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Issue 5, 2017
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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

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Abstract

A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2-propanol (CuF–IPA) complex as an additive. The sintering temperature used in this study was as low as 100 °C. Following sintering at a temperature of 100 °C, the lowest reported resistivity (8.8 × 10−7 Ω m) was achieved through the use of Cu-based metal–organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF–IPA complex.

Graphical abstract: Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

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Publication details

The article was received on 09 Oct 2016, accepted on 28 Nov 2016 and first published on 29 Nov 2016


Article type: Paper
DOI: 10.1039/C6TC04360G
J. Mater. Chem. C, 2017,5, 1033-1041
  • Open access: Creative Commons BY license
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    Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

    Y. Yong, M. T. Nguyen, T. Yonezawa, T. Asano, M. Matsubara, H. Tsukamoto, Y. Liao, T. Zhang, S. Isobe and Y. Nakagawa, J. Mater. Chem. C, 2017, 5, 1033
    DOI: 10.1039/C6TC04360G

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      [Original citation] - Published by The Royal Society of Chemistry (RSC) on behalf of the European Society for Photobiology, the European Photochemistry Association, and RSC.
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      [Original citation] - Published by The Royal Society of Chemistry.

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