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Issue 26, 2012
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Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

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Abstract

Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 nΩ m. An “in situ cleaning” action of PVP is proposed during the bonding process.

Graphical abstract: Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

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Publication details

The article was received on 30 Mar 2012, accepted on 05 May 2012 and first published on 10 May 2012


Article type: Communication
DOI: 10.1039/C2JM31979A
Citation: J. Mater. Chem., 2012,22, 12997-13001

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    Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

    P. Peng, A. Hu, H. Huang, A. P. Gerlich, B. Zhao and Y. N. Zhou, J. Mater. Chem., 2012, 22, 12997
    DOI: 10.1039/C2JM31979A

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