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Issue 12, 2010
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Nanoscale interface of metals for withstanding momentary shocks of compression

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Abstract

The failure of the nanoscale metallic interface has raised concerns owing to the effect interfacial amalgamation has on its application in nanoelectronic devices. Single crystal copper [110] and [100], which are set as two components of [110]‖[100] nanocrystalline copper, are used to simulate the interfacial properties using molecular dynamics simulations. Repeated tension and compression cycles show that the two components of the interface can come into contact and separate without interfacial amalgamation. The [110]‖[100] interface could withstand momentary shocks of compression and heat produced by the momentary shocks. This property of the [110]‖[100] interface is dominated by crystalline orientations of interfacial structure, in comparison with [111]‖[100] and [111]‖[110] interfaces under the same conditions.

Graphical abstract: Nanoscale interface of metals for withstanding momentary shocks of compression

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Publication details

The article was received on 21 May 2010, accepted on 12 Aug 2010 and first published on 14 Oct 2010


Article type: Paper
DOI: 10.1039/C0NR00333F
Nanoscale, 2010,2, 2818-2825

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    Nanoscale interface of metals for withstanding momentary shocks of compression

    F. Wang, Y. Liu, T. Zhu, Y. Gao and J. Zhao, Nanoscale, 2010, 2, 2818
    DOI: 10.1039/C0NR00333F

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