Issue 8, 2020
From the journal:

Chemical Communications

Metal-free C–C, C–O, C–S and C–N bond formation enabled by SBA-15 supported TFMSA†

Xiangyan Yi, ORCID logo ab   Jiajun Feng,ab   Fei Huang ORCID logo *ab  and  Jonathan Bayldon Baell ORCID logo *bc  

* Corresponding authors

a School of Pharmaceutical Science, Nanjing Tech University, Nanjing, China

b School of Food Science and Pharmaceutical Engineering, Nanjing Normal University, Nanjing, China

c Medicinal Chemistry Theme, Monash Institute of Pharmaceutical Sciences, Monash University, Parkville, Victoria 3052, Australia
E-mail: huangfei0208@yeah.net, jonathan.baell@monash.edu

Abstract

The construction of intermolecular C–C, C–O, C–S and C–N bonds between diazo compounds and acyclic and cyclic 1,3-dicarbonyl compounds, thiophenol and alkynes was developed by using TFMSA@SBA-15, thus providing a metal-free and eco-friendly platform for forging those chemical bonds.

Graphical abstract: Metal-free C–C, C–O, C–S and C–N bond formation enabled by SBA-15 supported TFMSA

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Article information

DOI
https://doi.org/10.1039/C9CC08389H
Article type
Communication
Submitted
26 Oct 2019
Accepted
16 Dec 2019
First published
17 Dec 2019

Chem. Commun., 2020,56, 1243-1246

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Metal-free C–C, C–O, C–S and C–N bond formation enabled by SBA-15 supported TFMSA

X. Yi, J. Feng, F. Huang and J. B. Baell, Chem. Commun., 2020, 56, 1243 DOI: 10.1039/C9CC08389H

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