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Issue 4, 2017
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A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

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Abstract

The sealing of microfluidic devices remains a complex and time-consuming process requiring specific equipment and protocols: a universal method is thus highly desirable. We propose here the use of a commercially available sealing tape as a robust, versatile, reversible solution, compatible with cell and molecular biology protocols, and requiring only the application of manually achievable pressures. The performance of the seal was tested with regards to the most commonly used chip materials. For most materials, the bonding resisted 5 bars at room temperature and 1 bar at 95 °C. This method should find numerous uses, ranging from fast prototyping in the laboratory to implementation in low technology environments or industrial production.

Graphical abstract: A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

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Supplementary files

Article information


Submitted
24 Oct 2016
Accepted
15 Jan 2017
First published
16 Jan 2017

This article is Open Access

Lab Chip, 2017,17, 629-634
Article type
Communication

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

M. Serra, I. Pereiro, A. Yamada, J.-L. Viovy, S. Descroix and D. Ferraro, Lab Chip, 2017, 17, 629
DOI: 10.1039/C6LC01319H

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    [Original citation] - Published by The Royal Society of Chemistry (RSC) on behalf of the European Society for Photobiology, the European Photochemistry Association, and RSC.
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    [Original citation] - Published by The Royal Society of Chemistry.

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