Issue 32, 2021

Surface characterization and methane activation on SnOx/Cu2O/Cu(111) inverse oxide/metal catalysts

Abstract

To activate methane at low or medium temperatures is a difficult task and a pre-requisite for the conversion of this light alkane into high value chemicals. Herein, we report the preparation and characterizations of novel SnOx/Cu2O/Cu(111) interfaces that enable low-temperature methane activation. Scanning tunneling microscopy identified small, well-dispersed SnOx nanoclusters on the Cu2O/Cu(111) substrate with an average size of 8 Å, and such morphology was sustained up to 450 K in UHV annealing. Ambient pressure X-ray photoelectron spectroscopy showed that hydrocarbon species (CHx groups), the product of methane activation, were formed on SnOx/Cu2O/Cu(111) at a temperature as low as 300 K. An essential role of the SnOx–Cu2O interface was evinced by the SnOx coverage dependence. Systems with a small amount of tin oxide, 0.1–0.2 ML coverage, produced the highest concentration of adsorbed CHx groups. Calculations based on density functional theory showed a drastic reduction in the activation barrier for C–H bond cleavage when going from Cu2O/Cu(111) to SnOx/Cu2O/Cu(111). On the supported SnOx, the dissociation of methane was highly exothermic (ΔE ∼ −35 kcal mol−1) and the calculated barrier for activation (∼20 kcal mol−1) could be overcome at 300–500 K, target temperatures for the conversion of methane to high value chemicals.

Graphical abstract: Surface characterization and methane activation on SnOx/Cu2O/Cu(111) inverse oxide/metal catalysts

Supplementary files

Article information

Article type
Paper
Submitted
22 Jun 2021
Accepted
28 Jul 2021
First published
28 Jul 2021

Phys. Chem. Chem. Phys., 2021,23, 17186-17196

Author version available

Surface characterization and methane activation on SnOx/Cu2O/Cu(111) inverse oxide/metal catalysts

J. Kang, N. Rui, E. Huang, Y. Tian, M. Mahapatra, R. Rosales, I. Orozco, R. Shi, S. D. Senanayake, P. Liu and J. A. Rodriguez, Phys. Chem. Chem. Phys., 2021, 23, 17186 DOI: 10.1039/D1CP02829D

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