Issue 23, 2018

Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

Abstract

The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To understand this phenomenon, the mass change of a sample of alloys was investigated between 40 and 260 °C and the evolved gas was analyzed. In the quest to identify the unwanted deposits, a new strategy was researched and developed to increase the quantity of the produced deposit and to obtain it on a target surface for further studies. Unexpectedly, crystals were produced. The growth process of the crystals was optimized to reach crystal structures at nearly 1 mm in height. Unusual shapes were detected.

Graphical abstract: Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

Supplementary files

Article information

Article type
Paper
Submitted
15 Aug 2018
Accepted
18 Oct 2018
First published
24 Oct 2018

New J. Chem., 2018,42, 19232-19236

Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

F. Conti, A. Hanss, O. Mokhtari, S. K. Bhogaraju and G. Elger, New J. Chem., 2018, 42, 19232 DOI: 10.1039/C8NJ04173C

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