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Issue 47, 2015
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Polymeric precursor for solution-processed amorphous silicon carbide

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Abstract

Amorphous silicon carbide (a-SiC) films are deposited via solution-based processes using a polymeric precursor solution consisting of polydihydrosilane with pendant hexyl groups. Unlike conventional polymeric precursors, this polymer neither requires catalysts nor oxidation for its synthesis and cross-linkage. Therefore, our polymeric precursor provides sufficient purity for the fabrication of solution-processed semiconducting a-SiC. Polymer-to-ceramic conversion is systematically investigated under various pyrolysis temperatures ranging from 320 °C to 420 °C. The polymer primarily undergoes cross-linking at temperatures above 150 °C with increasing polymer fraction; this cross-linking is followed by carbon atoms being incorporated into an amorphous network at 380 °C. The incorporated carbon atoms in the film are predominantly in the sp3-bonding state with almost no amorphous graphite-like sp2 C[double bond, length as m-dash]C clusters, leading to marked changes in the film's properties. The conductivity values of the resulting a-SiC films are comparable with those of semiconducting a-SiC films prepared using vacuum-based deposition.

Graphical abstract: Polymeric precursor for solution-processed amorphous silicon carbide

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Article information


Submitted
03 Oct 2015
Accepted
30 Oct 2015
First published
30 Oct 2015

J. Mater. Chem. C, 2015,3, 12212-12219
Article type
Paper
Author version available

Polymeric precursor for solution-processed amorphous silicon carbide

T. Masuda, A. Iwasaka, H. Takagishi and T. Shimoda, J. Mater. Chem. C, 2015, 3, 12212
DOI: 10.1039/C5TC03169A

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