Issue 36, 2024

Three-dimensional thermal network structured GnPs&MWCNTs@PBO/PEEK composites integrating high thermal conductivity and electromagnetic shielding

Abstract

This study presents dual-functional carbon-based poly(ether ether ketone) (PEEK) composites with enhanced thermal conductivity and electromagnetic interference shielding performance. A high-performance poly(p-phenylene benzobisoxazole) (PBO) polymer has been integrated within the composite to improve the thermal diffusion network. The composites comprising graphite nanosheets (GnPs) and multi-walled carbon nanotubes (MWCNTs)@PBO/PEEK exhibit outstanding in-plane thermal conductivity (TC) of 22.17 W m−1 K−1 at a filler loading of 19.31 vol%, representing a significant increase of 9540% and 1146% compared to pure PEEK and PBO@PEEK. Furthermore, the composites demonstrated exceptionally high electromagnetic interference shielding effectiveness (EMI SE) of 128.4 dB, with a total shielding efficiency of 99.99999999993%, which meets the aerospace shielding standard. The significant enhancement in TC and EMI is attributed to the π–π conjugation effect between carbon-based fillers and the main chains of PBO. According to the Agari and Foygel models, the addition of PBO establishes a robust and thermally conductive network, effectively reducing the heat flow barrier and facilitating the current tunneling effect. This study presents a straightforward and viable approach for developing thermally conductive and electromagnetic shielding bifunctional polymeric thermal management materials.

Graphical abstract: Three-dimensional thermal network structured GnPs&MWCNTs@PBO/PEEK composites integrating high thermal conductivity and electromagnetic shielding

Supplementary files

Article information

Article type
Paper
Submitted
30 Apr 2024
Accepted
02 Aug 2024
First published
12 Aug 2024

J. Mater. Chem. A, 2024,12, 24633-24646

Three-dimensional thermal network structured GnPs&MWCNTs@PBO/PEEK composites integrating high thermal conductivity and electromagnetic shielding

Y. Bai, H. Qian, X. Cao, F. Wen, Y. He, J. Ma, L. Cheng, Y. Wang, H. Tan, Y. Gu, P. Lian, R. Chen and J. Mu, J. Mater. Chem. A, 2024, 12, 24633 DOI: 10.1039/D4TA03002H

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