Issue 17, 2020

Recrystallized ice-templated electroless plating for fabricating flexible transparent copper meshes

Abstract

Flexible transparent conductors as a replacement for indium tin oxide (ITO) have been urgently pursued due to the inherent drawbacks of ITO films. Here, we report the fabrication of flexible transparent copper meshes with recrystallized ice-crystal templates. Completely different to conventional approaches, this novel method needs neither the fabrication of mesh patterns via micro/nanofabrication technologies nor the deposition of copper through evaporation or sputtering. The linewidth and mesh size of the prepared copper meshes can be regulated, as the ice recrystallization process is controllable. Therefore, the formed copper meshes have tailorable conductivity and transparency, which are critical for optoelectronic devices. Remarkably, the electrical performance of the copper meshes is maintained even after storing for 60 days in ambient conditions or bending for 1000 cycles. This strategy is modular and can also be employed to prepare other metal meshes, such as silver meshes, offering versatile substitutes for ITO in electronic devices.

Graphical abstract: Recrystallized ice-templated electroless plating for fabricating flexible transparent copper meshes

Supplementary files

Article information

Article type
Paper
Submitted
31 Jan 2020
Accepted
25 Feb 2020
First published
09 Mar 2020
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2020,10, 9894-9901

Recrystallized ice-templated electroless plating for fabricating flexible transparent copper meshes

L. Li, Q. Fan, H. Xue, S. Zhang, S. Wu, Z. He and J. Wang, RSC Adv., 2020, 10, 9894 DOI: 10.1039/D0RA00916D

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