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Issue 48, 2019
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Thick grain boundary induced strengthening in nanocrystalline Ni alloy

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Abstract

Grain refinement has been extensively used to strengthen metallic materials for decades. Grain boundaries act as effective barriers to the transmission of dislocations, consequently leading to strengthening. Conventional grain boundaries have a thickness of 1–2 atomic layers, typically ∼0.5 nm for most metallic materials. Here, we report, however, the formation of ∼3 nm thick grain boundaries in a nanocrystalline Ni alloy. In situ micropillar compression studies coupled with molecular dynamics simulations suggest that the thick grain boundaries are stronger barriers than conventional grain boundaries to the transmission of dislocations. This study provides a fresh perspective for the design of high strength, deformable nanostructured metallic materials.

Graphical abstract: Thick grain boundary induced strengthening in nanocrystalline Ni alloy

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Article information


Submitted
09 Aug 2019
Accepted
01 Nov 2019
First published
04 Dec 2019

Nanoscale, 2019,11, 23449-23458
Article type
Paper

Thick grain boundary induced strengthening in nanocrystalline Ni alloy

J. Ding, D. Neffati, Q. Li, R. Su, J. Li, S. Xue, Z. Shang, Y. Zhang, H. Wang, Y. Kulkarni and X. Zhang, Nanoscale, 2019, 11, 23449
DOI: 10.1039/C9NR06843K

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