Chi-Young Lee and Wen-Chung Yang
A low-pressure chemical vapor system which deposits tungsten based thin films on a substrate, using a horizontal hot-wall reactor has been studied. WF6 and SiF2 were used as precursors to deposit materials containing tungsten, at temperatures between 100 and 800°C. Results demonstrate that a deposition temperature below 400
°C led to polycrystalline tungsten and silicon oxide. Tungsten films deposited at higher temperature (300–400
°C) were normally present in the α structure while for those tungsten films deposited at lower temperature (<300
°C), XRD patterns indicated mixed α and β phases. As the reaction temperature was increased to ≥500
°C, polycrystalline tungsten silicide and polycrystalline silicon were deposited on the surface of the substrate. This study investigates the effect of different processing conditions for forming W and WSi2 and the role of SiF2 in their formation.