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Issue 69, 2018, Issue in Progress
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Boron carbide composites with highly aligned graphene nanoplatelets: light-weight and efficient electromagnetic interference shielding materials at high temperatures

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Abstract

B4C-based ceramic composites containing 0–2 vol% highly aligned graphene nanoplatelets (GNPs) are fabricated. The electromagnetic interference (EMI) shielding properties of the obtained composites are investigated at X-band (8.2–12.4 GHz) frequency range from room-temperature up to 800 °C. All composites exhibit outstanding EMI shielding properties with satisfactory frequency- and thermal-stability. The shielding effectiveness (SE) of GNP/B4C composites increases monotonically with increasing GNP loading. Superior room-temperature SE close to 40 dB is achieved with only 2 vol% GNPs and high SE around 35 dB still persists at 800 °C. Considering their relatively low density, GNP/B4C composites possess a high specific shielding effectiveness (SSE) of 16 dB cm3 g−1 which is among the highest values in reported ceramic-based shielding composites. Especially, the GNP/B4C composite with 2 vol% GNPs exhibits the highest SSE/t (SSE divided by thickness) values at temperatures above 200 °C for all reported shielding composites, indicating that GNP/B4C composites belong to the most promising high-temperature shielding composites. The excellent shielding properties of GNP/B4C composites arise mainly from the high electrical conductivity, high dielectric loss and the multiple reflections by the highly aligned and large-sized GNP layers.

Graphical abstract: Boron carbide composites with highly aligned graphene nanoplatelets: light-weight and efficient electromagnetic interference shielding materials at high temperatures

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Article information


Submitted
03 Sep 2018
Accepted
20 Nov 2018
First published
26 Nov 2018

This article is Open Access

RSC Adv., 2018,8, 39314-39320
Article type
Paper

Boron carbide composites with highly aligned graphene nanoplatelets: light-weight and efficient electromagnetic interference shielding materials at high temperatures

Y. Q. Tan, H. Luo, X. S. Zhou, S. M. Peng and H. B. Zhang, RSC Adv., 2018, 8, 39314
DOI: 10.1039/C8RA07351A

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