result also indicates that the silica nanoparticles are homogeneously dispersed in the polyimide matrices; thus, scattering of light in the visible region is negligible.
Tg values of the PI and SiO2–PI nanocomposite films were determined by TMA, and the results are listed in Table 1; the Tg values of the nanocomposites gradually declined as the silica content increased. Because of the large surface area of the nanoparticles, the interface between the polymer and the nanoparticle can change and affect the thermal properties of the nanocomposites.28 We assume that ligands on the nanoparticle surfaces acted as plasticizers for the polyimide. As a result, the chain kinetics of the polymer are changed at the polyimide-nanoparticle interface regions,29 and thus, Tg decreases from 381.3 to 363.3 °C as the SiO2 content increases. This result indicates that SiO2–polyimide nanocomposites have better processability due to the plasticizing effect of the P-SiO2 surface ligands.
Tda (°C) | Tgb (°C) | CTEc (10−6 °C−1) | Hardness (MPa) | Modulus (GPa) | |
---|---|---|---|---|---|
a Temperature at which 5% weight loss was recorded by TGA.b Tg determined by TMA.c CTE was determined over a range of 100–250 °C. | |||||
Polyimide | 570.1 | 381.3 | 33.9 | 215.4 ± 2.5 | 3.20 ± 0.03 |
5 wt% SiO2–PI | 567.7 | 379.1 | 30.8 | 229.7 ± 1.6 | 3.48 ± 0.04 |
10 wt% SiO2–PI | 564.7 | 376.3 | 30.6 | 249.9 ± 2.8 | 3.50 ± 0.05 |
20 wt% SiO2–PI | 560.3 | 363.3 | 27.8 | 283.9 ± 4.3 | 3.71 ± 0.05 |
TGA curves for the SiO2–PI nanocomposite films with various silica contents are also shown in Fig. 3. For all of the samples, almost no weight loss was found up to around 300 °C, and then, the films gradually decomposed at higher temperatures. The Td values of the nanocomposites, which were determined as the temperatures at which 5% weight loss occurred on the TGA curves, are summarized in Table 1. Although the Td values decreased slightly with increasing silica content, Td for each of the nanocomposites was higher than 500 °C, indicating good thermal stability for practical applications. The decreasing Td values with increasing silica content can be explained by the same reasoning as for the decreasing of Tg values. As expected, the remaining weight (wt%) at 1000 °C was proportional to the amount of silica nanoparticles in each of the polyimide films.
To quantify the effect of the SiO2 nanoparticles on the thermal expansion of the PI nanocomposites, TMAs were performed. Fig. S6† shows the thermal expansion curves for the PI and nanocomposite films in the temperature range from 100 to 250 °C. The coefficient of thermal expansions, α, for the nanocomposite films, which were calculated based on the thermal expansion curves by following equation, are shown in Table 1.
Nanoindentation tests were performed to investigate the effect of nanoparticle reinforcement on the nanocomposite's mechanical properties. Fig. 7 shows load-displacement curves for neat PI and the nanocomposites with various silica contents.
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Fig. 7 Load vs. indenter displacement for neat PI film and SiO2–PI nanocomposite films with different SiO2 contents. |
The similarities among the curves indicates that the nanocomposites are based on polyimide matrices. The curves gradually shift upwards and the maximum penetration depth decreases as the silica content in the PI matrices increases, since silica nanoparticles lead to nanocomposites with high resistance to plastic deformation.31,32 The elastic displacement is recovered during unloading. The initial unloading slopes (stiffness, S) increase with silica content, and thus, the effective elastic moduli are enhanced. The average hardness H and effective elastic modulus Eeff values are calculated from the nanoindentation curves using the Oliver–Pharr method33 and are shown in Fig. 8. Both H and Eeff for the polyimide nanocomposites increased markedly with the SiO2 content in the polyimide. This result indicated that the SiO2 in the polymer matrix acts as a reinforcement against deformation, thus improving it's mechanical properties.
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Fig. 8 Hardness and effective elastic modulus values for neat PI and SiO2–PI nanocomposite films with different SiO2 contents. |
Footnotes |
† Electronic supplementary information (ESI) available: FT-IR, solid 13C CP/MAS NMR spectra, and DLS data of SiO2, DETAS-SiO2, and P-SiO2, TEM images of SiO2–PI composites, thermal expansion of PI and composite films, calculation details of CTE. See DOI: 10.1039/c4ra04952g |
‡ Present address: Department of Medicine, Emory University, Atlanta, GA 30322, USA. |
This journal is © The Royal Society of Chemistry 2014 |