Issue 27, 2024

Dynamic compaction of cohesive granular materials: scaling behavior and bonding structures

Abstract

The compaction of cohesive granular materials is a common operation in powder-based manufacture of many products. However, the influence of particle-scale parameters such as bond strength on the packing structure and the general scaling of the compaction process are still poorly understood. We use particle dynamics simulations to analyze jammed configurations obtained by dynamic compaction of sticky particles under a fixed compressive pressure for a broad range of system parameter values. We show that relative porosity, representing the relative importance of porosity with respect to its minimum and maximum values, is a unique function of a modified cohesion number that combines adhesion force, confining pressure, and particle size, as well as contact stiffness, which is often assumed to be ineffective but is shown here to play an essential role in compaction. An asymmetric sigmoidal form based on two power laws provides an excellent fit to the data. The statistical properties of the bond network reveal self-balanced force structures and an exponential fall-off of the number of both tensile and compressive forces. Remarkably, the properties of the bond network depend on the cohesion number rather than the modified cohesion number, implying that similar bond network characteristics are compatible with a broad range of porosities mainly due to the effect of contact stiffness. We also discuss the origins of data points escaping the general scaling of porosity and show that they reflect either finite system size or rigid confining walls.

Graphical abstract: Dynamic compaction of cohesive granular materials: scaling behavior and bonding structures

Supplementary files

Article information

Article type
Paper
Submitted
24 Aug 2023
Accepted
28 Mar 2024
First published
28 Mar 2024
This article is Open Access
Creative Commons BY-NC license

Soft Matter, 2024,20, 5296-5313

Dynamic compaction of cohesive granular materials: scaling behavior and bonding structures

M. Sonzogni, J. Vanson, K. Ioannidou, Y. Reynier, S. Martinet and F. Radjai, Soft Matter, 2024, 20, 5296 DOI: 10.1039/D3SM01116J

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