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Issue 3, 2016
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Alkylsilyl compounds as enablers of atomic layer deposition: analysis of (Et3Si)3As through the GaAs process

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Abstract

A new chemistry has been developed to deposit GaAs, the quintessential compound semiconductor. The ALD process is based on a dechlorosilylation reaction between GaCl3 and (Et3Si)3As. Characteristic ALD growth was demonstrated, indicating good applicability of the alkylsilyl arsenide precursor. ALD of GaAs produced uniform, amorphous and stoichiometric films with low impurity content. This was done with saturating growth rates and an easily controlled film thickness. Crystallization was achieved by annealing. Even though the growth rate strongly decreased with increasing deposition temperature, good quality film growth was demonstrated at 175 to 200 °C, indicating the presence of an ALD window.

Graphical abstract: Alkylsilyl compounds as enablers of atomic layer deposition: analysis of (Et3Si)3As through the GaAs process

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Article information


Submitted
26 Sep 2015
Accepted
02 Dec 2015
First published
15 Dec 2015

J. Mater. Chem. C, 2016,4, 449-454
Article type
Paper

Alkylsilyl compounds as enablers of atomic layer deposition: analysis of (Et3Si)3As through the GaAs process

T. Sarnet, T. Hatanpää, M. Laitinen, T. Sajavaara, K. Mizohata, M. Ritala and M. Leskelä, J. Mater. Chem. C, 2016, 4, 449
DOI: 10.1039/C5TC03079J

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