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Issue 4, 2015
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A flexible insulator of a hollow SiO2 sphere and polyimide hybrid for flexible OLEDs

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Abstract

The fabrication of interlayer dielectrics (ILDs) in flexible organic light-emitting diodes (OLEDs) not only requires flexible materials with a low dielectric constant, but also ones that possess the electrical, thermal, chemical, and mechanical properties required for optimal device performance. Porous polymer–silica hybrid materials were prepared to satisfy these requirements. Hollow SiO2 spheres were synthesized using atomic layer deposition (ALD) and a thermal calcination process. The hybrid film, which consists of hollow SiO2 spheres and polyimide, shows a low dielectric constant of 1.98 and excellent thermal stability up to 500 °C. After the bending test for 50 000 cycles, the porous hybrid film exhibits no degradation in its dielectric constant or leakage current. These results indicate that the hybrid film made up of hollow SiO2 spheres and polyimide (PI) is useful as a flexible insulator with a low dielectric constant and high thermal stability for flexible OLEDs.

Graphical abstract: A flexible insulator of a hollow SiO2 sphere and polyimide hybrid for flexible OLEDs

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Publication details

The article was received on 24 Sep 2014, accepted on 25 Nov 2014 and first published on 27 Nov 2014


Article type: Paper
DOI: 10.1039/C4CP04266B
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Phys. Chem. Chem. Phys., 2015,17, 2416-2420

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    A flexible insulator of a hollow SiO2 sphere and polyimide hybrid for flexible OLEDs

    M. K. Kim, D. W. Kim, D. W. Shin, S. J. Seo, H. K. Chung and J. B. Yoo, Phys. Chem. Chem. Phys., 2015, 17, 2416
    DOI: 10.1039/C4CP04266B

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