Issue 32, 2026, Issue in Progress

A mechanically compliant MnO2–MXene–GelMA cardiac patch for modulating the post-infarction microelectrical environment and alleviating oxidative stress

Abstract

Conventional cardiac patches are limited by mechanical mismatch, disrupted electrical conduction, and excessive oxidative stress arising from the ischemic microenvironment after myocardial infarction, collectively impairing cardiac repair. Here, we develop a mechanically compliant MnO2–MXene–GelMA (MMG) cardiac patch designed to regulate the post-infarction microelectrical environment while alleviating oxidative stress. MnO2-decorated MXene nanosheets were incorporated into a photo-crosslinkable GelMA matrix to generate MMG hydrogels with tunable mechanical and electrical properties. The MMG system operated within a cardiac-matching modulus window and maintained stable electrical functionality under cyclic deformation and bending. In vitro, MMG reduced intracellular reactive oxygen species in cardiomyocytes under H2O2-induced and oxygen–glucose deprivation conditions. Moreover, MMG supported endothelial cell migration and facilitated Connexin 43-mediated intercellular coupling. This modular strategy integrates structural programmability with functional performance, establishing a multifunctional cardiac patch platform that combines mechanical compliance, microelectrical modulation, and oxidative stress attenuation, and offering a promising direction for minimally invasive cardiac repair.

Graphical abstract: A mechanically compliant MnO2–MXene–GelMA cardiac patch for modulating the post-infarction microelectrical environment and alleviating oxidative stress

Supplementary files

Article information

Article type
Paper
Submitted
16 Mar 2026
Accepted
12 May 2026
First published
01 Jun 2026
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2026,16, 29350-29360

A mechanically compliant MnO2–MXene–GelMA cardiac patch for modulating the post-infarction microelectrical environment and alleviating oxidative stress

M. Han, H. Jin, J. Zhang, C. Zhang, W. Yang, D. Sun and W. Huang, RSC Adv., 2026, 16, 29350 DOI: 10.1039/D6RA02208A

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