MEMS within a Swagelok®: a new platform for microfluidic devices

Abstract

A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to ‘plug-n-play’ devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tubeassembly to be encapsulated within standard Swagelok^® connectors.