Issue 37, 2017

An easily manipulated protocol for patterning of MXenes on paper for planar micro-supercapacitors

Abstract

Recently, a unique class of bidimensional layered transition-metal carbides/nitrides, namely MXenes, has shown great potential for use in high-performance on-chip microsupercapacitors (MSCs). Patterning of MXenes on film substrates to form coplanar interdigital electrodes is the key to realize the fabrication of high-performance MXene-based planar MSCs. Herein, through a combination of ordinary laser printing, vacuum-assisted deposition and physical sputtering, a simple protocol for fast and on-demand patterning of few-layered MXene flakes on paper into a coplanar arrangement to fabricate planar symmetric MSCs is reported. Benefiting from the as-obtained binder/conductive-additive free MXene-based interdigital electrodes with a unique layered porous structure and high electrical conductivity attributed to the good alignment along the c-axis of the closely restacked few-layered MXene flakes, the as-fabricated all-solid-state planar MXene-based symmetric MSCs can acquire a maximal areal capacitance of 27.29 mF cm−2 as the thickness of the MXene electroactive layer increases, achieving at least 460% enhancement compared to the value of advanced carbon-based planar symmetric MSCs (0.1–6 mF cm−2), without obvious deterioration of the volumetric capacitance. Our work provides a simple and convenient platform to fabricate MXene-based on-chip symmetric MSCs with thick coplanar interdigital electrodes to increase the capacity per device within a limited footprint.

Graphical abstract: An easily manipulated protocol for patterning of MXenes on paper for planar micro-supercapacitors

Supplementary files

Article information

Article type
Paper
Submitted
31 May 2017
Accepted
12 Jul 2017
First published
13 Jul 2017

J. Mater. Chem. A, 2017,5, 19639-19648

An easily manipulated protocol for patterning of MXenes on paper for planar micro-supercapacitors

H. Hu and T. Hua, J. Mater. Chem. A, 2017, 5, 19639 DOI: 10.1039/C7TA04735E

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