Low dielectric and thermally stable hybrid ternary composites of hyperbranched and linear polyimides with SiO2

Seongku Kima, Xingyuan Wanga, Shinji Ando*b and Xiaogong Wang*a
aDepartment of Chemical Engineering, Laboratory of Advanced Materials (MOE), Tsinghua University, Beijing, 100084, P. R. China. E-mail: wxg-dce@mail.tsinghua.edu.cn
bDepartment of Chemistry & Materials Science, Tokyo Institute of Technology, Ookayama 2-12-1-E4-5, Meguro-ku, Tokyo 152-8552, Japan. E-mail: sando@polymer.titech.ac.jp

Received 3rd April 2014 , Accepted 30th May 2014

First published on 30th May 2014


Abstract

A hydroxyl-terminated hyperbranched polyimide was synthesized via the A2 + B3 reaction between dianhydride and triamine monomers. The hydroxyl groups at the peripheral positions were then introduced by modification of the anhydride end groups via a reaction with 4-aminophenol. Based on the hydroxyl-terminated hyperbranched polyimide, HBPIBPADA-TAP(OH), we successfully fabricated hybrid ternary composites, which were comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and an inorganic SiO2 component. The material was designed to satisfy the requirement for cutting-edge insulators with a low dielectric constant and a high thermal stability. Because of the appropriate choice of the hybrid ternary composite systems with HBPIBPADA-TAP(OH) and inorganic silica, it is sensible to improve the dielectric properties and thermal resistant properties of unary systems or improve the disadvantages of the dielectric and optical properties of binary systems. For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% composite reaches the lowest value of 2.24 at 100 kHz. Research also showed that the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary linear PI 6FDA-APB–SiO2 composite, the transmittance increases from 1% to 75% at the wavelength of 450 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding 10% of HBPIBPADA-TAP(OH) to the PI6FDA-APB–SiO2-20% system, the coefficient of thermal expansion of the hybrid ternary composite is 20.9 ppm °C−1 in the temperature range from 100 to 150 °C, which is significantly lower than that of the linear polyimide (37.1 ppm °C−1 for PI6FDA-APB). Because of these optimized properties, hybrid ternary composites have the potential for use in applications in the micro-electronic insulator fields, such as interlayer dielectrics of advanced electronic devices.


Introduction

In the electrical and electronics industries, insulating interlayer materials with a low dielectric constant are urgently needed in order to improve the speed of electron flow transmission between the chips of large scale integrated circuits and to meet the requirement of high integration.1 Polyimide (PI) with low dielectric constant (low Dk) is a desirable insulator material for applications in high-speed and high-frequency circuits. The development of PI with low Dk has been the focus of several recent investigations.1–5 In recent years, research has been carried out on the organic–inorganic or other composite materials.2,6,8 The fabricated PI composites with well-designed organic–inorganic structures can reduce the Dk by utilizing the effects of air volume, air gap or pore voids,7,8 low polarization,9–11 and increased free volume.6,7,9,10,12 However, some drawbacks still remain in their thermal and mechanical properties as well as in the optical transparency. Therefore, there are some limitations for using them for real applications in the insulator material field. Generally speaking, ideal insulator materials should possess not only low dielectric properties, but also good mechanical properties and high thermal stability; in many cases, optical transparency is required as well. In order to satisfy these requirements, introducing the third component, such as a hyperbranched polymer, can be a promising way to reduce the dielectric constant and optimize the other properties at the same time.

Since they were reported by Kim and Webster in 1990,13 hyperbranched polymers (HBPs) have received considerable attention for applications in many fields.14 The properties of HBPs were predicted by Flory as early as 1952.15 The practical synthesis of HBPs can be traced back to the report by Kricheldorf et al. in 1982.16 HBPs are well known for their unique properties, such as possessing a large number of end groups, low solution viscosity, high solubility, and others. HBPs can be used where materials with improved properties are needed to supplement their linear analogues.

In recent years, hyperbranched polyimides (HBPIs) have been synthesized, characterized, and used for applications requiring high gas permeability with enlarged free volume.17–19 Those studies showed that there are many nano-scale open and accessible cavities (typically several angstroms in size) in a rigid branched structure.6,20,21 These characteristics have been exploited for the development of PI materials with improved properties.22,23

It is of particular interest to optimize the dielectric, optical, and thermal properties by using HBPI as an additional component in a unary or binary system. For a unary or binary system with an inorganic component,6,7,9,10,12,24 there is a limit to the faults that can be supplemented. For example, although addition of inorganic silica could reduce the dielectric constant, the composites often appear opaque because of phase-separation. Fluorine-containing PI with reduced charge transfer (CT) interactions are optically transparent in the visible region, but their dielectric constants and coefficients of thermal expansion are not satisfactory for their application as insulators. Therefore, there is a requirement to systematically investigate the function of HBPIs as additional components in the composites to obtain PI composites with optimized properties.

In this paper, the preparation and properties of a series of novel hybrid ternary composites of PIs with SiO2 are reported. The composites were prepared by using a hydroxyl-terminated hyperbranched polyimide (HBPIBPADA-TAP(OH)) synthesized in this study. HBPIBPADA-TAP(OH) and the precursor of a linear PI (PI6FDA-APB) were used to prepare the composites with inorganic silica using the sol–gel method. From the results, it was concluded that HBPIBPADA-TAP(OH) can be identified not only to have the effect to remedy the interaction faults between organic PI6FDA-APB and the inorganic silica network, but also to be effective at improving the comprehensive properties of the materials in a complementary manner. It can reduce the dielectric constant, enhance the optical transmittance, and does not have negative effects on the thermal stability. The hydroxyl terminated HBPI plays a key role in connecting PI components and the inorganic silica network. The preparation, structures and properties of the hybrid ternary composites are reported in the next sections.

Experimental section

Materials

4,4′-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA, 95%), 2,4,6-triaminopyrimidine (TAP, 98%), 1-hydroxy-cyclohexyl phenyl ketone, and 1,3-bis(3-aminophenoxy)benzene (APB, 98%) were purchased from Adamas Reagent Co. Ltd. 4,4′-Bis(4,4′-isopropylidene diphenoxy) bis-(phthalic anhydride) (BPADA 97%) was purchased from Sigma-Aldrich and Aladdin Chemical Company. 4-Amino-phenol was purchased from Tianjin Chemical Engineering Laboratory. N,N-Dimethylacetamide (DMAc, 98%), N,N-dimethylmethanamide (98%), tetrahydrofuran (THF, 98%), and toluene which were used as the reaction media were purchased from the Beijing Chemical Works and Alfa Aesar. The solvent N-methyl-2-pyrrolidone (NMP, 97%) was purchased from Beijing Modern East Fine Chemical. Hydrochloric acid (HCl) and tetraethoxysilane (TEOS, 98%) were purchased from Alfa Aesar and used without further purification. If it is not mentioned specifically, the reactants and solvents were used as received without further purification.

Synthesis

The synthetic routes of the materials are shown in Schemes 1–3, which include the preparations of PI6FDA-APB and its composite with silica (Scheme 1), the hydroxyl-terminated hyperbranched HBPIBPADA-TAP(OH) (Scheme 2), the hybrid ternary PI6FDA-APB–HBPIBPADA-TAP(OH)–SiO2 composites (Scheme 3). The preparation details are described next.
image file: c4ra02956a-s1.tif
Scheme 1 Synthetic route for the PI6FDA-APB and its composite with silica.

image file: c4ra02956a-s2.tif
Scheme 2 Synthetic route for the hydroxyl terminated hyperbranched HBPIBPADA-TAP(OH).

image file: c4ra02956a-s3.tif
Scheme 3 Synthetic route for the PI6FDA-APB–HBPIBPADA-TAP(OH)–SiO2 hybrid ternary composites.
Linear polyimide (PI6FDA-APB). The polymerization was performed by a traditional two-step condensation process. The polyamic acid (PAA) was firstly synthesized at 0 °C. Then, PAA was heated through several stages to a high temperature and then dehydrated to obtain the PI film. The diamine monomer, APB (0.657 g, 2.25 mmol) was dissolved in NMP (10 wt%) and cooled in an ice water bath. After complete dissolution, the anhydride monomer, 6FDA (1 g, 2.25 mmol) was added to the solution with stirring. The reaction to obtain the PAA solution proceeded, with magnetic stirring at 40 °C, for 24 h. The PAA solution was cast on a piece of glass plate and heated at 80 °C for 2 h. The film was thermally imidized by stepwise heating at 150 °C (1 h), 200 °C (1 h), and 300 °C (1 h). FTIR (KBr, cm−1): 1783 cm−1 (C[double bond, length as m-dash]O sym. str.); 1720 cm−1 (C[double bond, length as m-dash]O asym. str.); 1585, 1479, 1448 cm−1 (C[double bond, length as m-dash]C str. Ar.); 1367 cm−1 (C–N str. imide); 1238, 1187 cm−1 (Ar–O–Ar); 1137 cm−1 (–CF3); 960, 844 cm−1(Ar–H); 779, 717 cm−1 (Subst. Ar.); and 1660–1670 cm−1 (Non PAA structure band).
Linear polyimide–silica hybrid composite (PI6FDA-APB–SiO2-20%). The preparation of the linear silica composite was carried out by a typical sol–gel method (Scheme 1). The preparation of the composite containing 20 mol% SiO2 is given here as a typical example. Stoichiometric quantities of TEOS in DMAc (10 wt%, 1.38 g), and HCl in deionized water (0.1 N, 0.048 g) were mixed and stirred at room temperature for 0.5 h to form the SiO2 sol. Then, the SiO2 sol was added dropwise to the PAA solution (10 wt%, 2 g) with stirring. The mixture was then stirred at room temperature for 6 h and a PAA/SiO2 precursor was obtained. In the second stage, the PAA/SiO2 precursor solution was cast on a glass plate and heated at 80 °C for 2 h. The film was then thermally imidized by step-wise heating at 150 °C (1 h), 200 °C (1 h), and 300 °C (1 h) to obtain the PAA6FDA-APB–SiO2 composite. FTIR (KBr, cm−1): 1783 cm−1 (C[double bond, length as m-dash]O sym. str.); 1720 cm−1 (C[double bond, length as m-dash]O asym. str.); 1585, 1479 cm−1 (C[double bond, length as m-dash]C str. Ar.); 1369 cm−1 (C–N str. imide); 1240, 1189 cm −1 (Ar–O–Ar); 1137 cm −1 (–CF3); 1068–1003 cm−1 (Si–O–Si); 960 cm −1(Ar–H); 890 cm−1 (Si–OH); 844 cm−1(Ar–H); 779, 717 cm−1 (Subst. Ar.); and 1660–1670 cm−1 (Non PAA structure band).
Hydroxyl terminated hyperbranched polyimide (HBPIBPADA-TAP(OH)). The anhydride terminated HBPI was prepared by A2 + B3 polycondensation (Scheme 2).15,25,26 The molar ratio of dianhydride/triamine was at 2[thin space (1/6-em)]:[thin space (1/6-em)]1. TAP (0.06 g, 0.48 mmol) and BPADA (0.50 g, 0.96 mmol) were dissolved in NMP (100 mL) to obtain a solution with 60 wt% solid content. After reaction with stirring at 40 °C for 12 h, the anhydride-terminated hyperbranched polyamic acid (HBPAA) was obtained. An excess of 4-aminophenol (0.058 g, 0.53 mmol), and NMP (21 mL) were added to the HBPAA solution and the mixture was stirred with a magnetic bar at 40 °C for 24 h. Then toluene (50 mL) was added dropwise into the mixture and the reaction was carried out at 180 °C for 36 h under nitrogen gas protection. The mixture was poured into methanol and the gray powder was precipitated out. The product was obtained by filtration and dried under vacuum at 80 °C for 3 h. Yield = 82%. Mw = 8700, Mn = 3100, polydispersity index (PDI) (Mw/Mn) = 2.8. 1H-NMR (600 MHz, deuterated dimethylsulfoxide), δ (ppm): 9.73 (OH, 1Hj), 7.88 (CH, 2Hf), 7.4–7.2 (CH, 4Hb, 2He), 7.29 (CH, 2Hd), 7.10 (CH, 4Hg), 7.01 (CH, 4Hc), 6.82 (CH, 2Hh), 3.71 (CH, 1Hi), 1.67 (CH3, 6Ha). FTIR (KBr, cm−1): 3500–3000 cm−1 (OH); 2967 cm−1 (CH3 asym. str.); 1785 cm−1 (C[double bond, length as m-dash]O sym. str.); 1731 cm−1 (C[double bond, length as m-dash]O asym. str.); 1618 cm−1 (N–C[double bond, length as m-dash]N); 1598, 1479 cm−1 (C[double bond, length as m-dash]C str. Ar.); 1440 cm−1 (CH3); 1384 cm−1 (C–N str. imide.); 1272, 1236 cm−1 (Ar–O–Ar); 1175 cm−1 (CH3); 1014, 855, 717 cm−1 (Subst. Ar.); and 1660–1670 cm−1 (Non PAA structure band).
PI6FDA-APB–HBPIBPADA-TAP(OH)–SiO2 hybrid ternary composites. The hybrid ternary composites were prepared by using a typical sol–gel method (Scheme 3). As the methods for preparing the hybrid ternary composites are the same, to avoid repetition, only one of the methods for preparing the composite (PI6FDA-APB–HBPIBPADA-TAP(OH)-20%–SiO2-20%) is given here as a typical example. Stoichiometric quantities of TEOS in DMAc (10 wt%, 1.38 g), and HCl in deionized water (0.1 N, 0.048 g) were mixed and stirred at room temperature for 0.5 h to form the SiO2 sol. Then, the SiO2 solution was added dropwise into the solution of linear PAA (10 wt%, 2 g) and HBPIBPADA-TAP(OH) (0.04 g) with stirring. The mixture was stirred at room temperature for 12 h to obtain PI6FDA-APB–HBPIBPADA-TAP(OH)-20%–SiO2-20% precursor. In the second stage, the precursor solution was cast on to a glass plate and heated at 80 °C for 2 h. The film was then thermally imidized by step-wise heating at 150 °C (1 h), 200 °C (1 h), and 300 °C (1 h).

The hybrid ternary composites with different compositions were prepared by a similar method by adjusting the composition of the PI and silica. The film formation property of the hybrid ternary composite depended on the contents of the HBPIBPADA-TAP(OH) and TEOS. By using the linear PAA and HBPI, the hybrid ternary composites were prepared successfully. The films are called: SA-1 ∼ SA-5 for PI6FDA-APB–HBPIBPADA-TAP(OH)-0% ∼ 40%–SiO2-20%, where the percentage given in the generic abbreviations is the weight percentage relative to the linear PI calculated from the reactant amounts. The FTIR results of the hybrid ternary composites are:

SA-2, SA-3, SA-5: FTIR (KBr, cm−1): 2967 cm−1 (CH3 asym. str.); 1783 cm−1 (C[double bond, length as m-dash]O sym. str.); 1720 cm−1 (C[double bond, length as m-dash]O asym. str.); 1585, 1477 cm−1 (C[double bond, length as m-dash]C str. Ar.); 1369 cm−1 (C–N str. imide); 1238, 1189 cm −1 (Ar–O–Ar); 1137 cm −1 (–CF3); 1068–1003 cm−1 (Si–O–Si); 960 cm −1(Ar–H); 890 cm−1 (Si–OH); 846 cm−1(Ar–H); 779, 717 cm−1 (Subst. Ar.); and 1660–1670 cm−1 (Non PAA structure band).

SA-4: FTIR (KBr, cm−1): 2967 cm−1 (CH3 asym. str.); 1783 cm−1 (C[double bond, length as m-dash]O sym. str.); 1720 cm−1 (C[double bond, length as m-dash]O asym. str.); 1585, 1477 cm−1 (C[double bond, length as m-dash]C str. Ar.); 1371 cm−1 (C–N str. imide); 1236, 1189 cm−1 (Ar–O–Ar); 1137 cm−1 (–CF3); 1068–1003 cm−1 (Si–O–Si); 960 cm−1(Ar–H); 890 cm−1 (Si–OH); 846 cm−1(Ar–H); 779, 717 cm−1 (Subst. Ar.); and 1660–1670 cm−1 (Non PAA structure band).

Characterization

Proton nuclear magnetic resonance (1H-NMR, 600 MHz) spectra were recorded on a JNM-ECA600 NMR spectrometer (JEOL). Fourier transform infrared (FTIR) spectroscopic measurements were performed using a Magna-IR 560 FTIR spectrophotometer (Nicolet) on samples incorporated in KBr disks. The spectra were recorded in the range of 4000–450 cm−1 at a resolution of 0.35 cm−1. The molecular weights and molecular weight distributions were determined by using GPC gel permeation chromatography (GPC) at room temperature with THF as eluent at a flow rate of 1 mL min−1. The instrument was equipped with a Optilab T-rEX refractive index detector (Wyatt Technology) and fitted with a PLgel 5 μm mixed-D column (Agilent). The data were calibrated with linear polystyrene standards. The thermal properties were characterized by differential scanning calorimeter (DSC), thermal gravimetric analysis (TGA), and dynamic mechanical analysis (DMA). TGA was performed with a TGA 2050 thermogravimetric analyzer (TA Instruments) at a heating rate of 20 °C from room temperature to 900 °C under a continuous flow of nitrogen. Thermal phase transitions of the polymers were scanned using a DSC 2910 (TA Instrument Co.) with a heating rate of 20 °C min−1 under a nitrogen atmosphere. The dielectric constant was determined using a NOVOCOOL Alpha-ANB (Novocontrol Technologies GmbH & Co. KG) dielectric analyzer with silver paint electrodes, at room temperature with scan frequencies from 106 Hz to 1 Hz, and the reference was a commercial Kapton® HN type PI (Dk = 3.81 at 100 kHz). The thickness of the specimens was controlled to be 23–35 μm. The coefficient of thermal expansion (CTE) parallel to the film surfaces were measured using a DMA Q800 dynamic mechanical analyzer 9TA Instruments in extension mode over a temperature range from 25 to 320 °C with a force of 0.01 N. The samples used for the measurements were 14 mm in length, 5 mm in width, and 21–55 μm in thickness.

UV-visible absorption spectra of the films were measured on a Lamba Bio-40 spectrophotometer (Perkin-Elmer). Cross-sectional images of the PI hybrid films were studied by scanning electron microscopy (SEM). The SEM images were obtained using a S5500 electron microscope (Hitachi) operating at an acceleration voltage of 5.0 kV.

Results and Discussion

Synthesis and Characterization

A series of hybrid composites were prepared in this study. To facilitate the discussions, the abbreviations SA-1 ∼ SA-5 are used to denote the hybrid composites PI6FDA-APB–HBPIBPADA-TAP(OH)-0% ∼ 40%–SiO2-20%. For comparison, a linear polyimide (PI6FDA-APB) was also prepared and is referred to as S-1 in the following discussion. The chemical structure and synthetic routes of the materials are shown in Scheme 1–3. The preparation details are described in the experimental part of the paper.

The hydroxyl-terminated HBPIBPADA-TAP(OH) is a key component for preparing the hybrid ternary composites, which was synthesized by the A2 + B3 polycondensation method. The number average molecular weight (Mn) and PDI (Mw/Mn) of HBPIBPADA-TAP(OH) were 3100 and 2.8, respectively. The molecular structure of the hyperbranched PI was determined by 1H-NMR and FTIR. Fig. 1 shows the 1H-NMR spectrum of HBPIBPADA-TAP(OH) and the assignment of the resonance signals. The signals corresponding to the HBPI main-chain can be clearly identified from the spectrum. The resonance signal of the hydroxyl group appears at 9.73 ppm. It is the hydroxyl terminal groups in HBPI from 4-aminophenol.27 The signals at 6.82–7.88 ppm correspond to the benzene protons from BPADA (dianhydride monomer) and the 4-aminophenol (terminating agent). The resonance at 3.71 ppm is –CH from the TAP monomer. The characteristic signal at 1.67 ppm corresponds to the methyl protons from the –CH3 of BPADA. This spectral evidence reveals that the hydroxyl terminated HBPI has been successfully prepared.


image file: c4ra02956a-f1.tif
Fig. 1 1H-NMR spectra of the hydroxyl terminated hyperbranched polyimide (HBPIBPADA-TAP(OH)).

The FTIR spectra of HBPIBPADA-TAP(OH), linear PI (S-1), and the composites (Series SA-1 ∼ SA-5) are shown in Fig. 2. From the FTIR spectra of HBPIBPADA-TAP(OH) and S-1, the absorption bands of the imide groups are observed at 1785–1781 and 1731–1720 cm−1 for the symmetric and anti-symmetric stretching vibrations of the carbonyl group. No obvious absorption bands of PAAs can be seen in the range form 1660 to 1670 cm−1. The absorption band of the hydroxyl group (–OH) of HBPIBPADA-TAP(OH) is clearly observed between 3500 cm−1 and 3000 cm−1 of the FTIR spectrum. It also proves that the hydroxyl groups from 4-aminophenol are successfully introduced into the termini of the hyperbranched polyimide.


image file: c4ra02956a-f2.tif
Fig. 2 FTIR spectra of hydroxyl-terminated hyperbranched polyimide, linear polyimide (S-1), and PI/SiO2 hybrid ternary composites, SA-1 ∼ 5 (PI6FDA-APB–HBPI BPADA-TAP(OH)-0% ∼ 40%–SiO2-20%).

It can be seen that the absorption intensity of the bands around 1783 and 1720 cm−1 (C[double bond, length as m-dash]O stretching vibrations) increases with the increase of the amount of HBPIBPADA-TAP(OH) by using the intensity of SiO2 as the standard. The FTIR spectra of SA-1 ∼ 5 show significant absorption band shifts related to the transformation during the synthesis of the ternary composites. The absorption bands of the C[double bond, length as m-dash]O shift are from 1785 and 1731 cm−1 for HBPIBPADA-TAP(OH) to 1783–1781 and 1720 cm−1 for the hybrid ternary composites.

The absorption bands of C–N are shifted from 1384 cm−1 for HBPIBPADA-TAP(OH) to 1371–1369 cm−1 for the hybrid ternary composites, and the bands for C–O–C between aromatic rings are also shifted from 1272 and 1236 cm−1 for HBPIBPADA-TAP(OH) to 1240–1238 cm−1 and 1189–1187 cm−1 for the hybrid ternary composites. These band-shifts are related to the reactions between the hydroxyl groups of HBPIBPADA-TAP(OH) and Si–OH of TEOS, which enhance the molecular interactions. Therefore, with the increase of the percentage of HBPIBPADA-TAP(OH), the characteristic bands of C[double bond, length as m-dash]O, C–N, and C–O are gradually shifted to lower wavenumbers accompanied by the increase of their absorption intensities. Because of the completed imidization, no obvious absorption bands of PAAs are observed in the range between 1660 and 1670 cm−1.

In addition to the spectral characteristics related to the organic components, the FTIR spectra show absorption bands around 1000–1100 cm−1 (Si–O–Si symmetric stretching vibrations) and 890 cm−1 (Si–OH). The absorption bands show that the composites contain the inorganic component obtained from TEOS (SA-1 ∼ SA-5). It also verifies that not only are the PI precursors fully imidized, but also that the inorganic silica networks are formed in the hybrid ternary composites.

Morphology of hybrid ternary composites

Fig. 3 shows the typical SEM images of the PI and representative composite films. The reinforcement of HBPIBPADA-TAP(OH) to the binding with PI6FDA-APB and dispersion of SiO2 in the matrix can be confirmed by the morphology. Fig. 3(a) shows the PI6FDA-APB (S-1) without the inorganic component. For the composite of PI6FDA-APB and SiO2 (PI6FDA-APB–SiO2-20%, SA-1), the aggregated silica particles can be clearly seen as spherical beads with a smooth surface, which have an average diameter of around 1500 nm (Fig. 3(b)). When the hyperbranched PI is introduced, the dispersion of SiO2 in the PI matrix is dramatically improved. For the ternary composites, such as PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% (SA-4), the SEM observation indicates that HBPIBPADA-TAP(OH) has an obvious effect in reducing the phase separation of SiO2 (Fig 3(c) and 3(d)). The size of silica particles is significantly reduced and only particles with diameters of around 100–200 nm can be seen. The adhesion between PI and the inorganic component is also improved, which can be seen by the interface between the particles and matrix. Moreover, the image reveals that nano-scaled cavities exist in the hybrid ternary composite.
image file: c4ra02956a-f3.tif
Fig. 3 Typical SEM images of PI and the composites, (a) PI6FDA-APB (S-1), (b) PI6FDA-APB–SiO2-20% (SA-1), (c) and (d) PI6FDA-APB_HBPIBPADA-TAP(OH)-30%–SiO2-20% (SA-4); scale bar: 2 μm (a, b, and c) and 500 nm (d).

The function of HBPIBPADA-TAP(OH) to reduce the phase separation can be attributed to the peripheral hydroxyl (–OH) groups of the HBPI, which can form covalent linkages to the silica network. This enhanced interaction between the components can effectively reduce the aggregation of silica and suppress the phase separation between the PIs and the silica network. As will be discussed in the following sections, because of this effect, the transmittance of the composites can be significantly improved by incorporating an HBPIBPADA-TAP(OH) component into the PI6FDA-APB and the SiO2 composite. The decrease in dielectric constants (Dk) at the frequencies between 1 and 103 Hz can also be attributed to the reduced phase separation.

Dielectric properties of the hybrid ternary composites

Fig. 4(a) shows the dielectric constants (Dk) of the films measured at room temperature with the scanning frequencies from 106 (1 MHz) to 1 Hz, which is a typical range for applied current electric insulator devices. The dielectric constants of this series of hybrid ternary composites are compared with PI6FDA-APB (S-1), PI6FDA-APB–SiO2-20% (SA-1) and a commercial Kapton® HN type PI. The dielectric constants (Dk) show an increase with the decreasing frequency, which is typical behavior of the frequency dependence of Dk for solid matters.28 This frequency-dependent behavior can be described by the Cole–Cole equation,29
 
ε* − ε = (ε0ε)/[1 + (iωτ0)1−α] (1)
where: ε* is the complex dielectric constant, ε0 and ε are the dielectric constants at “static” and “infinite frequency”, ω = 2π times the frequency, and τ0 is a generalized relaxation time. The exponent parameter α can assume a certain value between 0 and 1, in which the former case corresponds to the result by Debye for polar dielectrics.29

image file: c4ra02956a-f4.tif
Fig. 4 Dielectric constant (Dk) of the linear polyimide (S-1) and hyperbranched polyimide with PI/SiO2 hybrid ternary composite films SA-1 ∼ 5 (PI6FDA-APB–HBPIBPADA-TAP(OH)-0% ∼ 40%–SiO2-20%), (a) scanning frequency from 106 to 1 Hz, (b) frequency is 100 kHz.

The dielectric constants of the films prepared in this study are significantly smaller than that of the Kapton® HN type PI. Compared with the two PIs, the Kapton® HN type PI and S-1, the dielectric constants of the organic–inorganic composites show a more significant dependence on the frequency, which shows a sudden drop in the characteristic frequencies. Therefore, in the high frequency range (>103 Hz), the dielectric constants of the composites are all lower than PI6FDA-APB (S-1). The decrease of the Dk in the 1 Hz to 103 Hz range shown in Fig. 4(a) is related to a decrease in space charge polarization between organic and inorganic phases. It is interesting to note that by adding the HBPI (HBPIBPADA-TAP(OH)) as the third component, the dielectric constants of the hybrid ternary composites (SA-2 ∼ SA-5) are always lower than the binary composite (SA-1). Especially for the optimized condition, PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% (SA-4) exhibits the lowest Dk compared with others.

The effect of HBPIBPADA-TAP(OH) to reduce Dk can be attributed to the effect of the HBPI component to enhance the homogeneous dispersion of silica in the system. HBPIBPADA-TAP(OH) is highly compatible with PI6FDA-APB through hydrogen bonding and other intermolecular interactions. More importantly, it can react with inorganic silica networks in the Si–OH/SiO2 transformation of TEOS. Because HBPIBPADA-TAP(OH) can improve the inorganic–organic phase dispersion, it plays a very important role in reducing the dielectric constant of hybrid ternary composites. The effect of reducing the dielectric constants can also be attributed to nano-scale cavities (typically several angstroms in size) in the branched structure for hyperbranched polymers.6,20,21

The dielectric constants measured at 100 kHz for this series of hybrid ternary composites are listed in Table 1 together with the data for PI6FDA-APB (S-1) and PI6FDA-APB–SiO2-20% (SA-1) for comparison. The dielectric constants of PIs determined at this frequency are related to the fast polarizability of the films. The results are also given in Fig. 4(b). The binary composite (SA-1) shows a lower dielectric constant than that of the linear PI (S-1), which is reduced from 2.90 to 2.70. After the addition of the HBPI (HBPIBPADA-TAP(OH)) into the composites, the dielectric constants of the hybrid ternary composites (SA-2 ∼ 5) further decrease. For PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% (SA-4), the composite achieves the lowest dielectric constant (Dk = 2.24). When the content of HBPIBPADA-TAP(OH) exceeds this critical point, the dielectric constant of the hybrid ternary composite begins to slightly increase with increase in the amount of HBPIBPADA-TAP(OH) as shown for SA-5. This increase could be attributed to the aggregation and poor dispersion of the excess HBPIBPADA-TAP(OH) in the system.

Table 1 The parameters and properties of hydroxyl terminated HBPI with PI/SiO2 hybrid ternary composites
Sample Thicknessa μm Dkb λcutoff nm Transmittance DSC TGA CTEe ppm °C−1
450 nm/% 400 nm/% Tg /°C Td5%c/°C Td10%c/°C Rw800d /%
a The thickness of specimens for dielectric constant measurement.b Measuring at frequency of 100 kHz.c Temperatures at which 5% and 10% weight loss occurred, respectively, recorded by TGA at a heating rate of 20 °C min−1 and a N2 gas flow rate of 25 cm3 min−1.d Residual weight percentages at 800 °C.e The temperature range from 100 to 150 °C with a force of 0.01 N.
S-1 PI 24 2.90 325 94 81 205.1 549 571 53 37.1
SA-1 PI_SiO2-20% 25 2.70 331 1 1 205.0 527 565 57 17.8
SA-2 PI_HBPI(OH)-10%–SiO2-20% 24 2.63 327 2 1 197.6 487 552 58 20.9
SA-3 PI_HBPI(OH)-20%–SiO2-20% 27 2.34 324 9 4 200.5 487 547 57 23.1
SA-4 PI_HBPI(OH)-30%–SiO2-20% 23 2.24 326 75 50 200.2 485 533 54 28.7
SA-5 PI_HBPI(OH)-40%–SiO2-20% 35 2.35 326 33 14 192.2 481 538 53 29.5


The results above indicate that the incorporation of HBPIBPADA-TAP(OH) shows a significant effect in lowering the dielectric constant, which can be attributed to the improvement of the dispersion of inorganic silica in the hybrid ternary composites and the nano-scale cavities of the hyperbranched structures. Therefore, the phase uniformity is enhanced by introducing an HBPI component up to 30%, which reduces the space charge polarization between the organic and inorganic phases. Meanwhile, this low value can also be attributed to the other characteristics of monomers and polymers, i.e., the high fluorine content from 6FDA,30,31 the flexible or kinked structures from APB,32,33 and the bulky substituent structure from BPADA.34–36 In addition to these effects, the introduction of inorganic silica can effectively reduce humidity absorption of the material and enhances the free volume.28

Optical properties of the hybrid ternary composites

The optical transparency of the linear PI (S-1), binary composite (SA-1) and hybrid ternary composite (SA-2 ∼ 5) was measured with UV-Vis spectroscopy. Fig. 5 shows the UV-Vis transmission spectra of the films. The cutoff wavelengths (absorption edge, λcutoff) and the transmittance at 450 nm and 400 nm are obtained from these spectra and listed in Table 1. S-1 (PI6FDA-APB) shows the highest transmittance of 94% at 450 nm, and the film is entirely colorless. This is because it contains not only meta-linked diphenylether linkages from the APB moiety but also contains low polarizable fluorine (C–F) substituents from the 6FDA monomer, both of which are beneficial to the high optical transparency. The rigid and kinked molecular structure prevents dense chain packing and π-electron transfer between benzene and the imide rings. These factors effectively reduce the intermolecular CT-complex formation between the polymer backbones through the steric hindrance and the inductive effect by reducing the electron-donating capabilities of diamine moieties.
image file: c4ra02956a-f5.tif
Fig. 5 UV-Vis spectra of linear polyimide (S-1) and HBPI with PI/SiO2 hybrid ternary composites for SA-1 ∼ 5 (PI6FDA-APB–HBPIBPADA-TAP(OH)-0% ∼ 40%–SiO2-20%).

After incorporating SiO2 (20 wt%) into the PI system, the appearance of the SA-1 film becomes opaque and its transmittance is significantly decreased, which is attributed to the light scattering and opacity caused by the aggregated inorganic silica phase at the wavelength scale or above in the film. However, it is interesting to note that after introducing the HBPIBPADA-TAP(OH) component into the PI6FDA-APB and SiO2 composite, the transmittance of the hybrid ternary composites is significantly improved until the amount of the hyperbranched PI component reaches 30%.

When the content of HBPIBPADA-TAP(OH) is 30% (SA-4), the transmittance is the highest in the series of the hybrid composites (SA-1 ∼ 5), and shows a transmittance of about 75% at 450 nm. This content of HBPIBPADA-TAP(OH) is appropriate for improving not only the optical properties but also the dielectric properties of the hybrid films. However, the transmittance of SA-5 (PI6FDA-APB–HBPIBPADA-TAP(OH)-40%–SiO2-20%) is reduced. It could be caused by the excess of hydroxyl groups on the terminal surface of HBPIBPADA-TAP(OH) (40%) for SiO2-20%, which could cause inhomogeneous phase separation because of the strong aggregation and poor dispersion of HBPIBPADA-TAP(OH). This seems to be the same cause for the increased dielectric constant discussed in the previous section.

This result further confirms that HBPIBPADA-TAP(OH) reduces organic–inorganic phase separation which was revealed by SEM observations. As mentioned above, this effect is attributed to the hydroxyl groups of HBPIBPADA-TAP(OH) which introduce the linkage to the silica network and reduce the phase separation between PIs and the silica network. As a consequence, the size of the silica particles is decreased by enhanced interaction between the components. Because of this effect, the light scattering and opacity observed for SA-1 (PI6FDA-APB–SiO2-20%) film, which are caused by silica phase aggregation at the wavelength scale or above, can be significantly improved. The phase uniformity enhanced by introducing the HBPI component reduces both the dielectric constant and the light scattering to a proper level.

Thermal properties of the hybrid ternary composites

The thermal phase transition behavior of the hybrid ternary composites and related materials was investigated by DSC. The results are shown in Fig. 6(a) and summarized in Table 1. The hybrid ternary composites and related materials all show the phase transition behavior of an amorphous material, which means that the PI components exist in the amorphous phase. The hybrid ternary composites SA-2 ∼ 5 show Tg values ranging from 200.5 to 192.2 °C. The Tg of S-1 is 205.1 °C and the Tg of the binary composite with 20 wt% SiO2 (SA-1) is 205.0 °C. After adding HBPIBPADA-TAP(OH), the Tg of the hybrid films becomes slightly lower than those of S-1 and SA-1. However, the differences in Tg of SA-2 to SA-4 are only a few degrees. The Tg of SA-5 is 192.2 °C, which is lowest in the series. As HBPIBPADA-TAP(OH) has a hyperbranched structure and comparatively low molecular weight, it has a lower Tg compared with that of PI6FDA-APB. However, when its concentration is below the critical value, HBPIBPADA-TAP(OH) will not form a separate phase. Therefore, the addition of HBPIBPADA-TAP(OH) does not show an obvious effect of decreasing the Tg of the hybrid ternary composites. Only when its concentration is too high, will the negative effects on the Tg be seen.
image file: c4ra02956a-f6.tif
Fig. 6 Thermal properties of linear polyimide (S-1) and HBPI with PI/SiO2 hybrid ternary composites for SA-1 ∼ 5 (PI6FDA-APB–HBPIBPADA-TAP(OH)-0% ∼ 40%–SiO2-20%), (a) DSC, (b) TGA, and (c) CTE spectra.

The thermal decomposition temperatures of the hybrid ternary composites and related materials were measured by TGA analysis. The results are shown in Fig. 6(b) and summarized in Table 1. It can be observed for the SA series, that the residual weights of the organic–inorganic composites are nearly 100% below 400 °C. The hybrid ternary composites (SA-2 ∼ 5) show 5% weight loss at temperatures ranging from 487 to 481 °C, and 10% weight loss at temperatures ranging from 552 to 533 °C. The temperatures are obviously lower than those for the binary composite (527 and 565 °C for SA-1) and PI6FDA-APB (549 and 571 °C for S-1). It can also be seen that the thermal decomposition temperature decreases with the increase of the HBPIBPADA-TAP(OH) content in the systems. The decrease of the thermal decomposition temperatures is attributed to the property of the HBPIBPADA-TAP(OH) component.

The CTE of the hybrid ternary composites and related materials was characterized by DMA. The CTE curves are shown in Fig. 6(c) and the CTE values are listed in Table 1. The materials all show significant thermal expansion in the temperature range higher than 200 °C, which corresponds to the glass transition as revealed by DSC analysis.

By comparing the CTE values below the Tg, the hybrid composites exhibit significantly smaller CTEs than that of the linear PI (S-1). The reduced CTE value is caused by the addition of inorganic silica. The CTE value of SA-1 (17.8 ppm °C−1) is the smallest in the series. Compared to 37.1 ppm °C−1 for PI6FDA-APB, it is reduced by about 52%. For the hybrid ternary composites, SA-2 exhibits the most reduced CTE value (20.9 ppm °C−1), which contains 10% of HBPIBPADA-TAP(OH). However, the CTE values increase with the further increase of HBPIBPADA-TAP(OH). The effectively reduced CTE value for the composites can be ascribed to the well-dispersed silica particles, which obstruct the expansion of polymer chains at elevated temperatures. Furthermore, there are many nano-scale cavities (typically several angstroms in size) in the branched structure of hyperbranched polymers.6,20,21

As discussed previously, the structures can significantly reduce the dielectric constants of the hybrid ternary composites. However, the effect of the inorganic silica networks to reduce the CTE value is somehow counter-balanced by the HBPI component. This tendency can be seen by comparing the CTE values among the SA series. Even in this case, the CTE values of the hybrid ternary composites are still much smaller than that of the PI6FDA-APB. The results shown previously indicate that there is a significant improvement of dielectric properties and transparency by introducing HBPIBPADA-TAP(OH). Its faults on the thermal properties can be complemented by the inorganic silica networks in the ternary system. Therefore, the hybrid ternary composites are very promising candidates for producing materials with optimized properties.

Conclusion

We synthesized a hydroxyl-terminated HBPI (HBPIBPADA-TAP(OH)) via A2 + B3 condensation polymerization of TAP with BPADA and a post-polymerization reaction with 4-aminophenol. Based on HBPIBPADA-TAP(OH), a series of hybrid ternary composites were fabricated by using a linear PI (PI6FDA-APB) and inorganic silica (SiO2) through the sol–gel method. The hybrid ternary composites exhibit improved dielectric properties as an insulating material. At the appropriate content of HBPIBPADA-TAP(OH), the dielectric constant can reach the lowest value of 2.24 for PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% (SA-4) in this series. The optical transmittance of the composites are also significantly improved with increasing HBPIBPADA-TAP(OH). The best result for the hybrid ternary composites was obtained for SA-4, where the corresponding transmittance at 450 nm was improved from 1% for the binary composite (SA-1) to 75% for SA-4. The CTE value of PI6FDA-APB can be significantly reduced by introducing the inorganic SiO2 phase. Although, incorporation of HBPIBPADA-TAP(OH) will counter-balance the effect of SiO2, the PI6FDA-APB–HBPIBPADA-TAP(OH)-10%–SiO2-20% composite (SA-2) still exhibits the small CTE value of 20.9 ppm °C−1. Compared to 37.1 ppm °C−1 for PI6FDA-APB, a reduction of 43% is obtained. The CTE value for the ternary composite with the lowest Dk (SA-4) is 28.7 ppm °C−1, which corresponds to a decrease of CTE of 24%.

In general, from the results of these hybrid ternary composites, it can be concluded that the hydroxyl-terminated HBPI (HBPIBPADA-TAP(OH)) is a new promising modifier to reduce dielectric constants and improve the overall performance for PI6FDA-APB–SiO2 (SA-1) binary systems. The fabricated hybrid ternary composites with HBPIBPADA-TAP(OH) can be complementary in preventing the dielectric and thermal resistance drawbacks of unary (S-1) or dielectric and optical drawbacks of the binary system (SA-1) to improve overall properties. Thus, the hybrid ternary composite developed can meet the requirements for being an interlayer dielectric in advanced electronic devices.

Acknowledgements

The financial support from National Basic Research Program of China (973 Program) under Project 2011CB606102 and that for the academic visit of X. W. in Tokyo from Tokyo Institute of Technology are gratefully acknowledged.

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