Issue 19, 2024

A facile solution processible self-rectifying and sub-1 V operating memristor via oxygen vacancy gradient within a TiO2 single layer

Abstract

Memristors are becoming increasingly recognized as candidates for neuromorphic devices due to their low power consumption, non-volatile memory, and synaptic properties and the ease of parallel computing through crossbar arrays. However, sneak current is a critical obstacle in crossbar arrays, and much research is being conducted to suppress the sneak current through self-rectifying characteristics. Here, we present a highly straightforward method for fabricating an active layer of a self-rectifying memristor through a single spin coating process, capitalizing on the attributes of spin coating, which initiates the reaction from the upper portion of the solution. We fabricated a self-rectifying memristor using an Ag/TiO2/TiOx/ITO structure through a vacuum-free solution process with low cost. During the spin-coating process, the reaction between titanium isopropoxide (TTIP) and ambient moisture formed TiO2 with an oxygen vacancy gradient. We confirmed the natural oxygen vacancy gradient using X-ray photoelectron spectroscopy (XPS) depth profiling and elucidated the resistance switching and self-rectifying mechanisms of the memristor based on the energy band structure. The memristors exhibited resistance switching and self-rectifying characteristics, which were essential characteristics for preventing sneak currents in a 3 × 3 crossbar array structure.

Graphical abstract: A facile solution processible self-rectifying and sub-1 V operating memristor via oxygen vacancy gradient within a TiO2 single layer

Supplementary files

Article information

Article type
Paper
Submitted
16 Jan 2024
Accepted
16 Apr 2024
First published
16 Apr 2024
This article is Open Access
Creative Commons BY-NC license

J. Mater. Chem. C, 2024,12, 6881-6892

A facile solution processible self-rectifying and sub-1 V operating memristor via oxygen vacancy gradient within a TiO2 single layer

M. H. Park, J. H. Jeong, W. Kim, S. Park, B. M. Lim, H. Lee and S. J. Kang, J. Mater. Chem. C, 2024, 12, 6881 DOI: 10.1039/D4TC00227J

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